Abstract: In a touch sensitive electronic switching circuit including a C-MOS inverter, for use in electronic wristwatches, a resistor of 1-10 MΩ is connected to the source electrode of the P-channel MOS type field effect transistor included within the C-MOS inverter, whereby the threshold voltage level of the C-MOS inverter is shifted to a low level to enhance the reliability of the touch sensitive electronic switching circuit. In another embodiment, the resistor of 1-10 MΩ is connected to the source electrode of the N-channel MOS type field effect transistor included within the C-MOS inverter, whereby the threshold voltage level of the C-MOS inverter is shifted to a high level to enhance the reliability of the touch sensitive electronic switching circuit.

Abstract: PURPOSE:To provide a high reliability by transmitting the information through an optical fiber, with the optical fiber assembled into the aerial power transmission wire or overhead earth wire.

Abstract: A multiple spray nozzle, offset press dampening system of the type having individual metering pumps for the respective nozzles achieves improved control and reliability by substantially increasing feed water pressure entering the metering pumps, thereby reducing the formation of bubbles. The pump output valve flow-through pressure is also increased to retain accurate metering conditions.

Abstract: PURPOSE:In directly heated semiconductor unit with high heat response and reliability achieved by improving insulation between electric heater and package.

Abstract: A solid state timing circuit exhibiting very high reliability under adverse environmental operational conditions such as are encountered in automatic truck lubrication systems The circuit utilizes an electrochemical timing device operating in plate and deplate modes to achieve a periodic actuation of an inductive load Two transistor stages are operatively associated with the electrochemical timing device and an R-C timing network is used to control one of these transistor stages

Abstract: PURPOSE: To prevent the delamination of the film around the chip and produce a semiconductor device of high reliability by forming metal bump electrodes in the openings of a polymide resin film, then dicing the wafer COPYRIGHT: (C)1977,JPO&Japio

Abstract: Report on Metallization systems for semiconductor devices, 13 February 1976 Imperial College, London.

Abstract: A semiconductor device has a conductive layer for wiring which is made of an Al alloy containing Mn in an amount greater than 1 percent by weight and below 6 percent by weight. The semiconductor device has excellent corrosion resistance, and has a high reliability.

Abstract: PURPOSE:To provide a measuring device that eliminates damages from arising when making electrical measurements of semiconductor elements and thus improve the reliability of the elements.

Abstract: Spacecraft applications that require the efficient cooling of high-powered components, the precise temperature control of sensitive electronic and optical components, and the protection of cooled components from temporary, adverse environmental conditions are increasing Heat pipes using gas, vapor, liquid, or voltage control to provide variable conductance or diode thermal behavior have been and are continuing to be developed to meet increasingly difficult requirements The various control techniques are critically evaluated using characteristic features and properties, including heat transport capability, volume and mass requirements, complexity and ease of fabrication, reliability, and control characteristics As a result, advantages and disadvantages of specific approaches are derived and discussed Using four development levels, the state-of-the-art of the various heat pipe temperature control techniques is assessed

Abstract: PURPOSE:To plan the decrease of mechanical and thermal strength and to plan improvement of reliability, by making as the sub-lead terminal of the semiconductor element and the lead terminal of the base are connected by simple manufacturing process

Abstract: PURPOSE:To obtain timepieces structure having a high reliability and eliminating soldering process by putting a circuit board with conductive pattern between an element holder incorporated with each element having an elastmeric conductive part and a liquid crystal display holder.

Abstract: PURPOSE: To improve the precision of time setting and reliability in a control system for program control of the operating mode of trafic display plates and other controlled units by arranging such that the comparison of a preset time and timer time is done with a single comparator circuit. COPYRIGHT: (C)1978,JPO&Japio

Abstract: : The objective of the study is to investigate reliability on small and medium scale C/MOS integrated circuits. Four manufacturers' gates and three manufacturers' shift registers are included. The effects of burn-in and stress tests on the devices are being evaluated. One aspect of this work involved an analysis of the structural differences between various manufacturing versions of devices bearing the same type designation, so that the possible effect of the variations on device reliability could be determined. Information contained in this report indicates structural differences between manufacturers' devices and indications of sequence of burn-in effects on the generation of failures. The evaluation reveals no serious device problems on initial stress tests and the failures which did occur revealed only anticipated mechanisms at this point in the testing schedule.

