Showing papers on "Reliability (semiconductor) published in 1972"
Patent•
26 Jan 1972
TL;DR: In this article, a solid state wristwatch with a digital time display of light-emitting diodes is described, which is a modular construction for ease of assembly and reliability.
Abstract: Disclosed is a solid state wristwatch having no moving parts and utilizing a digital time display of light-emitting diodes. The watch features a modular construction for ease of assembly and reliability. Also disclosed is a setting magnet for the watch stored in the watch bracelet.
28 citations
Patent•
18 Sep 1972
TL;DR: In this article, a semiconductor device increased in performance reliability by improving the fragility effected by heat and a lapse of time on the semiconductor devices such as power transistor, Thyristor, Triac, etc.
Abstract: This invention relates to a semiconductor device and more particularly to a semiconductor device increased in performance reliability by improving the fragility effected by heat and a lapse of time on the semiconductor device such as power transistor, Thyristor, Triac, etc.
17 citations
Patent•
10 Mar 1972
TL;DR: A decoder-driver network for energizing a liquid crystal display used in a timepiece to cause the same to provide any one of a plurality of presentations according to any number of coded formats is described in this paper.
Abstract: A decoder-driver network for energizing a liquid crystal display used in a timepiece to cause the same to provide any one of a plurality of presentations according to any one of a number of coded formats. The decoder-driver circuit uses bidirectional devices arranged in series paths to minimize components and increase reliability.
11 citations
TL;DR: In this article, a convenient method for making plastic cone seals by heat shrinking for use in high pressure liquid and gas systems is described, but the method is not suitable for high temperature environments.
Abstract: A convenient method is described for making plastic cone seals by heat shrinking for use in high pressure liquid and gas systems.
11 citations
Patent•
24 Nov 1972TL;DR: In this paper, a plurality of solid-state one-shot, logic gates and JK flipflops are used to provide a compact modem control having improved reliability of operation.
Abstract: A plurality of solid-state one-shots, logic gates and JK flipflops are used to provide a compact modem control having improved reliability of operation The solid-state logic circuits improve the accuracy of the timing over modem controls using relays
7 citations
TL;DR: In this article, a redundant static inverter is applied as an uninterruptible power supply (UPS) and a reliability analysis is presented showing that the introduction of a static bypass transfer switch brings about a reliability improvement of 8.5 to 1 in the mean time between failure (MTBF).
Abstract: A redundant static inverter is applied as an uninterruptible power supply (UPS). A reliability analysis is presented showing that the introduction of a static bypass transfer switch brings about a reliability improvement of 8.5 to 1 in the mean time between failure (MTBF). This gives MTBF greater than 600 000 h. The static bypass transfer switch provides a synchronized automatic transfer in less than 1 ms from the UPS to the normal ac input power source upon a failure of the UPS.
6 citations
3 Apr 1972
TL;DR: A survey of more than a dozen semiconductor manufacturers indicated that the following reliability areas are not adequately controlled: metallization, wire bonding, loose conductive particles and ceramic packages sealed by low melting point glasses as discussed by the authors.
Abstract: : A study was undertaken to determine the feasibility of obtaining high reliability devices for long term space missions and military applications by imposing and monitoring additional process quality controls and screening procedures on standard commercial production lines A survey of more than a dozen semiconductor manufacturers indicated that the following reliability areas are not adequately controlled: metallization, wire bonding, loose conductive particles and ceramic packages sealed by low melting point glasses Wide variations were found in the manner in which the bond strength test is carried out Methods were studied to institute SEM inspection and a more rigorous bond strength test on the production lines, coupled with wafer and bonder traceability This report surveys reliability problems caused by defects in semiconductor devices and their control
4 citations
2 citations
5 Apr 1972
TL;DR: In this article, it was shown that burning in and screening at wafer level is a cost effective method of improving the reliability of complex hybrids, and it was also shown that burn-in-and-screening at the chip level can improve the yield by using burned in chips.
Abstract: The complex hybrids being developed today probably will be a critical reliability problem if a better method of screening semiconductors prior to assembly into the hybrid is not developed. This paper outlines an approach that is presently under development which appears to hold a great deal of promise. It allows for an all gold interconnect system, improves the yield by using burned in chips, and makes the semiconductor and interconnect system less dependent on good, hermetic packages. It appears that burning in and screening at wafer level is a cost effective method of improving the reliability of complex hybrids.
2 citations
TL;DR: In this paper, the previous hot spot statistical analysis was extended to a more complete assessment of the reliability of a reactor core against over-temperatures, and a simple procedure allowed the designer to evalu...
Abstract: The previous hot spot statistical analysis was extended to a more complete assessment of the reliability of a reactor core against over-temperatures. A simple procedure allows the designer to evalu...
2 citations
Patent•
20 Dec 1972
TL;DR: An ignition system with improved triggering means for triggering and firing associated spark plugs with better accuracy and reliability is described in this paper, where an ignition system is disclosed having improved triggering and triggering means.
Abstract: An ignition system is disclosed having improved triggering means for triggering and firing associated spark plugs with better accuracy and reliability.
TL;DR: A mathematical model useful as a basis for the computation of circuit drift reliability or yield is developed and an important concepts connected with the notion of drift reliability of electronic circuits are discussed.
TL;DR: One of the most common forms of power in industry is a rotating shaft, commonly driven by a cage induction motor as discussed by the authors, and the demands for lower costs and greater reliability of motors have resulted in the use of new materials, techniques and standards.
Abstract: One of the most common forms of power in industry is a rotating shaft, commonly driven by a cage induction motor. The demands for lower costs and greater reliability of motors have resulted in the use of new materials, techniques and standards
1 Jul 1972
TL;DR: In this article, a summary of approaches that may be taken in designing hybrid microcircuits similar to those for aerospace application is presented. But they do not cover the use of hybrid micro-circuits in the Internet of Things.
Abstract: Document is summary of approaches that may be taken in designing hybrid microcircuits similar to those for aerospace application.
TL;DR: In this paper, a multilayer conductor-insulator technology suitable for semiconductor memories has been developed utilizing materials and fabrication techniques compatible with high density LSI structures, and interactions between failure modes, structure design, and process design are presented.
Abstract: A multilayer conductor-insulator technology suitable for semiconductor memories has been developed utilizing materials and fabrication techniques compatible with high density LSI structures. Interactions between failure modes, structure design, and process design are presented.
TL;DR: Researchers investigate the impact of reduced carbon content on corrosion resistance, reliability, and integrity of cast stainless alloys, finding improved performance in severe service conditions, particularly in minimizing intergranular attack and pitting.
Abstract: The trend in recent years has been to lower and lower carbon contents in corrosion resistant stainless alloys. This trend has developed in response to the more demanding service requirements imposed on these alloys by the chemical process industries in their continuing efforts to increase yields and efficiency and to decrease contamination of product. It is known that lower carbon content improves the general corrosion resistance of stainless alloys and minimizes or eliminates their susceptibility to intergranular attack and pitting.1,2 Lower carbon content is therefore a means of extending the serviceability of these alloys to meet the more severe service conditions being imposed.
15 Sep 1972