Topic
Package testing
About: Package testing is a research topic. Over the lifetime, 49 publications have been published within this topic receiving 389 citations.
Papers
TL;DR: In this article, the authors provide a discussion of the emerging BOT and BIT schemes for embedded high-speed RF/analog/mixed-signal circuits in SOPs.
Abstract: Increasing levels of integration and high speeds of operation have made the problem of testing complex systems-on-packages (SOPs) very difficult. Testing packages with multigigahertz RF and optical components is even more difficult as external tester costs tend to escalate rapidly beyond 3 GHz. The extent of the problem can be gauged by the fact that test cost is approaching almost 40% of the total manufacturing cost of these packages. To alleviate test costs, various solutions relying on built-off test (BOT) and built-in test (BIT) of embedded high-speed components of SOPs have been developed. These migrate some of the external tester functions to the tester load board (BOT) and to the package and the die encapsulated in the package (BIT) in an "intelligent" manner. This paper provides a discussion of the emerging BOT and BIT schemes for embedded high-speed RF/analog/mixed-signal circuits in SOPs. The pros and cons of each scheme are discussed and preliminary available data on case studies are presented.
104 citations
Patent•
28 Feb 2005
TL;DR: In this article, an integrated circuit (IC) package testing apparatus integrates a temperature sensor, heater (or cooler), and controller within a single modular unit, which allows a selected testing temperature to be input by a user via a communications link to the controller.
Abstract: An integrated circuit (IC) package testing apparatus integrates a temperature sensor, heater (or cooler), and controller within a single modular unit. The controller is a microprocessor embedded within the modular unit and in communication with the sensor and heater. The controller allows a selected testing temperature to be input by a user via a communications link to the controller. Each IC package has its testing temperature individually controlled by a controller. The module is easily attached and removed from an open-top socket through the use of latches on the testing socket. Many IC packages can be quickly placed and removed from testing sockets when a matrix of sensors and heaters (or coolers) are located on a single top attach plate with the sensors and heaters (or coolers) individually spring-loaded on the single top attach plate.
42 citations
Book•
1 Jan 1972
TL;DR: In this article, the authors discuss the origins of packaging development, the relationship of packaging to marketing, and the role of marketing in the development of the future of the packaging industry, as well as a marketing case history: Doy-N-Pack vs BrikPak.
Abstract: 1 Origins of Packaging Development.- The Industrial Revolution.- The Birth of Packaging Development.- National and International Recognition.- 2 Package Development: An Overview.- Interrelationships.- Developmental Paths.- 3 Packaging Materials.- Ceramics.- Metals.- Plant Products.- Plastics.- ABS.- 4 Package Forms.- Rigid and Semirigid Package Forms.- Flexible Package Forms.- Converting of Flexible Packaging Materials.- 5 Materials and Package Testing.- Quality Testing of Packaging Materials.- Identification of Unknown Packaging Materials.- Quality Testing of Fabricated Packages.- Product-Package Compatibility Testing.- Shipping and Abuse Testing.- 6 The Packaging Process: Testing a Segment of Manufacturing Operations.- The Manufacturing Process.- The Packaging Process.- Development of Equipment.- 7 Packaging Equipment.- Can Packaging Equipment.- Glass Packaging Equipment.- Other Primary Packages.- Paperboard Cartons.- Equipment for Flexible Packaging.- Thermoformed Packages.- 8 The Relationship of Packaging to Marketing.- Product Life Cycle.- Pricing Policy.- Distribution Policy.- Market Research.- Product-Package Promotion.- A Marketing Case History: Doy-N-Pack vs. BrikPak.- Package Styling and Design.- 9 Governmental Regulations Affecting Packaging.- Federal Food, Drug, and Cosmetic Act-1938.- The 1958 Food Additives Amendment to the Food, Drug, and Cosmetic Act.- Food Additive Definition.- New Amendment to Food Additive Legislation (1983).- Manufacturing Regulations.- Future Activity.- The FDA and Drugs.- The Color Additive Amendment.- The "Fair Packaging and Labeling" Bill.- Other Governmental Regulations.- FDA versus USDA.- Freight Regulations.- 10 Strategic Planning in Packaging.- Text.- 11 Technological Forecasting.- Technology.- Why Plan?.- Why Forecast?.- What Is Technology?.- Why Is Forecasting Possible?.- Origins of Technological Forecasting.- What Is Technological Forecasting.- Objective of the Forecast.- Qualifications of the Person or Institution Making the Statement about the Future.- Methodologies Used to Provide a Picture of the Future.- Interactions External to Technology.- Process of Technological Innovation.- Intuitive Forecasting.- Trend Extrapolation.- Monitoring.- Structural Analysis.- Modeling.- Cross-Impact Analysis.- Scenario Generation.- Conclusion.
39 citations
1 Dec 2006
TL;DR: In this paper, the authors describe their findings regarding LED package testing with a focus on die attach quality testing, necessary short measurement times only, and requirements against the physical testing and the further processing are shown based on their experimental findings.
Abstract: The qualification of the die attach of light emitting diodes (LED) is a very important element of predicting the reliability of the package, as the temperature of the chip is strongly affected by the quality of the die attach. LED manufacturers are seeking for solutions to be able to test die attach quality in mass production. This paper describes our findings regarding LED package testing with a focus on die attach quality testing, necessary short measurement times only. Requirements against the physical testing and the further processing are shown based on our experimental findings.
34 citations
Patent•
27 Apr 2004
TL;DR: The planarity of external terminals or a ball grid array on a device package can be improved through use of test probes that flatten the electrical terminals while forming the electrical contacts for package testing as discussed by the authors.
Abstract: The planarity of external terminals or a ball grid array on a device package can be improved through use of test probes that flatten the electrical terminals while forming the electrical contacts for package testing. After testing, the package has external terminals with improved planarity that improves the electrical connections formed during assembly of a system containing the package.
20 citations
Related Topics (5)
Performance Metrics
| Year | Papers |
|---|---|
| 2020 | 1 |
| 2019 | 2 |
| 2018 | 6 |
| 2016 | 1 |
| 2015 | 1 |
| 2013 | 1 |