Abstract: A gas turbine vane to improve vane performance by addressing known failure mechanisms. A cooling circuit to the trailing edge of a vane airfoil is fed from the outer diameter platform, which prevents failure due to an oxidized and eroded airfoil trailing edge. The gas turbine includes an outer diameter platform, a hollow airfoil and an inner diameter platform with a plurality of cooling tubes extending radially through the airfoil. The cooling tubes are open at the outer diameter end and closed with covers at the inner diameter end. The inner diameter platform is also cooled and includes a meterplate for a portion of the cooling passageway and includes an undercut to improve thermal deflections of the inner diameter platform.

Abstract: An undercut processing mechanism can facilitate punching-out of undercut portions having various shapes spreading in the circumferential direction on the inside of a molded article. Split cores (61) that form an undercut molding core (60) are supported one by one at the leading end of slide members (50) disposed radially to face the center axis of an undercut portion (P3). Each slide member (50) is housed in a holder (40) so as to be slidable between a molding position where the split cores (61) are mutually disposed in the entire circumferential direction and a demolding position where the split cores (61) are mutually reduced in diameter. The holder (40) is provided with a guide member (46) for guiding each slide member (50) to move simultaneously in the punching-out direction parallel to the center axis of the undercut portion (P3) and in the direction escaping from the undercut portion (P3) toward the center axis of the undercut portion (P3), respectively, along an inclination direction from the molding position toward the demolding position.

Abstract: In casting, molding and forming processes, the surface geometries of the fabricated products are formed/molded by different functional components of tooling. In plastic injection molding, they are molded by core, cavity or side-cores. In die and mold CAD, how to identify the product surfaces formed/molded by the corresponding tool components for a given product CAD model is critical, as it affects the determination of parting directions, parting lines and parting surfaces, the generation of core and cavity blocks, and finally the design of side-cores and their actuating mechanisms. In this paper, the concepts of surface visibility, demoldability, and moldability are first presented and formulated. The surfaces formed/molded by core, cavity and side-cores are then defined based on the plastic injection molding process. The methodology to identifying and classifying them is further developed. By employing the proposed notions of the demoldability map of surfaces and undercut features, the most preferred demolding direction, the grouping of undercut features, and how to conduct the side-core design is articulated succinctly, and the detailed procedures and processes are presented. Through an industrial case study, the developed methodology for side-core design is systematically presented and the feasibility of the developed approaches is verified.

Abstract: The invention relates to a mounting arrangement for optical devices having a mounting plate forming an undercut guide for receiving a clamping plate, the mounting plate comprising a side bar in which an undercut profile groove is formed, and having a strip located opposite the bar movably connected to the mounting plate via a clamping mechanism and a second undercut profile groove forming the undercut guide together with the first undercut profile groove, the strip being able to be tightened against the mounting plate by the clamping mechanism to fix the clamping plate, whereby the spacing distance between the undercut profile grooves is reduced. A second undercut guide is formed by additional undercut profile grooves in the same side bar of the mounting plate and the same strip, wherein the guides are both disposed on one side of the plane (X) spanned by the mounting plate.

Abstract: Newly developed photosensitive etch protection materials have key advantages over standard photoresists typically used in today's MEMS applications. Using these new materials eliminates the need for silicon nitride (SiN) masks deposited via CVD processes, which require significant investments in processing equipment, utilize extreme processing conditions and contribute to an overall decrease in throughput. This new technology will enhance throughput by reducing the number of process steps and simplify the process flow with minimal impact on overall undercut performance. The polymeric coating serves as a SiN mask replacement for etching silicon substrates in alkaline anisotropic etchants such as KOH and TMAH. The undercut performance observed is larger than that of SiN when etched in KOH, but when alternative alkaline etchants such as TMAH are used, the undercut is identical (1–2% with respect to etch depth). Various factors, such as primer bake, topcoat final cure temperature, etchant concentration and substrate surface conditions, have all been shown to affect undercut results. An additional advantage of this new technology is that it can be easily reworked/removed by solvents, plasma etch, Nano-Strip®, Piranha and RCA cleaning solutions depending on where the removal takes place in the process.

