About: Test probe is a research topic. Over the lifetime, 924 publications have been published within this topic receiving 6913 citations. The topic is also known as: probe & electronic test probe.
TL;DR: In this paper, three different probes, including a differential hall probe, a differential coil probe, and a two-stage differential coils probe, are designed to detect the defects between third layer and fourth layer in riveted structures.
Abstract: The Pulsed Eddy Current (PEC) technique is an effective method of quantifying defects in multi-layer structures. It is difficult to detect defects in riveted structures of aging aircraft. Based on theoretical analysis of PEC technique, three different probes, including a differential hall probe, a differential coil probe, and a two-stage differential coil probe are designed to detect this kind of defects. The averaging method and wavelet analysis method are used to de-noise the hall response signals. By selecting peak amplitude and zero-crossing time of response signal in time domain as key features, defects in riveted structures can be detected effectively. The experimental results indicated that the differential coil probe acted as effectively as the differential hall probe. The defects between third layer and fourth layer in riveted structures can be detected by utilizing the two-stage differential coil probe. The PEC technique has a promising application foreground in the field of aeronautical nondestructive testing.
TL;DR: In this article, a test system for conductive electronic device structures such as a conductive housing member that forms part of an antenna may be provided that has a pair of pins or other contacts.
Abstract: Conductive electronic device structures such as a conductive housing member that forms part of an antenna may be tested during manufacturing. A test system may be provided that has a pair of pins or other contacts. Test equipment such as a network analyzer may provide radio-frequency test signals in a range of frequencies. The radio-frequency test signals may be applied to the conductive housing member or other conductive structures under test using the test probe contacts. An antenna may be used to gather corresponding wireless radio-frequency signal data. Forward transfer coefficient data may be computed from the transmitted and received radio-frequency signals. The forward transfer coefficient data or other test data may be compared to reference data to determine whether the conductive electronic device structures contain a fault.
TL;DR: A test probe for a high-frequency device having an electronic circuit with two or more contact regions is described in this article, where the ground probe is positioned between at least two of the signal probes.
Abstract: A test probe for a high-frequency device having an electronic circuit with two or more contact regions. The test probe comprises two or more signal probe tips. Each signal probe tip has a contact surface area for contacting one of the contact regions of the device. A ground probe has a ground contact surface with a surface area substantially greater than the contact surface area of the one signal probe tip for contacting another one of the contact regions of the electronic circuit. The ground probe is positioned between at least two of the signal probes.
TL;DR: In this article, a test system is provided that includes a test probe configured to energize the conductive housing member or other conductive structures under test and that includes temporary test structures that may be placed in the vicinity of or in direct contact with the device structures during testing to facilitate detection of manufacturing defects.
Abstract: Electronic device structures such as a conductive housing member that forms part of an antenna may be tested during manufacturing. A test system may be provided that includes a test probe configured to energize the conductive housing member or other conductive structures under test and that includes temporary test structures that may be placed in the vicinity of or in direct contact with the device structures during testing to facilitate detection of manufacturing defects. Test equipment such as a network analyzer may provide radio-frequency test signals in a range of frequencies. An antenna probe may be used to gather corresponding wireless radio-frequency signal data. Forward transfer coefficient data may be computed from the transmitted and received radio-frequency signals. The forward transfer coefficient data or other test data may be compared to reference data to determine whether the device structures contain a fault.
TL;DR: In this article, a test probe head assembly having a plurality of probe arms with terminal probe-points mounted on a support member with means for transmitting electrical signals between an external signal source and the probe's arms is presented.
Abstract: A test probe head assembly having a probe assembly comprising a plurality of probe arms with terminal probe-points mounted on a support member with means for transmitting electrical signals between an external signal source and the probe's arms. The probe-points are resiliently mounted on the probe assembly which is itself capable of deflection.