Organic–inorganic hybrid materials do not represent only a creative alternative to design new materials and compounds for academic research, but their improved or unusual features allow the development of innovative industrial applications. Nowadays, most of the hybrid materials that have already entered the market are synthesised and processed by using conventional soft chemistry based routes developed in the eighties. These processes are based on: a) the copolymerisation of functional organosilanes, macromonomers, and metal alkoxides, b) the encapsulation of organic components within sol–gel derived silica or metallic oxides, c) the organic functionalisation of nanofillers, nanoclays or other compounds with lamellar structures, etc. The chemical strategies (self-assembly, nanobuilding block approaches, hybrid MOF (Metal Organic Frameworks), integrative synthesis, coupled processes, bio-inspired strategies, etc.) offered nowadays by academic research allow, through an intelligent tuned coding, the development of a new vectorial chemistry, able to direct the assembling of a large variety of structurally well defined nano-objects into complex hybrid architectures hierarchically organised in terms of structure and functions. Looking to the future, there is no doubt that these new generations of hybrid materials, born from the very fruitful activities in this research field, will open a land of promising applications in many areas: optics, electronics, ionics, mechanics, energy, environment, biology, medicine for example as membranes and separation devices, functional smart coatings, fuel and solar cells, catalysts, sensors, etc.

Applications of hybrid organic–inorganic nanocomposites

Investigations of two-photon polymerization of inorganic-organic hybrid materials initiated by femtosecond Ti:sapphire laser pulses are performed. First applications of this technique for the fabrication of three-dimensional microstructures and photonic crystals in inorganic-organic hybrid polymers with a structure size down to 200 nm and a periodicity of 450 nm are discussed.

/pdf/femtosecond-laser-induced-two-photon-polymerization-of-4r9ehba6q8.pdf

Femtosecond laser-induced two-photon polymerization of inorganic-organic hybrid materials for applications in photonics.

Inorganic–organic hybrid materials for application in optical devices

Hybrid inorganic-organic polymers based on organically modified heteropolysiloxanes have found widespread attention and application as materials with adjustable properties using tailor-made precursors. The chemical structures of monomers and their modified sol-gel processing method are described. An overview is given for the control of various properties (mechanical, electrical, optical) of the materials on a molecular scale. Successful material developments and industrial applications are described.

Synthesis, properties and applications of inorganic-organic copolymers (ORMOCER®s)

Functionalized coating materials based on inorganic-organic polymers

Hybrid inorganic-organic polymers (ORMOCER®s) have been developed and tested for evaluation in optical and electrical interconnection technology. The photopatternable materials with negative resist behaviour are composed of inorganic oxidic structures cross-linked or substituted by organic groups. They are prepared from organosilane precursors by sol-gel-processing in combination with organic crosslinking of polymerizable organic functions. As a result of these functionalities the properties of the ORMOCER®s can be adjusted to particular applications. Systematic variation of composition combined with adaptation to micro system technology allows great flexibility in processing. The main features of these materials are: Combined use as dielectric and passivation layers in electrical systems and devices as well as core and cladding for optical applications enables e/o applications with high integration levels. Postbaking at moderate temperatures (120°C – 170°C) enables processing on low-cost substra...

ORMOCER®S – Inorganic-Organic Hybrid Materials for e/o-Interconnection-Technology

Hybrid inorganic-organic polymers (ORMOCERs) have been developed and tested in an ongoing EU-program (BE 7250 DONDOMCM) for evaluation in MCM applications. The photopatternable materials with negative resist behavior are composed of inorganic oxidic structures cross-linked or substituted by organic groups. They are prepared from organosilane precursors by sol-gel-processing in combination with organic crosslinking of polymerizable organic functions. As a result of these functionalities the properties of the ORMOCERs can be adjusted to particular applications. Systematic variation of composition combined with adaptation to micro system technology allows great flexibility in processing. Some features of these materials are: postbaking at moderate temperatures (120/spl deg/C-180/spl deg/C) enables processing on substrates such as FR-4 and BT. Combined use as dielectric and passivation layers in electrical systems and devices as well as core and cladding for optical applications enables e/o applications with high integration levels. Easily adaptable to thin film technology: spin-on with planarization >90% and via diameters down to 20 /spl mu/m have been achieved.

ORMOCERs/sup TM/-new photo-patternable dielectric and optical materials for MCM-packaging

In the last year, MCMs have changed the view of electronic manufacturing due to novel functions. MCMs offer an attractive alternative to packaged components, as they increase packaging density and improve the reliability of electronic functions in a harsh environment. MCMs can increase manufacturability and, due to the use of low cost materials, they can save space, volume and weight in order to decrease overall costs. This paper shows the results of reliability tests carried out on test vehicles to optimise the manufacturing process. As base substrate materials, high T/sub g/ FR-4 and BT-epoxy was used to process the VLSIs on the MCM-L. The assembly was done using chip-on-board technology with chip-and-wire and flip-chip technology, showing the high performance of both methods. The paper presents current improvements to the substrate manufacturing process and fine pitch flip-chip bonding process. Different encapsulation technologies (glob top, underfilling, metal lid) are used to optimise reliability and media resistance for automotive requirements of harsh environment conditions for under-the-hood applications. Finally, the best technologies and processes, in terms of reliability performance and cost, have been selected to build the electrical demonstrator: an electronic control unit (ECU), which is briefly described.

Results of assembly and reliability investigation of an MCM-L for an automotive application: electronic control unit

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ORMOCER®S – Inorganic-Organic Hybrid Materials for e/o-Interconnection-Technology

ORMOCERs/sup TM/-new photo-patternable dielectric and optical materials for MCM-packaging

Results of assembly and reliability investigation of an MCM-L for an automotive application: electronic control unit