Topic
Flatpack
About: Flatpack is a research topic. Over the lifetime, 26 publications have been published within this topic receiving 497 citations.
Papers
TL;DR: Since sperm motility patterns have been reported to be correlated with fertility both in vitro and in vivo it is speculated that the use of the FlatPack might improve the results when using frozen-thawed boar spermatozoa for artificial insemination.
135 citations
TL;DR: The present results suggest that this freezing protocol and FlatPack container maintains high sperm viability post-thaw and the fertility levels when inseminated at overseas nucleus herds seem to be similar to those achieved with (NM/AI breedings) at the same farms.
111 citations
TL;DR: Results indicate that boar spermatozoa can be successfully frozen when concentrated in a small volume, and inter-boar variation was present, albeit only significant for MS (sperm motility) and SFP (PMI).
75 citations
Patent•
1 Apr 1971
TL;DR: A printed circuit board for mounting integrated circuit and resistor network packages commonly referred to as flatpack components and a process for fabricating the circuit board is described in this article, where a conductive pattern of electrical connection pads for connecting to electrical leads from flatpack component and electrical conductors for connecting the pads to circuitry external to the board.
Abstract: A printed circuit board for mounting integrated circuit and resistor network packages commonly referred to as flatpack components and a process for fabricating the circuit board. The printed circuit board has a conductive pattern of electrical connection pads for connecting to electrical leads from flatpack components and electrical conductors for connecting the pads to circuitry external to the board. A channel for receiving and aligning each electrical lead from a flatpack component is formed by printed circuit techniques. The surface layer of each channel is formed of solder which simplifies the process of electrically connecting flatpack leads and reduces errors occuring in the soldering process.
35 citations
Patent•
28 Jan 1971
TL;DR: In this paper, a flatpack carrier for encapsulating a component and a socket for receiving the carrier is presented, and a plurality of electrical connectors are inserted into the flatpack to complete electrical circuit connections.
Abstract: A package for electrical components comprising a carrier for encapsulating the component and a socket for receiving the carrier. The carrier is in the form of a leadless circular flatpack. The socket is an annular receptacle dimensioned for accepting the carrier therein and includes a plurality of electrical connectors which engage deposited conductive patterns on the flatpack carrier to complete electrical circuit connections.
25 citations
Related Topics (5)
Performance Metrics
| Year | Papers |
|---|---|
| 2019 | 1 |
| 2015 | 1 |
| 2014 | 1 |
| 2007 | 1 |
| 2005 | 1 |
| 2002 | 1 |