Topic
RF module
About: RF module is a research topic. Over the lifetime, 1554 publications have been published within this topic receiving 9444 citations.
Papers published on a yearly basis
Papers
Patent•
5 Dec 2000TL;DR: In this paper, a planar spiral wound conductive traces are fabricated as high conductive metals to reduce trace height and width while maintaining low resistance, thereby reducing parasitic capacitances between adjacent trace side walls and with the ground plane of the IC chip.
Abstract: Implantable medical devices (IMDs) having sense amplifiers for sensing physiologic signals and parameters, RF telemetry capabilities for uplink transmitting patient data and downlink receiving programming and interrogation commands to and from an external programmer or other medical device are disclosed. At least one IC chip and discrete components have a volume and dimensions that are optimally minimized to reduce its volumetric form factor. Miniaturization techniques include forming notch filters of MEMS structures or forming discrete circuit notch filters by one or more of: (1) IC fabricating inductors into one or more IC chips mounted to the RF module substrate; (2) mounting each IC chip into a well of the RF module substrate and using short bonding wires to electrically connect bond pads of the RF module substrate and the IC chip; and (3) surface mounting discrete capacitors over IC chips to reduce space taken up on the RF module substrate. The IC fabricated inductors are preferably fabricated as planar spiral wound conductive traces formed of high conductive metals to reduce trace height and width while maintaining low resistance, thereby reducing parasitic capacitances between adjacent trace side walls and with a ground plane of the IC chip. The spiral winding preferably is square or rectangular, but having truncated turns to eliminate 90° angles that cause point-to-point parasitic capacitances. The planar spiral wound conductive traces are further preferably suspended over the ground plane of the IC chip substrate by micromachining underlying substrate material away to thereby reduce parasitic capacitances.
298 citations
Patent•
5 Jan 2010
TL;DR: In this paper, a radio frequency (RF) charging system is capable of charging an RF device on a display panel to increase charging efficiency, which includes an antenna set having a plurality of antennas, a switch unit, an RF module and a microcontroller unit (MCU).
Abstract: A radio frequency (RF) charging system is capable of charging an RF device on a display panel to increase charging efficiency. The RF device generates a response signal upon receiving an RF signal. The RF charging system includes an antenna set having a plurality of antennas, a switch unit, an RF module and a microcontroller unit (MCU). The MCU controls the switch unit to select one antenna from the antenna set. The antenna is able to receive the response signal and is used for transmitting the RF signal, thereby charging the RF device.
187 citations
Patent•
3 May 2001
TL;DR: In this paper, an RF communication module (201) for enabling RF data communication in a wireless communication system is provided, which comprises, a transmitter/receive circuitry (203) for transmitting and receiving data, an RF chipset and microcontroller (209) for enable and controlling various functions of the RF communications module (200), an antennae circuitry (205), an enabling function of the transmitters/receivers circuitry (202), and a data port (207) for serial communication between the RF module and connected components of a host device, characterized in that the RF communication
Abstract: An RF communication module (201) for enabling RF data communication in a wireless communication system is provided. The communication module (201) comprises, a transmitter/receive circuitry (203) for transmitting and receiving data, an RF chipset and microcontroller (209) for enabling and controlling various functions of the RF communication module (201), an antennae circuitry (205) for enabling function of the transmitter/receive circuitry (203) and a data port (207) for enabling serial communication between the RF module (201) and connected components of a host device, characterized in that the RF communication module (201) functions as a slave module or a controlling module dependent on the host device.
168 citations
Patent•
28 Jul 2006
TL;DR: In this article, a patch-type physiological monitoring apparatus, system and network are disclosed, which includes a node, and at least a patch for attaching to a skin surface of a user and for supporting the node on the skin surface through joining therewith, wherein the node includes at least signal I/O port for externally connecting to at least sensor or electrode through a connecting wire so as to acquire a physiological signal, and a RF module for transmitting and receiving signal.
Abstract: Patch-type physiological monitoring apparatus, system and network are disclosed. The patch-type physiological monitoring apparatus includes at least a node, and at least a patch for attaching to a skin surface of a user and for supporting the node on the skin surface through joining therewith, wherein the node includes at least a signal I/O port for externally connecting to at least a sensor or electrode through a connecting wire so as to acquire a physiological signal, and a RF module for transmitting and receiving signal. The apparatus according to the present invention is of light weight and compact size and easily attached to human body through adhesive patches. Through a RF module, the system can wirelessly communicate with corresponding devices without additional wiring. Further, the system can utilize conventional electrodes, patch electrodes and electrode wiring to avoid extra cost for facilities' renewal and replacement.
149 citations
Patent•
31 Mar 2003TL;DR: In this article, the integrated inductors are fabricated as planar spiral wound conductive traces formed of high conductive metals to reduce trace height and width while maintaining low resistance, thereby reducing parasitic capacitances between adjacent trace side walls and with the ground plane of the IC chip.
Abstract: Implantable medical devices (IMDs) having RF telemetry capabilities for uplink transmitting patient data and downlink receiving programming commands to and from an external programmer having an improved RF module configured to occupy small spaces within the IMD housing to further effect the miniaturization thereof An RF module formed of an RF module substrate and at least one IC chip and discrete components has a volume and dimensions that are optimally minimized to reduce its volumetric form factor. Miniaturization techniques include: (1) integrating inductors into one or more IC chips mounted to the RF module substrate; (2) mounting each IC chip into a well of the RF module substrate and using short bonding wires to electrically connect bond pads of the RF module substrate and the IC chip; and (3) surface mounting discrete capacitors over IC chips to reduce space taken up on the RF module substrate. The integrated inductors are preferably fabricated as planar spiral wound conductive traces formed of high conductive metals to reduce trace height and width while maintaining low resistance, thereby reducing parasitic capacitances between adjacent trace side walls and with a ground plane of the IC chip. The spiral winding preferably is square or rectangular, but having truncated turns to eliminate 90° angles that cause point-to-point parasitic capacitances. The planar spiral wound conductive traces are further preferably suspended over the ground plane of the RF module substrate by micromachining underlying substrate material away to thereby reduce parasitic capacitances.
146 citations
Related Topics (5)
Performance Metrics
| Year | Papers |
|---|---|
| 2021 | 17 |
| 2020 | 29 |
| 2019 | 60 |
| 2018 | 78 |
| 2017 | 77 |
| 2016 | 105 |