Abstract: The usual definition of stochastic comparison of random vectors is extended to stochastic comparison of random processes. Conditions are stated under which { X ( t ), t ≧ 0} stochastically larger than { Y ( t ), t ≧ 0} implies that for increasing functionals f . Applications are made to reliability problems, yielding stochastic comparisons for systems of independently operating machines assuming exponential failure and exponential repair. From these stochastic comparisons we may then deduce similar stochastic comparisons for functionals of practical importance in reliability applications, such as the total machine up-time, the first time that the number of functioning machines drops below a specified number, the total time during which at least a specified number of machines are functioning, etc.

Abstract: This invention relates to an electrostatic voltmeter which provides accurate measurement of the electrostatic potential of a small surface area, without physical contact therewith. More particularly, it relates to the utilization of solid state elements to provide improved transient response, characterized by superior performance, stability, reliability and ease of maintenance of an electrostatic voltmeter.

Abstract: Improper coverage of surface topography can lead to a variety of reliability and yield problems in electron devices. The nature of coverage defects and failure mechanisms is discussed, and techniques for improving the reliability by chemical tapering processes and/or optimized film deposition methods are reviewed and classified. Specific examples of experimental conditions are given for obtaining tapered edges of delineated films by chemical and by fusion techniques. Means for achieving improved step coverage by deposited films are also outlined. Several examples of applications to device processing are presented in the experimental part of the paper. A novel electrical process control method utilizing noise measurements in a selected frequency range is demonstrated to be an extremely sensitive tool for rapidly determining variations in the cross-sectional area of conductor films. Experimental results are given to illustrate the applicability of the new method for evaluating taper angles from 3 to 90°.

Abstract: Two orders of magnitude improvement in the reliability of plastic packages has been achieved as the result of a systematic study of basic failure mechanisms and the development of improved materials, handling procedures and process controls. This improved integrated-circuit packaging system has resulted in plastic-encapsulated product capable of matching the reliability of hermetic packages under severe environmental stress.

Abstract: Electron Bombarded Semiconductor or EBS Power Devices have presented some unique reliability problems to the developers. Recently many of the design difficulties have been overcome and devices have now demonstrated over 3000 hours of operation. This paper briefly discusses some of the reliability improvements and describes the development of reliable, radiation resistant semiconductor targets.

Abstract: Stepping motors under computer control are often required to go as fast as reliability permits, which generally entails acceleration to a high speed followed by deceleration to a destination. For reliable and efficient operation the acceleration must not exceed a given limit; however the motor must not waste time at very low speeds. Since a single computer instruction forms an appreciable part of the delay between pulses at high speed the algorithm which calculates this delay must be very concise. In addition, it must be virtually free of cumulative errors since the tolerance on the mean delay time can easily be less than 0.01% at high speed. Such an algorithm is given.

Abstract: Defective wire bonds account for a high percentage of hybrid-microcircuit failures. The work reported here was undertaken to evaluate methods of determining and enhancing bond reliability. The investigations indicated the limitations of visual inspection and such conventional screening techniques as mechanical shock and acceleration testing and thermal cycling for the assessment of microcircuit bonds. They showed that pull-strength testing and failure-mode identification constitute a valuable tool for use in reliability evaluation and manufacturing control.

Abstract: An experimental high power, high gain 4 GHz transistor is described. The design aspects of high breakdown voltage, ballasting resistors, metallization system and thermal design are reviewed. It is shown how these consideration have been optimized for device reliability and long MTF.

Abstract: The rapid progress in reliability and performance of electronic equipment in recent years calls for further improvement in circuit density, reliability and electrical properties of printed circuit boards on which IC or LSI is installed. This problem can be solved only by new development in such as board material, plating, and manufacturing process and technologies.

Abstract: The shortcomings of mechanical and vacuum tube computers are pointed out. the semiconductor device has provided greatly increased intrinsic reliability but has made apparent the problem of manageability. the semiconductor approach allows the classical methods of tackling complexity by partitioning and decentralization to be followed. storage management and store searching aids can easily be realized by additional circuits.

Abstract: A preliminary failure mode, failure effect, and criticality analysis of the major subsystems of nuclear electric propulsion is presented. Simplified reliability block diagrams are also given. A computer program was used to calculate the reliability of the heat rejection subsystem.