Abstract: Reliability evaluation tests for multilayer ceramic chip capacitors mounted on a hybrid IC were implemented. Failure modes, failure mechanisms, and drift of characteristics were analyzed. Humidity acceleration as well as voltage and temperature accelerations were investigated to estimate the chip capacitor reliability. The chip capacitor reliability proved to be high and adequate for the service period of the communication system.

Abstract: This paper discusses techniques of evaluating long term oxide reliability at the wafer level. These techniques are presently used in the development of high reliability oxide processes. The first technique involves a statistical analysis of the electric field distribution of MOS capacitor primary breakdown. The second technique consists of monitoring time dependent breakdowns of test capacitors during a short four second voltage accelerated stress test. Using an empirically derived voltage acceleration factor (107/MV/cm) failure rates at nominal voltages can be accurately extrapolated from these voltage accelerated data. A discussion of how these techniques can be used to determine oxide reliability is presented.

Abstract: Over 90% of failures in buried cables are caused by mechanical damage, and, of the remaining 10%, the cause is unknown. Trees have been found in the polyethylene insulation of cables that have failed in service, but nobody has established that treeing was the actual cause of failure. But, because of the increasingly severe requirements for power systems, all factors must be considered to design for complete reliability

Abstract: There is a rapidly increasing trend to apply silicon integrated circuits (ICs) in microprocessors to the control of complete systems. A few examples are consumer products, automobiles, and distributed communication. These systems are complex and orders of magnitude more expensive than the microprocessors, necessitating a functional reliability of the microprocessors and ICs much higher than in traditional applications. The need for higher reliability is particularly demanding in applications which involve operating extremes of temperature, humidity, and electrical operation, e.g. in engine control of cars.

Abstract: CMOS IC s are being produced using a variety of processes, and considerable data is now available on their reliability and failure mechanisms.

Abstract: PURPOSE:To improve the reliability and safety of the apparatus, by installing a switching means possible to supply necessary electric power until the pulling and unloading of the pinch roller are completed, even if the power source is off.

Abstract: One questionnaire designed to measure primary personality traits (the 16 PF) and another designed to measure second-order traits (the EPI) were compared in terms of reliability and comprehensiveness. Reliability differences between the two tests appeared to be due to their relative length rather than any inherent characteristics of the underlying traits. Two approaches for evaluating the overlap between the two scales were explored. The theoretical conclusion appears to be that the reliable portions of the EPI scale scores can be entirely reconstructed from a knowledge of 16 PF scores. In contrast, the EPI is far narrower in its scope and able to explain less than a third of a reliable variance in the 16 PF.

Abstract: PURPOSE:To prolong the endurance life of the device and enhance its reliability by removing a pattern from a thick film resistor layer provided on a photo-resist parrern, and then, forming plural heater-resistors resulting from a relative separation of each resistor.

Abstract: PURPOSE:To make possible woven fabrics of high reliability and facilitate production without impairing the transmission characteristics of an optical fiber by inserting color-coding fibers or yarns into the inside of the protection covering layer of the optical fiber.

Abstract: In this paper we describe the active devices and passive components used in the SG undersea cable system for the TAT-6 link between Green Hill, Rhode Island, and St. Hilaire de Riez, France. We explain reasons for component choice and present information about design, performance, screening, and reliability.

Abstract: The design criteria and performance of a Nd-YAG unstable resonator laser are described The laser offers better performance and reliability at a lower cost than conventional stable-resonator Nd-YAG designs (TFD)

Abstract: PURPOSE:To increase the reliability, by reducing the production of 2-bit error through the correction of failures in the mememory section within semiconductor memory elements and by correcting one-bit error even at write-in.

Abstract: PURPOSE:To improve the mass-productivity and reliability of a thermal head by connecting array blocks of exotermic resistors and diodes by way of film in which conducting wires are arranged.

Abstract: PURPOSE:To improve the operation property and the reliability in an atomic power plant, to improve the coefficient of utilization by the reduction of equipments, and to reduce the keeping quantity and to employ the using water in the plant profitably, by means of purifying the pool water in a plenum chamber (SP).

Abstract: PURPOSE:To improve an activity rate, a reliability, and an economical efficiency by performing heat exchange between the lst cooling system and steam system, where a liquid metal is circulating, by means of a stable material which is reacting with neither liquid metal nor water.

Abstract: A comprehensive reliability study of low noise GaAs FETs is presented. It involves over 1500 devices and 1,500,000 device hours of aging and various conditions of elevated temperature, bias and humidity. The major findings are: a) The Al gate metallization is responsible for the major failure mechanisms. Proper design and packaging can circumvent these problems. b) Unbiased aging leads to meaningless and overly optimistic results. c) DC and RF degradation generally do not agree and contact degradation is not accompanied by a loss of RF performance. d) A properly designed low noise GaAs FET can have failure rates comparable to those reported for silicon devices of similar size.

Abstract: PURPOSE:To improve reliability by preventing misdischarging by providing reactor of which intermittence of current supply and that of ignition coil can be done by the same switching element synchronisingly.

Abstract: PURPOSE:To improve reliability in a controlling device, by means of providing a detecting circuit composed of a driving detecting circuit and an actuating detecting circuit etc. for an electromagnetic valve.

Abstract: PURPOSE:To improve the reliability by maintaining the normal operations of a switching circuit, even if a trouble occurs to a semiconductor switch, by providing a switch with a mechanical contact in juxtaposition.

Abstract: PURPOSE:To improve working efficiency and reliability by supplying starting instructions for a driving controlling apparatus directly from a process computer so that when a detector completes drawing-out, a next detector completes insertion.

Abstract: PURPOSE:To simplify the handling of the resing as well as increase the reliability of a semiconductor device by attaching the semiconductor sealing frame to the flexible film and giving a potting into the frame.