A method and apparatus for injecting a fluid into a plasma stream with a uniform distribution and with reduced likelihood of clogging over prolonged use is provided. An injector includes a first channel portion for restricting a flow of the fluid and having a shape such that inner walls of the first channel portion are parallel to a first axis. The injector also includes a second channel portion in fluid communication with the first channel portion. The second channel portion includes a recessed portion such that inner walls of the second channel portion diverge from the first axis at a predetermined angle. The second channel portion reduces a buildup of a clogging layer on the inner walls of the second channel portion over a period of use. In addition, the injector can further include a tip portion that protrudes into the plasma. The injector can be integrated into or interchangeable within an injector system that can be designed for operation within a plasma deposition apparatus.

Fluid injector for and method of prolonged delivery and distribution of reagents into plasma

Chemical vapor deposition is performed using a plurality of expanding thermal plasma generating means to produce a coating on a substrate, such as a thermoplastic and especially a polycarbonate substrate. The substrate is preferably moved past the generating means. Included are methods which coat both sides of the substrate or which employ multiple sets of generating means, either in a single deposition chamber or in a plurality of chambers for deposition of successive coatings. The substrate surfaces spaced from the axes of the generating means are preferably heated to promote coating uniformity.

Apparatus and method for large area chemical vapor deposition using multiple expanding thermal plasma generators

A deposition process comprises determining a target process condition within a chamber of an expanding thermal plasma generator (102, 202) for plasma enhanced chemical vapor deposition of a coating on a substrate; the generator (102, 202) comprising a cathode (106, 206), replaceable cascade plate and generators (108, 208) with concentric orifice; and replacing the cascade plate with another plate having a configured orifice to effect the identified target process condition; and generating a plasma at the target process condition by providing a plasma gas to the plasma generator (102, 202) and ionizing the plasma gas in an arc between cathode (106, 206) and generators (108, 208) within the generator (102, 202) and expanding the gas as a plasma onto a substrate in a deposition chamber. A deposition apparatus (100) for generating a controllable plasma; comprises a deposition chamber; adapted to be maintained at subatmospheric pressure; an article support within the deposition chamber; an expanding thermal plasma generator (102, 202) comprising a cathode (106, 206), a single cascade plate and an generators (108, 208) and a communicating orifice through the cascade plate, the orifice having a length of lmm to less than 20mm.

Replaceable plate expanded thermal plasma apparatus and method

The invention is embodied in a plasma flow device or reactor having a housing that contains conductive electrodes with openings to allow gas to flow through or around them, where one or more of the electrodes are powered by an RF source and one or more are grounded, and a substrate or work piece is placed in the gas flow downstream of the electrodes, such that said substrate or work piece is substantially uniformly contacted across a large surface area with the reactive gases emanating therefrom The invention is also embodied in a plasma flow device or reactor having a housing that contains conductive electrodes with openings to allow gas to flow through or around them, where one or more of the electrodes are powered by an RF source and one or more are grounded, and one of the grounded electrodes contains a means of mixing in other chemical precursors to combine with the plasma stream, and a substrate or work piece placed in the gas flow downstream of the electrodes, such that said substrate or work piece is contacted by the reactive gases emanating therefrom. In one embodiment, the plasma flow device removes organic materials from a substrate or work piece, and is a stripping or cleaning device. In another embodiment, the plasma flow device kills biological microorganisms on a substrate or work piece, and is a sterilization device. In another embodiment, the plasma flow device activates the surface of a substrate or work piece, and is a surface activation device. In another embodiment, the plasma flow device etches materials from a substrate or work piece, and is a plasma etcher. In another embodiment, the plasma flow device deposits thin films onto a substrate or work piece, and is a plasma-enhanced chemical vapor deposition device or reactor.

Method of processing a substrate

A method and apparatus for depositing a uniform coating on a large area, planar surface using an array of multiple plasma sources and a common reactant gas injector. The apparatus includes at least one array of a plurality of plasma sources, wherein each of the plurality of plasma sources includes a cathode, an anode, and an inlet for a non-reactive plasma source gas disposed in a plasma chamber, and a common reactant gas injector disposed in a deposition chamber that contains the substrate. The common reactant gas injector provides a uniform flow of at least one reactant gas to each of the multiple plasmas generated the multiple plasma sources through a single delivery system. The at least one reactant gas reacts with the plurality of plasmas to form a uniform coating on a substrate.

Apparatus and method for depositing large area coatings on planar surfaces

A nozzle-injector was designed and fabricated for plasma deposition of thin-film coatings using a wall-stabilized arc torch as the plasma generator. The design of the nozzle-injector controls the injection, ionization, and reaction of the reagents, and these functions, in turn, determine the coating deposition rate, coating area, coating composition, and coating quality.

Nozzle-injector for arc plasma deposition apparatus

PROBLEM TO BE SOLVED: To improve the coating area of protective coating film and the coating forming rate by a plasma vapor growth method using a wall-stabilized arc torch as a plasma generator SOLUTION: This injector contains an arc plasma generator 2 having a plasma gas introducing port 6, one or more anodes, a cathode, a nozzle injector 8 fitted to the cathode and having a divergent channel stretched from the cathode, an oxygen injector for injecting oxygen into plasma in the vicinity of the cathode and one or more reagent injectors 14 for injecting a reactive gas into plasma in the case the plasma spreads into the divergent channel

Nozzle injector for arc plasma film forming device

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Nozzle-injector for arc plasma deposition apparatus

Nozzle injector for arc plasma film forming device