Abstract: A semiconductor device includes a dielectric layer in which an upper portion is densified. An interconnection is disposed in the dielectric layer. The densified portion reduces undercut during subsequent processing, improving reliability of the interconnection.

Abstract: A semiconductor memory device and a method for its fabrication are provided. In accordance with one embodiment of the invention the method comprises the steps of forming a gate insulator and a gate electrode overlying a semiconductor substrate. The gate insulator is etched to form an undercut opening beneath an edge of the gate electrode and the undercut opening is filled with a layered structure comprising a charge trapping layer sandwiched between layers of oxide and nitride. A region of the semiconductor substrate is impurity doped to form a bit line aligned with the gate electrode, and a conductive layer is deposited and patterned to form a word line coupled to the gate electrode.

Abstract: The present invention in one embodiment provides a method of forming a memory device including providing a first dielectric layer including at least one via containing a metal stud; providing a second dielectric layer atop the first dielectric layer; recessing the metal stud to expose a sidewall of the via; etching the sidewall of the via in the first dielectric layer with a isotropic etch step to produce an undercut region extending beneath a portion of the second dielectric layer; forming a conformal insulating layer on at least the portion of the second dielectric layer overlying the undercut region to provide a keyhole; etching the conformal insulating layer with an anisotropic etch to provide a collar that exposes the metal stud; forming a barrier metal within the collar in contact with the metal stud; and forming a phase change material in contact with the barrier metal.

Abstract: An vision inspection sensor system for the automation of laser welding processes in heavy industries is presented. The system consists of PC based vision camera and stripe type laser diode. For image de-noising, a new surface inspection method of Tailor-welded blanks including in: median filtering, bi-level thresholding, opening and closing, mid-line of the laser stripe extraction, has been developed. After extracting the middle line of the laser stripe, the algorithms of calculating bead width, mismatch, weld slope, convexity, concavity, overthickness and undercut are proposed. Finally, A series of experiments show that the proposed method in this paper is effective.

Abstract: In this paper the process integration challenges for a 3-D die to wafer stacking technology are investigated. A process for etching through the full multi layer field dielectric of a completed wafer is achieved. Ionized PVD is used to form a barrier and liner, and is shown to allow full metal coverage of scallops and undercut resulting from the combined deep silicon via etch and oxide liner deposition processes. Void free copper plating of the completed via is demonstrated to verify successful integration of all stages necessary for through silicon via formation.

Abstract: An apparatus and process for forming compacted powder metal parts having a non-axial undercut feature. An undercut die is located between the upper and the lower dies and contains a plurality of shaped punches aligned in a circular pattern. Each of the shaped punches contains a working edge. The working edges converge to form an inner circumference which creates the undercut feature. The edges of the shaped punches slide with respect to each other to change the size of the inner circumference from a maximum diameter position to a minimum diameter position. During compaction, the rotation of the shaped punches alters the inner circumference to its minimum diameter position thereby forming an undercut in the final compacted part. The retraction of the shaped punches to its maximum diameter position enables the unimpeded removal of the part from the tool set.

Abstract: A circuit board and method of manufacturing a circuit board The circuit board includes a substrate, a conductor layer formed on the substrate, and an insulation layer formed on the substrate and the conductor layer, the insulating layer having an opening with an undercut therein, the opening reaching the conductor layer A metal layer is formed in the opening of the insulation layer and connected to the conductor layer, a solder layer formed in the opening of the insulation layer and outside of the opening; and an alloy layer formed in a boundary region between the metal layer and the solder layer in the opening The alloy layer includes a metal of the metal layer and a composition of the solder layer, the alloy layer being more fragile than the metal layer and being formed in a position misaligned from an edge of the undercut of the opening formed on the insulation layer

