TL;DR: In this paper, a planar platform is developed in which the microstrip line and rectangular waveguide are fully integrated on the same substrate, and they are interconnected via a simple taper.
Abstract: Usually transitions from microstrip line to rectangular waveguide are made with three-dimensional complex mounting structures. In this paper, a new planar platform is developed in which the microstrip line and rectangular waveguide are fully integrated on the same substrate, and they are interconnected via a simple taper. Our experiments at 28 GHz show that an effective bandwidth of 12% at 20 dB return loss is obtained with an in-band insertion loss better than 0.3 dB. The new transition allows a complete integration of waveguide components on substrate with MICs and MMICs.
TL;DR: In this paper, a new class of long-period fiber gratings that can be used as in-fiber, low-loss, band-rejection filters is presented.
Abstract: We present a new class of long-period fiber gratings that can be used as in-fiber, low-loss, band-rejection filters. Photoinduced periodic structures written in the core of standard communication-grade fibers couple light from the fundamental guided mode to forward propagating cladding modes and act as spectrally selective loss elements with insertion losses act as backreflections <-80 dB, polarization-mode-dispersions <0.01 ps and polarization-dependent-losses <0.02 dB.
TL;DR: In this paper, the trade-offs between resonantly enhanced group delay, device size, insertion loss and operational bandwidth are analyzed for various delay-line designs, and a large fractional group delay exceeding 10 bits is achieved for bit rates as high as 20 Gbps.
Abstract: On-chip optical buffers based on waveguide delay lines might have significant implications for the development of optical interconnects in computer systems. Silicon-on-insulator (SOI) submicrometre photonic wire waveguides are used, because they can provide strong light confinement at the diffraction limit, allowing dramatic scaling of device size. Here we report on-chip optical delay lines based on such waveguides that consist of up to 100 microring resonators cascaded in either coupled-resonator or all-pass filter (APF) configurations. On-chip group delays exceeding 500 ps are demonstrated in a device with a footprint below 0.09 mm2. The trade-offs between resonantly enhanced group delay, device size, insertion loss and operational bandwidth are analysed for various delay-line designs. A large fractional group delay exceeding 10 bits is achieved for bit rates as high as 20 Gbps. Measurements of system-level metrics as bit error rates for different bit rates demonstrate error-free operation up to 5 Gbps.
TL;DR: In this article, the authors present new concepts that allow for the complete integration of planar circuits and waveguide filters synthesized on a single substrate by means of metallized post (or via-hole) arrays.
Abstract: The integrated planar technique has been considered as a reliable candidate for low-cost mass production of millimeter-wave circuits and systems. This paper presents new concepts that allow for a complete integration of planar circuits and waveguide filters synthesized on a single substrate by means of metallized post (or via-hole) arrays. Analysis of the synthesized integrated waveguide and design criteria are presented for the post pitch and diameter. A filter design method derived from a synthesis technique using inductive post is presented. An experimental three-pole Chebyshev filter having 1-dB insertion loss and return loss better than 17 dB is demonstrated. Integrating such planar and nonplanar circuits on a substrate can significantly reduce size, weight, and cost, and greatly enhance manufacturing repeatability and reliability.
TL;DR: In this paper, the authors demonstrate a Mach-Zehnder modulator with high linearity, high bandwidth, and low manufacturing cost on a silicon and lithium niobate hybrid integration platform.
Abstract: Optical modulators are at the heart of optical communication links. Ideally, they should feature low loss, low drive voltage, large bandwidth, high linearity, compact footprint and low manufacturing cost. Unfortunately, these criteria have been achieved only on separate occasions. Based on a silicon and lithium niobate hybrid integration platform, we demonstrate Mach–Zehnder modulators that simultaneously fulfil these criteria. The presented device exhibits an insertion loss of 2.5 dB, voltage–length product of 2.2 V cm in single-drive push–pull operation, high linearity, electro-optic bandwidth of at least 70 GHz and modulation rates up to 112 Gbit s−1. The high-performance modulator is realized by seamless integration of a high-contrast waveguide based on lithium niobate—a popular modulator material—with compact, low-loss silicon circuitry. The hybrid platform demonstrated here allows for the combination of ‘best-in-breed’ active and passive components, opening up new avenues for future high-speed, energy-efficient and cost-effective optical communication networks. Low-loss, high-speed and efficient optical modulators on a silicon platform are demonstrated.