The invention relates to an etching solution and a method for manufacturing a packaging substrate through the etching solution. The etching solution is used for the corrosion thinning process of a copper plated layer in the packaging substrate and comprises hydrogen peroxide, sulfuric acid and additive. The additive comprises at least one kind of a cationic surface active agent and a ligand compound of copper ions. The invention further relates to the packaging substrate prepared through the etching solution. By means of the etching solution, the number of pits and pin holes in the surface canbe reduced after the corrosion thinning process is carried out on the copper plated layer of the packaging substrate, and therefore the product yield of the packaging substrate is improved.

Etching solution and method for manufacturing packaging substrate through etching solution

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Etching solution and method for manufacturing packaging substrate through etching solution