Abstract: An optical means of measuring torque is described having high accuracy and reliability combined with modest cost. Details of an instrument which was adapted to a transmission output shaft are given. Torque, rpm, and their time rates of change are envisaged as inputs to a microprocessor for the generation of feedback control signals for timing, fuel-air ratio, and fuel.

Abstract: PURPOSE:In the control rod postion detecting apparatus constituted of a magnet moving with a control rod and a plurality of lead switch driven by the said magnet, a plurality of magnet are arranged leaving a proper distance, and reliability is improved without increasing the number of lead switches.

Abstract: The reliability of Integrated Injection Logic (I2L) or Merged Transistor Logic (MTL) circuits fabricated in a standard bipolar technology with Ti-Pt-Au interconnection is reported. The study is based on accelerated stress aging and actual field results. Experiments are described which demonstrate that I2L circuit failure in humid ambients due to Au elelctrolysis will not occur because of low voltage operation. Failure rates less than 10 FITs for an LSI part (.001% failure per 1000 device hours) under normal stress over a 40 year life are predicted for the main population by accelerated bias temperature and bias humidity stress. Well behaved current gain (su) under bias temperature step stress indicates that Ou degradation will not be a significant failure mechanism. At this writing, more than 60 million device hours have been accumulated for LSI chips in specific applications with no reported chip failures. This field result firmly supports accelerated stress reliability predictions.

Abstract: PURPOSE:To obtain a reliability through minimization of accident by moving a mirror with an inclination to an optional direction and angle by remote control or also by hand or by performing to prevent from overload driving of the driving mechanism when an external pressure is given to the mirror in the rear reflecting mirror device for vehicle.

Abstract: PURPOSE:To improve a soldering property and reliability of a lump, by forming the electrode of the bump etc on the surface of a semiconductor element

Abstract: : This report summarizes the accomplishments on a program to collect, study, and analyze reliability data and to develop models based on these data that can be used to predict the reliability of microwave tubes. The data were collected from the military services and various manufacturers for microwave tubes used in radar, communication and electronic counter measure systems. Included in the data were tubes from air, ground, and sea installations. The frequency range of the tubes in the data is 400 MHz through 16 GHz, and the peak output power of the tubes is generally over 100 watts. Reliability models were developed for 70 tube types which may be used to predict failure rates and removal criterion distributions. Additional reliability models were developed for klystrons, twystrons, magnetrons, traveling wave tubes, triodes and tetrodes which may be used to predict failure rates and removal criterion distributions based on operating parameters such as power, frequency and duty cycle. A methodology was developed to determine tubes requiring reliability improvement based expenditures required to replace failed tubes.

Abstract: PURPOSE: To enable sensing the water level in the washing tank of a washing machine in high reliability and simple construction by a non-contacting water level sensing circuit for sensing the water level by means of the increase of the electrostatic capacity between the external stationary electrodes at the rise of the water level in the tank. COPYRIGHT: (C)1978,JPO&Japio

Abstract: PURPOSE:A electrodeposition insulating process for rotor coil or the like wherein stand insulation and ground insulation are concurrently effected to obtain an insulated film having excellent heat resisting property, mechanical and electrical characteristics as well as a high reliability of electric insulating property.

Abstract: PURPOSE:For improving the technical reliability and miniaturizing product by reducing the number of parts of a time limit reset circuit which discharges the charges in condensers with a definite delay after the power supply opens.

Abstract: PURPOSE:To get wiring unit with high reliability by improving adhesion between wiring layer isolating film and metal wiring conductor layer in thin film integrated circuit