An exhaust air removal system and method for use with a rack or enclosure containing equipment is provided. The system and method are configured for removal of exhaust air vented from equipment during operation to thereby remove heat from the equipment. In one aspect, the system includes a fan unit preferably configured to serve as a back door of an equipment rack or enclosure and configured to provide access to an interior of the rack or enclosure. The fan unit provides multiple fans coupled to internal exhaust ducts that are arranged to draw and to remove exhaust air vented from rack-mounted equipment. The fan unit is further configured to vent exhaust air to an area external to a rack or enclosure, such as an external exhaust duct or plenum. Removal of hot and warm exhaust air vented from rack-mounted equipment enables the equipment to operate effectively, drawing sufficient amounts of cooling air to meet its cooling requirements. The fan unit is constructed for portability and for easy attachment to and removal from a rack or enclosure, providing flexibility in handling equipment exhaust needs.

Exhaust air removal system

A data center includes an electronic equipment rack having a front face and a back face and a cooling unit positioned adjacent to the rack, the cooling unit having a front face and a back face, the cooling unit being configured to exhaust cooled air from the front face of the cooling unit to cool the rack. The cooling unit is configured to release the cooled air along a substantial portion of a height of the front face of the rack.

Rack height cooling

An air removal unit configured for removing exhaust air from an equipment rack or enclosure includes multiple fans to achieve a high airflow capacity while defining a compact and portable structure. The unit removably installs along an exhaust side of an equipment rack or enclosure to provide capabilities for managing the thermal output of equipment, such as servers, CPUs, communications, internetworking and other types of equipment. The unit includes one or more upper fan modules and one or more lower fan modules positioned below the upper fan modules. The upper and the lower fan modules are arranged in a stacked configuration along the depth of the unit with the lower fan modules positioned in an offset orientation relative to the upper fan modules. The stacked configuration and the offset orientation of the fan modules help to incorporate multiple fans with the unit while maintaining the compact and portable design. The unit is further configured to serve as a door of an equipment rack or enclosure to thereby provide access to the unit and the rack or enclosure during operation. The unit can be incorporated with a ventilation system or a cooling air system associated with an equipment room or data center.

Air removal unit

At least one version is directed to a mobile data center that includes a trailer having a length greater than a width and having an interior, the trailer being configured to be transported in a direction generally parallel to the length, and a plurality of equipment enclosures installed in the interior of the trailer to form a row, with the row being parallel to the length of the trailer, wherein the row is positioned in the interior such that a first aisle is on a front side of the row and a second aisle is on a back side of the row. The mobile data center also includes at least one cooling unit constructed and arranged to draw warm air from the second aisle and provide cool air to the first aisle to cool equipment contained in the plurality of equipment enclosures.

Mobile data center

A system for cooling gas heated by passing the gas over heat-producing equipment to cool the equipment comprises a heat exchanger including a first heat transfer mechanism configured to transfer heat from the heated gas to a first coolant, and a first condensing module connected for fluid communication with the heat exchanger and including second and third heat transfer mechanisms, the first condensing module being configured to transfer heat through the second and third heat transfer mechanisms from the first coolant to second and third coolants in the second and third heat transfer mechanisms, respectively.

IT equipment cooling

A chassis-rack system mounts two 19″ RETMA rack chassis back-to-back in the same vertical 1U-space. Each has an independent cooling system that draws-in cold air from respective front and rear panels. Such panels are provided with a series of slots that are blocked-off in different patterns according to empirical cooling tests, done with particular complements of internal constituent components. Such intakes are typically at a left side of the panel, and air drawn in is forced to flow to the back and around to the right by two floor-to-ceiling partition walls. Such walls can define bay for a CD-ROM, floppy disk, or PCI-bus. The drawn-in air is critically sequenced first over processors, memory, then hard disk drives, and finally over a power supply. The power supply is near the front on the right, typically, and-two 33-CFM fans exhaust the heated air out the respective panels. The chassis enclosures each have a lid with a special flat ductwork that conducts cold outside air directly to at least one CPU fan and heatsink.

Flow-through cooling in-the-round system

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Flow-through cooling in-the-round system