The invention relates to a Variable Speed Drive (1) for subsea installations (20), subsea vessels or subsea vehicles, as well as to a corresponding subsea installation (20), subsea vessel or subsea vehicle, comprising an alternating current /alternating current converter (2) having a current - controlled capacitor- less direct current link (7).

Variable speed drive for subsea applications

A power wiring structure realizes low inductance and is
applicable to a semiconductor device. The power wiring structure employs two switching elements
that are connected in series and are complementarily turned on
and off. Ends of the switching elements are connected to power
lines extending from a power source. A node between the switching
elements is connected to an output line U that is connected to
load. The power lines are a high-potential power line P and a
low-potential power line N. The lines P, N, and U are each a
wide electrode with the width thereof greater than the thickness
thereof. The electrodes are layered one upon another in a
thickness direction in order of P, U, and N to form a three-layer
wide electrode structure. A current of the same value as and oppositely oriented
from a current flowing through the output line U flows through
the output line P or N, to cancel magnetic fields generated by
the currents, thereby effectively reducing wiring inductance.

Power wiring structure and semiconductor device

A high power inverter pole (21) for a voltage sourced inverter suitable for providing compensation in electric power transmission and distribution systems, has a positive switching valve (23) and a negative switching valve (25) connected between closely spaced dc-sourced terminals (13, 15), respectively, and a common ac terminal (17) to form a current loop (41) with minimum loop area thereby reducing stray loop inductance and limiting the overshoot voltage on serially connected electronic switches (27) which make up the valves (23, 25). In a preferred embodiment, the valves (23, 25) are mounted on opposite sides of the web (65W) of an insulative I-beam (65). The electronic switches (27) are incorporated in modular switching units (33) connected in series by C-channel connecting conductors (37) having flanges (37) bolted to the I-beam flanges (65F). The modular units (33) include broad, flat conductors (67, 69) bolted through end flanges (67F, 69F) to the C-channel connecting conductors (37).

High power inverter pole employing series connected devices configured for reduced stray loop inductance

A converter circuit arrangement is specified. An extremely compact structure is achieved by virtue of the fact that the current rise limiting inductor concentrically surrounds the second stack containing diode and resistor. In particular, the inductor can be designed as a wire helix surrounding the stack. A very compact structure of the converter is produced, furthermore, by virtue of the fact that the first and second stacks, that is to say the stack of the switches and the stack of the snubber, belong to a common clamping lattice.

Converter circuit arrangement

Converter modules have a busbar system for a plurality of power semiconductor switches or, preferably, IGBT power semiconductor modules (IPMs). The power semiconductor switches are arranged in pairs, facing one another or facing away from one another, close together and parallel. In accordance with exemplary embodiments, alternating current is fed in one or two phases via bridge circuits composed of two or four power semiconductor switches.

Converter modules having a busbar system for power semiconductor switches

A converter circuit arrangement is specified which is constructed to have a particularly low inductance. This is achieved by the circuit area of the commutation circuit being kept as small as possible. A circuit area which is as small as possible is achieved by the branch modules and switch modules of a phase module being arranged either in a U-shape or in a meandering shape. The branch modules can be arranged either parallel to or at right angles to a main direction, between the positive and negative connections and the load connection. In addition, it is advantageous if the power semiconductor switches and the reverse-connected parallel diodes and freewheeling diodes are arranged in separate stacks which are held together by means of a clamping-in device.

Converter arrangement having a low-inductance commutation circuit

A converter circuit arrangement is specified, which is constructed with a particularly low inductance. This is achieved by the fact that the surface area of the commutation circuit is kept as small as possible. A circuit surface area which is as small as possible is achieved by arranging the branch modules or switch modules of a phase module either in the shape of a U or in a meandering fashion. The branch modules can be arranged either parallel or perpendicularly with respect to a main direction between the positive or negative connection and the load connection. It is also advantageous if the power semiconductor switches and the reverse-connected parallel diodes and freewheeling diodes are arranged in separate stacks held together by means of a clamping device.

Converter device with low-inductive commutation loop

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Converter arrangement having a low-inductance commutation circuit

Converter device with low-inductive commutation loop