Showing papers on "Multi-chip module published in 2015"
Patent•
11 Sep 2015TL;DR: In this paper, a programmable integrated circuit (IC) includes external contacts configured to interface with a substrate and a plurality of configurable logic elements (CLEs) distributed across programmable fabric.
Abstract: In an example, a programmable integrated circuit (IC) includes external contacts configured to interface with a substrate and a plurality of configurable logic elements (CLEs) distributed across a programmable fabric. The programmable IC further includes interconnect circuits disposed between the plurality of CLEs and the external contacts. A plurality of the interconnect circuits is disposed in the plurality of CLEs.
8 citations
IBM1
TL;DR: In this paper, IBM Research and NTK Technologies have explored the development of an organic multi-chip module (MCM) solution, with the goal of developing innovative technologies that address the requirements of high performance systems.
Abstract: In this work, IBM Research and NTK Technologies have explored the development of an organic Multi-Chip Module (MCM) solution, with the goal of developing innovative technologies that address the requirements of high performance systems. A 90 × 90 mm organic MCM was designed, fabricated, and assembled with dual side mountable 24 × 28 mm thermal test chips mounted on chip-scale interposers to enable functional screening and rework process. The work demonstrated that a large scale organic MCM was compatible with LGA sockets with over 6000 contacts.
7 citations
28 Dec 2015
TL;DR: In this paper, the authors present results of the Multi-Chip Module-Deposited technology built with thin film processes over a substrate of alumina and oxidized silicon that was used to micro-fabricate passive components (capacitors, resistors, inductors).
Abstract: This work presents results of the Multi-Chip Module-Deposited technology built with thin film processes over a substrate of alumina and oxidized silicon that was used to micro-fabricate passive components (capacitors, resistors, inductors). Metal layers were deposited by sputtering, electrolytic and electroless techniques and benzocyclobutene was used as dielectric. Electrical characteristics of passive components and filters were evaluated indicating that the testchip and processes were effective to manufacture the devices.
4 citations
Patent•
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TL;DR: In this article, a multi-chip module consisting of a substrate, a semiconductor chip, and an optical transceiver is presented, where the substrate has a first side and a second side opposite the first side.
Abstract: One example of a multi-chip module includes a substrate, a semiconductor chip, and an optical transceiver. The substrate has a first side and a second side opposite the first side. The semiconductor chip is electrically coupled to the first side of the substrate. The optical transceiver is electrically coupled to the second side of the substrate.
3 citations
11 Dec 2015
1 citations
Dissertation•
9 Dec 2015
1 citations
Patent•
12 Nov 2015
TL;DR: In this article, the authors propose a chip consisting of a plurality of unit cells, a scan circuit which scans the unit cells to output signals from the plurality of units, a voltage/current conversion circuit, a current/voltage conversion circuit and an output terminal and an input terminal.
Abstract: PROBLEM TO BE SOLVED: To reduce noise caused by charging/discharging a parasitic capacitor of wiring that connects chips with each other.SOLUTION: A chip includes: a plurality of unit cells; a scan circuit which scans the plurality of unit cells to output signals from the plurality of unit cells; a voltage/current conversion circuit, a current/voltage conversion circuit, an output terminal and an input terminal. The voltage/current conversion circuit converts a voltage signal outputted from the scan circuit into a current signal and outputs the current signal from the output terminal. The current/voltage conversion circuit converts a current signal inputted to the input terminal into a voltage signal. The scan circuit starts scanning in response to the voltage signal outputted from the current/voltage conversion circuit.
1 Aug 2015
TL;DR: In this paper, the authors demonstrate the substrate design considerations of a 3-dimensional (3-D) microwave multi-chip module (MCM), which is a dual-band microwave front-end working at Ka-band and K-band (Receive).
Abstract: This paper demonstrates the substrate design considerations of a 3-dimensional (3-D) microwave (MW) multi-chip module (MCM). This module is a dual-band microwave front-end working at Ka-band (Transmit) and K-band (Receive). Three organic substrates are stacked up via ball grid array (BGA), combining a transceiver module with both frequency band antennas integrated. Substrate design needs considerations of multiple aspects. As for active chips, selection and placement of MMICs, bond wire design, Electromagnetic (EM) isolation and thermal management of high power MMICs are of great importance. As for passive components patterned on the substrates, band pass filter, DC-AC block and antennas are main devices need to be simulated and optimized.