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  3. Systems engineering
  4. 2001
Showing papers on "Systems engineering published in 2001"
Proceedings Article•10.1109/ECBS.2001.922419•
Need-based requirements change management

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A. Kobayashi1, M. Maekawa2•
NEC1, University of Electro-Communications2
20 Apr 2001
TL;DR: The NRM (Need-based Requirements Management) model and a practical approach, NRM process, constructed on the NRM model are suggested to efficiently manage such continuous changes of system requirements.
Abstract: Many changes of system requirements can be continuously proposed during the life cycle of the system. Those continuous changes of system requirements can cause many kinds of difficult and costly errors throughout the whole life cycle of a system and make most of the requirements engineering methods practically useless. An effective approach to manage requirements changes is therefore necessary for successful system development in practice. The paper suggests the NRM (Need-based Requirements Management) model and a practical approach, NRM process, constructed on the NRM model to efficiently manage such continuous changes of system requirements. The NRM model has an ability to define the system requirements in 4W (Where, Who, Why, What) aspects, so that system analysts can understand the requirements accurately, although general system requirements analysis methods define them in only 2W (Who What) aspects. The NRM process, which mainly consists of V&V (verification and validation) activities, continuously watches requirement changes throughout the whole system life cycle.

52 citations

Proceedings Article•10.1109/IPFA.2001.941451•
Failure analysis challenges

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L.C. Wagner1•
Texas Instruments1
9 Jul 2001
TL;DR: The International Sematech Product Analysis Forum (Joseph et al., 2000) has identified ten primary challenges for the future of the failure analysis in the semiconductor industry: localization and electrical characterization; deprocessing techniques for new materials; system-on-a-chip; imaging of small defects and structures; detection and characterization of nonvisual defects; verification and test; globally dispersed entities as virtual factory; fault isolation and simulation software; cost of failure analysis; complexity and volume of data.
Abstract: Semiconductor trends as embodied in the International Technology Roadmap for Semiconductors (ITRS) provides a guide for the challenges facing the failure analysis community. The technical challenges fall primarily into two categories: failure site isolation and physical analysis. The failure site isolation challenges are driven primarily by the device complexity and reduced accessibility of circuit nets. Additional challenges arise due to the increase in device operating speed and pin count. The challenges in physical analysis are driven primarily by smaller device feature sizes and by the host of new materials being introduced. In addition to the technical challenges, infrastructure changes are also likely to occur. The likely industry paths for addressing these challenges are discussed. The International Sematech Product Analysis Forum (Joseph et al, 2000) has identified ten primary challenges for the future of the failure analysis in the semiconductor industry: localization and electrical characterization; deprocessing techniques for new materials; system-on-a-chip; imaging of small defects and structures; detection and characterization of nonvisual defects; verification and test; globally dispersed entities as virtual factory; fault isolation and simulation software; cost of failure analysis; complexity and volume of data. These challenges have been correlated to the Technology Working Group Difficult Challenge table in the ITRS.

31 citations

Repository•10.1051/jp4:2001622/pdf•
Space Station and instrumentation

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E. Kufner
1 Jan 2001
Abstract: Europe contributes to the International Space Station (ISS) a variety of research equipment either originating form individual European countries or stemming from Trans-European co-operations carried out under ESA contracts The ISS relevant research equipment is usually composed of universally applicable, discipline-adapted laboratories and experiment-dedicated facilities. The laboratories will be integrated into the International Standard Payload Racks (ISPR). Examples relevant for the discipline Physical Sciences are the European Fluid Science Lab (FSL), the Material Science Lab (MSL), the Electromagnetic Levitator for Material Sciences (MSL-EML), and also the European Drawer Rack (EDR) Experiment dedicated hardware will go into fast easily exchangeable Experiment Containers (ECs), Inserts, Cartridges, Drawers, and Lockers These components slide into the laboratories, mostly by automatically connecting relevant power, gas, liquid, and light-beam ducts. These laboratory inserts are planned to be designed as modular as possible so that they can be adapted to various similar demands, or upgraded according to growing scientific achievements. All the European laboratories and experiment-dedicated hardware are planned to serve as multi-user and multi-experiment facilities.
Book Chapter•10.1093/oso/9780198504160.003.0008•
EV simulation

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Chun Chung Chan, K. T. Chau
11 Oct 2001
TL;DR: EV simulation is a powerful tool for virtual analysis of physical system behaviour, enabling engineering designers to evaluate their designs thoroughly and identify potential problems.
Abstract: Abstract Computer simulation has been widely accepted to be a powerful tool in different fields of research. Its key role is to provide virtual analysis of physical system behaviour before performing any expensive prototyping or time-consuming experimentation. Increasingly, it enables engineering designers to evaluate their designs thoroughly, and to identify some problems that are not easy to observe by measurement or experimentation. This tool can save the development cost in the order of millions of dollars that might otherwise be spent to correct flaws in later stage of engineering and manufacturing (Chau, 1996).

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