Abstract: Laser welding is a promising joining method for magnesium alloys. The process reliability of 2-mm ZE41A-T5 butt joints welded by a 4 kW Nd:YAG laser was investigated from weld geometries, defects and mechanical properties using Weibull statistical distribution. Smooth, geometrically regular and macroscopically defect-free sound joints were obtained. However, sag, undercut, surface misalignment, and some variations in weld width and fusion zone area were also observed. The results indicated that tensile strength and elongation at fracture can be more accurately described by Weibull distribution. The modulus values of 31.98 and 22.52 were obtained for tensile strength in the as-welded and the aged conditions, respectively, indicating that tensile strength becomes more scattered after artificial aging. The aging treatment does not significantly affect mechanical properties, although it can provide stress relief. After laser welding, there is some degradation in tensile properties, especially elongation at fracture. [doi:10.2320/matertrans.MRA2007622]

Abstract: A method for manufacturing an LCD(Liquid Crystal Display) is provided to prevent transparent electrodes from being undercut due to double etching by forming dual film-structured pixel electrode, which contains a transparent electrode and a reflective electrode, through a single photo mask and, at the same time, forming a photoresist film at the side of a conductive layer. A transparent conductive film(190p) is laid on a substrate(110). A reflective conductive film(190q) is laid on the transparent conductive film. The first photoresist film, of which the thickness differs according to locations, is formed on the reflective conductive film. Using the first photoresist film as an etching mask, the reflective conductive film and the transparent conductive film are removed through etching. The second photoresist film(400a) is formed as the first photoresist film reflows after being baked. Using the second photoresist film as an etching mask, the reflective conductive film is etched.

Abstract: For the first time, selective undercut etching and periodically loaded electrodes are combined to improve impedance and velocity matching for traveling-wave electroabsorption modulators. These devices are fabricated in a platform compatible with widely tunable lasers.

Abstract: PROBLEM TO BE SOLVED: To efficiently release a package 15 from the inside of mold cavities 4, 5 by efficiently reducing mold release resistance to the package (resin molding 15). SOLUTION: A mold for resin molding is constituted by forming at least a mold face (e.g., bottom faces of mold cavities 4, 5) in contact with resin into mirror surfaces, and providing the necessary numbers of hemispherical fine recessed parts 13 having slanted faces 39 (curved faces) not forming undercut on the bottom faces of the cavities 4, 5 (mirror surfaces) in the necessary places. Fine cured protrusion parts 16 cured in the fine concave parts 13 slide on the inner faces (slanted faces 39) of the fine recessed parts 13 and displaced to be floated by composite contraction force 20 of vertical contraction force 18 due to contraction of a resin molding 15 molded in the die cavities 4, 5 and horizontal contraction force 19, thus gaps 17 are generated between the bottom faces of the die cavities 4, 5 and resin molding 15 to reduce the mold release resistance. COPYRIGHT: (C)2009,JPO&INPIT

Abstract: This paper reports a new patterning method, the complementary-structure micropatterning (CSMP) technique, to fabricate the undercut structures for the passive-matrix display of organic light-emitting diodes (OLEDs). First, the polyvinylpyrrolidone (PVP) stripe patterns with a trapeziform cross-section were formed by micromolding in capillaries. Then the photoresist was spin coated on the substrate with the patterned PVP stripes and developed in water. The PVP was dissolved and lifted off from the substrate with the photoresist deposited on it, resulting in the undercut structures of the remaining photoresist. The undercut structures with different configurations were obtained by adjusting the photoresist thickness. The undercut structures were further used as separators in the patterning of the passive-matrix display of OLEDs. No visible performance difference was observed compared with OLEDs patterned by the traditional method.

Abstract: The present invention relates to a method for fabricating a planar independent-double-gate FET or a planar gate-all-around FET on a bulk semiconductor substrate. The method comprises refilling a surface recess in an active semiconductor region with a buried sacrificial layer, and, after preparing a pre-processing a gate stack by respective deposition and patterning, the formation of a recess in the isolation regions so as to cause the recess to extend, in a depth direction that points towards the inner substrate, to a depth level that allows removing the buried sacrificial layer and so as to cause the recess to undercut portions of gate stack in the channel direction.

