TL;DR: In this article, the effect of processing temperature on the cure kinetics and interdiffusion kinetics of co-bonded acrylonitrile butadiene styrene thermoplastic to unsaturated polyester thermoset is studied experimentally.
Abstract: Co-bonding is an effective joining method for fiber-reinforced composites in which a prefabricated part bonds with a thermoset resin during the curing process. Manufacturing of co-bonded thermoset-thermoplastic hybrid composites is a challenging task due to the complexities of the interdiffusion of reactive thermoset resin and thermoplastic polymer at the interface between two plies. Herein, the interphase properties of co-bonded acrylonitrile butadiene styrene thermoplastic to unsaturated polyester thermoset are investigated for different processing conditions. The effect of processing temperature on the cure kinetics and interdiffusion kinetics are studied experimentally. The interphase thickness and microstructure are linked to the chemo-rheological properties of the materials. The interdiffusion mechanisms are explored and models are developed to predict the interphase thickness and microstructure for various process conditions. The temperature-dependent diffusivities were estimated by incorporating an inverse diffusion model. The mechanical response of interphases was analyzed by the Vickers microhardness test and was correlated to the processing condition and microstructure. It was observed that processing temperature has significant effect on the interdiffusion process and, consequently, on the interphase thickness, its microstructure and mechanical performance.
TL;DR: In this paper, the interphase interaction at indium phosphide contacts with layers of metals of group I (Cu, Ag, Au) annealed in an atmosphere of oxygen is investigated using the method of Rutherford backscattering, x-ray structure analysis, and electrophysical measurements.
Abstract: The interphase interaction at indium phosphide contacts with layers of metals of group I (Cu, Ag, Au) annealed in an atmosphere of oxygen is investigated using the method of Rutherford backscattering, x-ray structure analysis, and electrophysical measurements. The relation between the character of the interphase process and the behavior of the electrophysical parameters of the Schottky barriers is traced. The mechanism of degradation in the contacts mentioned is discussed.