Topic
Lamination
About: Lamination is a research topic. Over the lifetime, 4133 publications have been published within this topic receiving 21207 citations. The topic is also known as: laminating.
Papers published on a yearly basis
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Papers
TL;DR: In this article, the fabrication of three-dimensional (3D) microfluidic networks entirely made of SU-8 with integrated electrodes is reported. But unlike other reported methods, transferred layers are patterned following the bonding step allowing a more accurate and simple alignment between levels than techniques using already patterned layers.
Abstract: The fabrication of three-dimensional (3D) microfluidic networks entirely made of SU-8 with integrated electrodes is reported. The described technology allows the fabrication of uncrosslinked SU-8 dry film on a polyester (PET) sheet and its subsequent lamination to form closed microstructures. Unlike other reported methods, transferred layers are patterned following the bonding step allowing a more accurate and simple alignment between levels than techniques using already patterned layers. Dry release of the complete polymer microstructure was demonstrated. Flexible microfluidic chips were obtained. This technique uses simple tools and no wafer bonder is used but lamination techniques which are more collective processes. Limitations in the method for layers thicker than 50 µm have been observed and are discussed. Hydraulic flow experiments have been performed to study the deformation of the cover layer which could influence adjacent flow in a three-dimensional configuration. Important deformations have been observed for layers 10 µm thick and an average pressure greater than 100 kPa. No deformations have been noted for layers with thicknesses greater than 35 µm and for average pressures up to 200 kPa. No failures occurred within the range of the experimental set-up, i.e. up to 300 kPa.
196 citations
Patent•
16 Jul 2002
TL;DR: In this paper, the authors proposed a peeling method which gives no damage to the peeled layers, and provided a semiconductor device which is made lightweight by sticking peeled layers on various base material, and its manufacturing method.
Abstract: PROBLEM TO BE SOLVED: To peel not only a peeled layer with small area, but also a peeled layer with large area over the entire surface in good yield by providing a peeling method which gives no damage to the peeled layers, to provide a semiconductor device which is made lightweight by sticking the peeled layers on various base material, and its manufacturing method, and to provide a semiconductor device which is made lightweight by sticking various elements (a thin-film diode, and a photoelectric converting element and silicon resistance element composed of PIN junctions of silicon) represented by a TFT, specially, on flexible film, and its manufacturing method. SOLUTION: A metal layer or nitride layer 11 is provided on a substrate, an oxide layer 12 is provided in contact with the metal layer or nitride layer 11. Even after lamination film formation or a heat treatment of ≥500°C is carried out, fine separation in the oxide layer 12 or on its interface can easily be carried out by a physical means. COPYRIGHT: (C)2003,JPO
168 citations
Patent•
8 May 2003TL;DR: In this article, the SOI (Silicon On Insulator) substrate is provided with: a support substrate, a single crystal silicon layer above one surface of the support substrate; an insulation portion comprising a single layer of an insulation film or a lamination structure of a plurality of insulation films.
Abstract: An SOI (Silicon On Insulator) substrate is provided with: a support substrate ( 201 ); a single crystal silicon layer ( 202 ) disposed above one surface of the support substrate; an insulation portion ( 205 ) disposed between the support substrate and the single crystal silicon layer, the insulation portion comprising a single layer of an insulation film or a lamination structure of a plurality of insulation films, and including a silicon nitride film or a silicon nitride oxide film ( 204 ).
164 citations
TL;DR: In this article, the significance of advanced magnetic materials for lamination, nano-material based conducting materials, and high energy product permanent magnets (PMs) is discussed in detail and a case study has been presented with a 5 kW PM synchronous machine in order to understand the advantages of the discussed materials.
Abstract: The growth of electric and hybrid electric vehicles has drawn more attention toward the development of high power density electrical machines. The materials used in the fabrication of electrical machines play a crucial role in enhancing their power density. In this paper, the significance of advanced magnetic materials for lamination, nano-material based conducting materials, and high energy product permanent magnets (PMs) is discussed in detail. Finally, a case study has been presented with a 5 kW PM synchronous machine in order to understand the advantages of the discussed materials.
163 citations
TL;DR: In this paper, six types of hybrid composite were designed by lamination pairing of carbon/aramid fabric and carbon/glass fabric using VARTM and the dependence of the mechanical properties of the samples on the pairing effects of the lamination structures was investigated.
Abstract: Many attempts have been made to fabricate lightweight, high-performance, and low-cost polymeric composites. To improve the mechanical performance of the same material compared to conventional composites, paired hybrid materials were manufactured with different lamination structures. Each of six types of hybrid composite was designed by lamination pairing of carbon/aramid fabric and carbon/glass fabric using VARTM. The dependence of the mechanical properties of the samples on the pairing effects of the lamination structures was investigated. All pairing materials did not lead to a large increase of tensile strength due to the domination of carbon fiber, but the mechanical properties of specific laminates were clearly changed by the particular pairing sequence used. Using the limited material, the design of an effective structure was the central laminating condition with a good tensile and bending properties. Laminating position of the carbon fiber was found to play an important role in the stacking design of hybrid composites.
136 citations
Related Topics (5)
Performance Metrics
| Year | Papers |
|---|---|
| 2026 | 1 |
| 2025 | 83 |
| 2024 | 89 |
| 2023 | 192 |
| 2022 | 355 |
| 2021 | 63 |