Zero insertion force

Abstract: A connector is disclosed for electrically interconnecting the conductive pins of an electrical component to a printed circuit board. The connector includes a plurality of conductive contacts mounted within a non-conductive housing. Each contact includes first and second upwardly extending arms spaced apart a distance sufficient to permit a conductive pin of the electical component to be freely mounted therebetween. The first arm of the contact is generally V-shaped in configuration and defines an intermediate projecting section, extending away from the second arm. A cammed closure is provided for exerting a force on the projecting section of the first arm in a direction towards the second arm. By this arrangement, after a conductive pin is mounted between the arms of the contact, the actuation of the cam causes the first arm of the contact to be moved into electrical contact with the conductive pin of the component. Further movement of the cam causes the contact point of the first arm to travel upwardly, along the conductive pin, wiping oxidation residue from the pin. In the preferred embodiment, the cam is movable to a locked position wherein the contact point of the first arm is located at a position on the conductive pin which has been wiped clean during the locking action.

Abstract: A connector for microelectronic elements includes a sheetlike dielectric layer having a plurality of through holes desirably arranged in a rectangular grid pattern. Each hole is provided on one major surface with a generally laminar contact having at least one projection extending inwardly over the through hole. Contact pads on the second major surface of the dielectric layer overlie the through holes to provide a blind end which is electrically connected to the other contact by means of a metal layer lining the through hole. The resulting connectors provide low or zero insertion force sockets for mounting microelectronic elements having bump leads thereto. The bump leads may be received within corresponding sockets without engagement with the contact or projection, and then, by movement in a lateral direction, engaging the contact or projection to provide electrical connection to the socket. The dielectric layer may be formed from flexible and/or compressible materials, such as polyimide, whereby deflection of the connector will cause the top contacts surrounding the through hole to move radially inward into engagement with the bump leads on the microelectronic element.

Abstract: An electronic package for an integrated circuit (IC). The package has a plurality of first pins extending from a laminated plastic/printed circuit board substrate. The pins are coupled to the integrated circuit and provide a means for mounting the package to an external printed circuit board. The package also has an internal circuit board that is coupled to both the substrate and the IC by a plurality of second pins. Mounted to the circuit board are passive and/or active electrical elements that are connected to the integrated circuit through the second pins. Some of the second pins may extend entirely through the substrate to directly couple the internal circuit board and electrical elements to the external printed circuit board. To improve the thermal impedance of the package, the integrated circuit is mounted to a heat slug which can be attached to a heat sink. The heat sink may also provide a substrate for the internal circuit board.

Abstract: An IC chip testing apparatus provided with an IC socket to which an IC chip is brought into electrical contact, a printed circuit board with one terminal which is electrically connected to a terminal of a test head and with another terminal which is electrically connected to a terminal of the IC socket, and a heating element provided at the printed circuit board. The IC chip testing apparatus may be provided with a socket to which an IC chip to be tested is detachably mounted; a socket guide; a chamber opening to which the socket guide is attached so that an IC chip mounting opening of the socket faces inside a chamber which is maintained at a predetermined state less than ordinary temperature; a printed circuit board; and a heating board which is provided around the chamber opening.