Topic
Lead (electronics)
About: Lead (electronics) is a research topic. Over the lifetime, 167 publications have been published within this topic receiving 2300 citations. The topic is also known as: electronic lead & electrical lead.
Papers published on a yearly basis
Papers
Patent•
29 Apr 1994
TL;DR: In this paper, a thermoelectric generator is used to convert the heat generated by a semiconductor integrated circuit into electrical energy, which is then used to drive a fan or other airflow generating device.
Abstract: An apparatus and method for recovering power dissipated by a semiconductor integrated circuit includes a thermoelectric generator which converts the heat generated by the integrated circuit into electrical energy. The electrical energy is used to drive a fan or other airflow generating device to cause heated air to be moved away from the integrated circuit and cooler air to be drawn to the integrated circuit to absorb further heat from the integrated circuit. In the described embodiment, the thermoelectric generator is a Peltier cooler positioned between the integrated circuit and a heatsink. The Peltier cooler is operated in the Seebeck mode to generate power in response to the temperature differential between the integrated circuit and the heatsink. The fan is positioned proximate to the heatsink to cause air flow over the heatsink thereby reducing the temperature of the heatsink and thus reducing the temperature of the integrated circuit by causing more heat to be transferred from the integrated circuit to the heatsink.
171 citations
Patent•
23 Aug 1996
TL;DR: In this article, a plurality of leads, where each lead comprises a first connection lead and a second connection lead with upper and lower surfaces, is used to increase memory capacity and improved heat emission effect.
Abstract: An improved package is thinner with increased memory capacity and improved heat emission effect. The package includes a plurality of leads, where each lead comprises a first connection lead and a second connection lead with upper and lower surfaces. An integrated chip, such as a semiconductor chip, is attached to a portion of the upper surface of the first connection lead. The chip and leads are molded such that the lower surface of the first connection leads and upper surface of the second connection leads are exposed.
153 citations
Patent•
22 Nov 2002TL;DR: In this article, a heat sink is positioned at least partially within the package body so a surface of a first portion of the heat sink faces the lead frame in close proximity to a substantial part, such as at least eighty percent, of the area of the enclosed portion of a lead frame to reduce an inductance associated with each of the leads.
Abstract: An integrated circuit package includes a package body, such as a transfer molded plastic or preformed ceramic package body, having an integrated circuit die positioned therein. A lead frame, such as a peripheral lead, Leads-Over-Chip (LOC), or Leads-Under-Chip (LUC) lead frame, includes a plurality of leads with portions enclosed within the package body that electrically connect to the integrated circuit die. A heat sink is positioned at least partially within the package body so a surface of a first portion of the heat sink faces the lead frame in close proximity to a substantial part, such as at least eighty percent, of the area of the enclosed portion of the lead frame to thereby substantially reduce an inductance associated with each of the leads.
126 citations
Patent•
27 Jul 1994TL;DR: In this paper, a thin and flat integrated circuit assembly is achieved by using a thin carrier with shallow cavities for holding the integrated circuits and/or discrete circuit components, and the circuit assembly may then be accommodated into a credit card-sized packaging with standard dimensions.
Abstract: A thin and flat integrated circuit assembly (10, 40) may be achieved by using a thin carrier (20) with shallow cavities (22, 24) for holding the integrated circuits (16) and/or discrete circuit components (14). The integrated circuits (16) and/or circuit components (14) may be friction fitted in the cavities (22, 24) or they may be secured therein by the use of adhesives and/or solder. Electrical connection between the integrated circuits (16) and circuit components (14) may be done with wire bonding, ribbon bonding, tape-automated bonding, lead frames, flip chip bonding, and/or conductive gluing of leads. The circuit assembly may then be accommodated into a credit card-sized packaging with standard dimensions set by the International Standards Organization.
120 citations
Patent•
19 Jul 2001TL;DR: In this article, a clamping system coupled with a heatsink is proposed to decouple the clamping forces in an electrical circuit assembly coupled to a heat sink to ensure intimate contact between the chip and the heatsink to facilitate chip cooling.
Abstract: A clamping system decouples the clamping forces in an electrical circuit assembly coupled to a heatsink. A heatsink clamping assembly applies controllable and predictable force on the electrical circuit assembly including an integrated circuit device (“chip”). The applied force is controlled to effectively ensure intimate contact between the chip and the heatsink to facilitate efficient chip cooling. The force applied to the chip is decoupled from the much higher force required to clamp the electrical interposer interconnect structure between the electrical circuit assembly and the printed circuit board.
87 citations
Related Topics (5)
Performance Metrics
| Year | Papers |
|---|---|
| 2020 | 1 |
| 2019 | 2 |
| 2018 | 3 |
| 2017 | 2 |
| 2016 | 1 |
| 2015 | 8 |