Abstract: One or more undercut sections (5) are provided in the hollow profile component (1) to provide keying for the casting. The casting material (2) flows around the undercut sections, forming a solid joint between the components (1, 2). A closure is placed inside the cavity (1a) of the hollow profile component. This limits penetration of the cast material to a given depth within the hollow profile. In one example, to seal the hollow space of the cavity in the hollow component, a slide is pushed into it, in the longitudinal direction. In an alternative method, a slide is inserted through a slot in the hollow component, at right angles to the longitudinal direction. In yet another method, a casting core is laid into the profile. A sand-, metal- or salt core is used. The core is fixed by the hollow profile component. The undercut in the profile is a recess or a depression. It is optionally a number of points. The depression is line-shaped. The undercut is produced by variation in the cross section of the profile. It is produced by bending the profile outwardly or inwardly.

Abstract: Stress enhanced transistor devices and methods of fabricating the same are provided. In one embodiment, a transistor device comprises: a gate conductor disposed above a semiconductor substrate between a pair of dielectric spacers, wherein the semiconductor substrate comprises a channel region underneath the gate conductor and recessed regions on opposite sides of the channel region, wherein the recessed regions undercut the dielectric spacers to form undercut areas of the channel region; and epitaxial source and drain regions disposed in the recessed regions of the semiconductor substrate and extending laterally underneath the dielectric spacers into the undercut areas of the channel region.

Abstract: A die-casting mold with an improved structure is provided to effectively form a metal article having an undercut portion through die-casting by constructing the die-casting mold in an inexpensive and simple structure. In a die-casting mold comprising a fixed die(40), a movable die(50), and an ejecting unit(60), the die-casting mold further comprises: undercut forming cores(100) having undercut forming parts(101) for forming an undercut portion on a metal article in a way that the under cut portion is projected in a cross direction(D2) crossing a reciprocating direction(D1) of the movable die; and a linkage unit for moving the undercut forming cores in the cross direction to slide out the undercut forming parts from the undercut portion in a state that the linkage unit is linked to a moving operation of the ejecting unit when the ejecting unit approaches the movable die, wherein the linkage unit comprises: guide rails(110) installed on the ejecting units to support the undercut forming cores such that the undercut forming cores are slidable in the cross direction relative to the ejecting unit; and guide blocks(120) which are installed on the movable die, and into which inclined cam holes(121) are penetrated in a direction inclined relative to the reciprocating direction of the movable die such that the undercut forming cores are slidingly inserted into the inclined cam holes in the penetrating direction of the undercut forming cores, and wherein the undercut forming cores slide in the cross direction relative to the ejecting unit while the undercut forming cores are guided by the inclined cam holes of the guide blocks when the ejecting unit moves in a direction that the ejecting unit approaches the movable die.

Abstract: The invention belongs to the electronic and photoelectronic device field, relating to the preparation technique adopting photoetching to realize device figure transfer in the device preparation technical process. The technology is that a positive photoresist is adopted, and the surface of a sample is spin coated with a first layer of photoresist by the conventional photoetching technology method, and is characterized in that the surface of the sample undergoes large area exposure without masking by a photoetching plate after being prebaked; then the first layer of photoresist which undergoes large area exposure is spin coated with a second layer of photoresist, and is prebaked and exposed after figure masking by the photoetching plate. Development is undergone after exposure, and the first layer of photoresist and the second layer of photoresist both undergo development, after a clear figure shows, development time is prolonged within a specified time to the degree that the figure boundary of the first layer of photoresist penetrates the bottom of the second layer of photoresist which is arranged on the first layer of photoresist, thereby a photoresist figure with a reversed trapezoid-shaped section or an undercut section is formed. The technology is easy to operate and popularize with good repeatability.

