Topic
Microetching
About: Microetching is a research topic. Over the lifetime, 126 publications have been published within this topic receiving 1083 citations.
Papers published on a yearly basis
Papers
TL;DR: Scanning electronic microscopy analysis revealed that diamond roughening and microetching produced only a surface-peeling pattern, whereas hydrofluoric acid conditioning produced an extensive in-depth penetrating pattern.
126 citations
Patent•
27 Jan 1997
TL;DR: A microetching composition for copper or copper alloys is proposed in this paper, which consists of an oxidizing agent which can oxidize the copper and copper alloy, a polymer compound which contains polyamine chains or a cationic group or both in the amount of 0.000001 to 1.0% by weight, and water.
Abstract: A microetching composition for copper or copper alloys comprising, (a) an oxidizing agent which can oxidize the copper or copper alloy, (b) a polymer compound which contains polyamine chains or a cationic group or both in the amount of 0.000001 to 1.0% by weight, and (c) water. The composition can produce surfaces of copper or copper alloy exhibiting excellent adhesion to resins such as prepregs and resists, and superior solderability. The composition can be adaptable to the manufacture of printed wiring boards with highly integrated fine line patterns.
55 citations
Patent•
7 Jul 1998
TL;DR: In this paper, a polymer compd. having polyamine chains and cation groups is added by 0.00001-1.0% to a microetching agent for copper and copper alloys comprising a soln. containing an oxidizing agent.
Abstract: PROBLEM TO BE SOLVED: To etch the surface of copper to form deep recesses so that the surface has excellent adhesion property to a solder resist and the like by incorporating a minute amt. of a polymer compd. having polyamine chains and cation groups into a microetching agent for copper. SOLUTION: A polymer compd. having polyamine chains and cation groups is added by 0.00001-1.0wt.% to a microetching agent for copper and copper alloys comprising a soln. containing an oxidizing agent for copper. As for the polymer compd. a polyethylene imine and a polyalkylene polyamine are preferable. Since deep recesses are formed on the surface of copper or copper alloys treated with this microetching agent, the surface has good adhesion property to a resin such as prepreg, solder resist and dry film resist. Moreover, the surface of copper treated has excellent soldering property.
50 citations
TL;DR: This study shows that both Ideal 1 and Right-On are suitable for bonding ceramic brackets to porcelain restorations, if the Porcelain has been conditioned with hydrofluoric acid.
48 citations
TL;DR: Within each bracket type no significant differences were found between mean bond strengths for new, new etched, anddebonded etched conditions, a finding that supports the use of microetching to clean accidentally debonded brackets.
46 citations
Related Topics (5)
Performance Metrics
| Year | Papers |
|---|---|
| 2020 | 6 |
| 2019 | 4 |
| 2018 | 5 |
| 2017 | 7 |
| 2016 | 6 |
| 2015 | 8 |