Pin grid array

Abstract: A test set socket adapter (20) comprises a substrate (28), a plurality of cantilever beams (32) and a package (30). A bare chip (22) may be inserted into and held by the test socket adapter (20) for insertion into a standard test socket. The cantilevers (32) are designed to deflect and compensate for variations in solder bumps (26) on the bare chip (22). The deflection of the cantilever beams (32) allows a positive contact between the solder bumps (26) and the cantilever beams for an AC and a burn-in test.

Abstract: A patient cable has a duo sensor connector having a first socket section and a second socket section. The first socket section is configured to removably attach a two-wavelength sensor. The second socket section in conjunction with the first socket section is configured to removably attach a multiple wavelength sensor in lieu of the two-wavelength sensor. A circuit housed in the duo sensor connector converts emitter array drive signals adapted for the multiple wavelength sensor into back-to-back emitter drive signals adapted for the two-wavelength sensor when attached.

Abstract: The invention concerns light emitting diode clusters assembly suitable for use in outdoor displays. The cluster on a circuit board is housed in a first socket open to its front and nested in an outer connector socket. Electrical wiring runs from the rear of the first socket via the connector socket to a source of electricity. The connector socket provides weather proofing and protects the circuit board from torque. Moreover, driver circuits of a display board into which the assembly is connected may be shielded from ultraviolet rays. A tubular visor may be provided to the front.

Abstract: Disclosed is a burn-in test socket which serves as a temporary package for integrated circuit die, multichip hybrid or a complete wafer without damaging the bonding pads or insulating passivation on the die during test and burn-in.