Abstract: In the gas metal arc welding (GMAW) process, when the welding speed reaches a certain threshold, there will be an onset of weld bead undercut defects which limit the further increase of the welding speed. Establishing a mathematical model for high-speedGMAWto predict the tendency of bead undercuts is of great significance to prevent such defects. Under the action of various forces, the transferred metal from filler wire to the weld pool, and the geometry and dimension of the pool itself decide if the bead undercut occurs or not. The previous model simplified the pool shape too much. In this paper, based on the actual weld pool geometry and dimension calculated from a numerical model, a hydrostatic model for liquid metal surface is used to study the onset of bead undercut defects in the high-speed welding process and the effects of different welding parameters on the bead undercut tendency.

Abstract: PROBLEM TO BE SOLVED: To provide a shape evaluating device capable of evaluating whether the shape of a molding is a shape suitable for injection molding without manual aid about a draft of a metallic mold and an undercut on the basis of design data. SOLUTION: A vector operation processing means 115 calculates an inner product of a reference vector V1 and a normal vector V2. A gradient amount calculating means 121 calculates an angle θ from a result of the vector operation processing means 115. A gradient amount evaluating means 124 evaluates whether the angle θ is a gradient amount suitable for the height of a surface on the basis of correlation information stored in a surface height/gradient amount proper information database 123. An undercut part detecting means 131 detects that the surface of an object has an undercut if there is an intersecting surface in the direction of a normal vector of a surface about the surface where the value of an inner product is a negative value. A detected surface display means 151 displays an evaluation result and a detection result. COPYRIGHT: (C)2008,JPO&INPIT

Abstract: Disclosed is a tool that is designed as a milling cutter (13) and is used for producing an undercut groove (1) in a gypsum plaster board (2), said undercut groove (1) having a V-shaped upper delimiting cross-section (3) and an adjacent undercut cross-sectional area (4). The milling cutter (13) has a truncated conical section (14) and a section (15) that is formed at the free end and has a larger external diameter (D) for producing an undercut cross-sectional area (4). In the radially external edge region (16), the cross-section of the section (15) having the larger external diameter (D) corresponds at least approximately to half the cross-section of the cross-sectional opening formed after bending the workpiece.

Abstract: PROBLEM TO BE SOLVED: To provide an etching technique of a wiring film of a transistor, capable of preventing undercut in etching a copper laminate film SOLUTION: An etchant includes a solution containing nitric acid, hydorchloric acid and phosphoric acid, and has a small difference in etching speed in etching films different in the content of a copper oxide Thus, overetching can be prevented in etching a first copper thin film 51 containing a copper oxide and a second copper thin film 52 having the content of a copper oxide lower than that of the first copper thin film 51, and a phenomenon called "undercut" can be prevented COPYRIGHT: (C)2009,JPO&INPIT

Abstract: The present invention provides a PM main bearing cap, and its precursor compact, with an undercut breathing window that is formed during a compaction process. By fabricating the undercut during the compaction process, the invention eliminates the need for a secondary machining operation to form the undercut feature in the bearing caps.

Abstract: The earlier in the production chain discontinuities in the weld area are discovered the better and less expensive it is to modify the weld. If the weld is bigger than necessary the cost and the weight grow, and if the weld is undersized the strength is put at risk. This report contains a summary of a literature survey for finding means for optical measurements of weld geometry. Some of the articles are about existing devices that can measure welds. One is hand-held and is applied on the weld afterwards and compares the data with pre set parameters. Experiments were performed with two different systems to evaluate their capability to capture the weld geometry. The first system is an in - house built system with a laser line diode and a CMOS - camera, the other system is scanCONTROL, and is a device with integrated camera and laser line. Matlab was used to process and analyse data from both systems. Experiments with the first system ended when it was quite obvious that it did not meet the expected result. The laser line projection was too short to cover enough of the weld area and it was hard to process the image to find defects in the weld area. The data from the scanCONTROL system was ready to use and it was quite easy to find different defects and discontinuities in the weld area. It is possible to find the geometry of the weld and it is possible to find defects like spatter, undercut and sharp edges, with laser line projection and camera. The equipment is important in order to extract data useful for analysis.