Topic
Wire wrap
About: Wire wrap is a research topic. Over the lifetime, 209 publications have been published within this topic receiving 1832 citations. The topic is also known as: wrapping wire.
Papers published on a yearly basis
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Papers
TL;DR: In this paper, a semi-empirical model was developed that can accurately predict pressure losses in a hexagonal array of fuel pins utilizing a wire-wrap spacer system, which is able to predict pressure drop to within ± 14 % over a wide range of geometries in the turbulent flow regime.
190 citations
Patent•
2 Dec 1982TL;DR: In this paper, a hybrid fiber optic connector is presented whereby both electrical and fiber optic cables are connected to a printed circuit card, and the connector consists of a female half which contains a plurality of fiber optic contact inserts molded into the connector, and also female electrical connections.
Abstract: A hybrid connector is presented whereby both electrical and fiber optic cables are connected to a printed circuit card. The connector consists of a female half which contains a plurality of fiber optic contact inserts molded into the connector, and also female electrical connections. The male half of the connector is an integral part of a printed circuit card constructed to contain male fiber optical contact inserts in addition to the standard plated electrical male type contact points. Both halves of the connector may be fitted with removable and interchangeable fiber optic contacts, radio frequency contacts, and/or power pins in addition to the standard printed circuit car contacts for wire wrap or solder connections. The printed circuit card hybrid fiber optic connector presented here provides normal card installation and removal of fiber optic interconnects from standard card cages or mother boards without threading or other special engaging mechanisms.
94 citations
TL;DR: In this article, the effect of transverse flow in promoting flow and temperature uniformity in a heat generating fuel pin bundle with helically wound spacer wire has been investigated by solving the three-dimensional conservation equations of mass, momentum and energy, for a wide range of Reynolds number.
80 citations
Patent•
26 Jul 1983TL;DR: In this paper, a low insertion force compliant pin is provided for solderless connection to a printed circuit board in which the pin was provided with an enlarged contact portion, a reduced-diameter shank, and one or more slots through the contact portion and the shank such that when the pin is inserted into a solder plated-through hole in the board, the contact part is compressed on itself, thereby to provide a spring-biased contact to the interior plated wall of the hole.
Abstract: A low insertion force compliant pin is provided for solderless connection to a printed circuit board in which the pin is provided with an enlarged contact portion, a reduced-diameter shank, and one or more slots through the contact portion and the shank such that when the pin is inserted into a solder plated-through hole in the board, the contact portion is compressed on itself, thereby to provide a spring-biased contact to the interior plated wall of the hole in the board. The compliant pin also provides anti-overstress protection by compressing on itself. The compliant pin is adapted for use with a number of different hole sizes, with spring bias tension being controlled by the elasticity of the pin material and the length of the slot or slots and the diameter of the enlarged contact portion. The distal end of the pin is provided with a connector body, a solder lug, a wire wrap pin or other termination device so that the compliant pin forms one part of an electrical interconnection system for connection to the plated-through holes of the board.
69 citations
TL;DR: In this paper, the authors investigated the pressure drop and heat transfer characteristics of wire-wrapped 19-pin rod bundles in a nuclear reactor subassembly of liquid metal cooled fast breeder reactor (LMFBR) through three-dimensional turbulent flow simulations.
65 citations
Related Topics (5)
Performance Metrics
| Year | Papers |
|---|---|
| 2021 | 1 |
| 2020 | 2 |
| 2019 | 2 |
| 2018 | 12 |
| 2017 | 3 |
| 2016 | 7 |