Topic
Flying probe
About: Flying probe is a research topic. Over the lifetime, 252 publications have been published within this topic receiving 2113 citations.
Papers published on a yearly basis
Papers
Patent•
4 Dec 2007
TL;DR: In this paper, integrated circuit probe card assemblies are disclosed, which extend the mechanical compliance of both MEMS and thin-film fabricated probes, such that these types of spring probe structures can be used to test one or more integrated circuits on a semiconductor wafer.
Abstract: Several embodiments of integrated circuit probe card assemblies are disclosed, which extend the mechanical compliance of both MEMS and thin-film fabricated probes, such that these types of spring probe structures can be used to test one or more integrated circuits on a semiconductor wafer. Several embodiments of probe card assemblies, which provide tight signal pad pitch compliance and/or enable high levels of parallel testing in commercial wafer probing equipment, are disclosed. In some preferred embodiments, the probe card assembly structures include separable standard components, which reduce assembly manufacturing cost and manufacturing time. These structures and assemblies enable high speed testing in wafer form. The probes also have built in mechanical protection for both the integrated circuits and the MEMS or thin film fabricated spring tips and probe layout structures on substrates. Interleaved spring probe tip designs are defined which allow multiple probe contacts on very small integrated circuit pads. The shapes of probe tips are preferably defined to control the depth of probe tip penetration between a probe spring and a pad or trace on an integrated circuit device. Improved protective coating techniques for spring probes are also disclosed, offering increased reliability and extended useful service lives for probe card assemblies.
188 citations
Patent•
4 Jun 2010TL;DR: In this paper, the authors describe the use of cowlings to improve device aesthetics and bumpers to protect flex circuits that are routed over the printed circuit boards from being damaged.
Abstract: Electronic devices may be provided that include mechanical and electronic components Connectors may be used to interconnect printed circuits and devices mounted to printed circuits Printed circuits may include rigid printed circuit boards and flexible printed circuit boards Cosmetic structures such as cowlings may be used to improve device aesthetics Bumpers may be mounted over rough edges of printed circuit boards to protect flex circuits that are routed over the printed circuit boards Fasteners may be soldered to solder pad structures on printed circuit boards
83 citations
Patent•
4 Nov 2004
TL;DR: In this article, a method for the testing of circuit boards, together with a test probe for this apparatus and this method, in which the contact tips of a test finger of a finger tester are monitored during the testing process by an optical detection device and their movement, at least when approaching a part of the circuit board test points of a circuit board to be tested, is corrected on the basis of the result determined by the optical detection devices in such a way that the contact tip makes reliable contact with the test point concerned.
Abstract: An apparatus and a method for the testing of circuit boards, together with a test probe for this apparatus and this method, in which the contact tips of a test finger of a finger tester are monitored during the testing process by an optical detection device and their movement, at least when approaching a part of the circuit board test points of a circuit board to be tested, is corrected on the basis of the result determined by the optical detection device in such a way that the contact tip makes reliable contact with the circuit board test point concerned. The correction data hereby obtained may be used in the calculation of calibration data.
82 citations
ADAS1
TL;DR: The authors address the problem of generating minimum test sets for diagnosing faults in wiring interconnects on printed circuit boards with a fault model that includes multiple stuck-at and short faults.
Abstract: The authors address the problem of generating minimum test sets for diagnosing faults in wiring interconnects on printed circuit boards. It is assumed that all the nets can be accessed in parallel or through a boundary-scan chain on the board. The fault model includes multiple stuck-at and short faults. Three methods for three different diagnosis mechanisms are presented. It is also pointed out that the self-diagnosis problem is the same as the concurrent error detection problem for asymmetric errors. Thus, the diagnostic methods considered are similar to the coding methods used in concurrent error detection. All the diagnostic methods can be extended to structural tests by taking advantage of the geometry of a circuit board to produce an efficient test. >
77 citations
TL;DR: The invention provides automatic test generation, including means for learning the characteristics of known good components and boards, and provides expert system programming for recording and analyzing test results data and for using this data to generate faster tests.
68 citations
Related Topics (5)
Performance Metrics
| Year | Papers |
|---|---|
| 2020 | 8 |
| 2019 | 12 |
| 2018 | 13 |
| 2017 | 13 |
| 2016 | 10 |
| 2015 | 10 |