Showing papers on "Multi-chip module published in 1990"
Patent•
29 Oct 1990TL;DR: In this paper, a cooling structure for cooling a multi-chip module by a heat sink is described, in which the heat sink, the module cap and the wiring board are clamped as one body by a clamp member, and a heat-sink pushing member is attached to the clamp members.
Abstract: A cooling structure for cooling a multi-chip module by a heat sink is disclosed in which the heat sink is disposed above the multi-chip module in a state that heat-conductive grease is sandwiched between the heat sink and the module cap of the multi-chip module, and the heat sink, the module cap and the wiring board of the multi-chip module are clamped as one body by clamp member, and in which a heat-sink pushing member for pressing the heat sink against the module cap by a constant force is attached to the clamp members.
48 citations
Patent•
30 Nov 1990TL;DR: In this article, a multi-chip consists of a semiconductor substrate and disc, while the conductive tracks and terminal contacts are of aluminium or copper, and metal connecting fins are typically fitted to the contact strips, protruding beyond the multichannel module.
Abstract: The multi-chip consists of a semiconductor susbtrate, on which is deposited at least one chip. The latter contacting is carried out by at least one wiring plane on the substrate with corresp. conducting track. In each wiring plane are brought out laterally several contact strips, pref. as plug contacts. Metal connecting fins are typically fitted to the contact strips, protruding beyond the multi-chip module. On the latter surface may be deposited another semiconductor disc, contg. heat sinks for the corresp. chips. The semiconductor substrate and disc are made of silicon, while the conductive tracks and terminal contacts are of aluminium or copper. USE/ADVANTAGE - For integrated circuit coupling techniques. Reliable and mechanically stable terminal contacts and extra heat disposal.