Electrostatic-sensitive device

Abstract: The evolution in semiconductor and electronic packaging to fulfill mobility and miniaturization has drastically changed the nature of electronic industry. Electronic component are continuing to get more sensitive to EOS (electrical overstress) due to electrostatic Sensitivity, Although HBM (Human Body Model) for Electrostatic sensitive device (ESD) has not changed for the last two decades. In this article, the CDM (Charged Device Model) which is used in semiconductor device ESD sensitivity test will be explained for a potential situation where a semiconductor device is charged to a high voltage then discharged to a grounded surface. From the failure analysis data collected from the field in the past several years, it is clear that the number of failure caused by ESD has been increasing due to component electrostatic as sensitivity as 100V of CDM. It is perilous to find out the possible ESD source and risk in PCBA/SYS assembly process and make the corresponding remedy before the electronic board is build in the line. This article will give the general guideline to make this extended ESD control, and a working model will be developed to organize the mitigation plan and measures to be taken.

Abstract: Electrostatic discharge-sensitive devices (ESDS) consist of electronic systems that are easily damaged by electrostatic fields or discharges. To safely stow and transit the ESDS, Bosch Car Multimed...

Abstract: In the process of production, transportation and assembly, cable assemblies can get a lot of electrostatic charge by friction, dragging, pulling and induction. These residual charges can be discharged when Electrostatic sensitive device connected with it and can cause the complete failure or potential failure of the electrostatic sensitive product. In this paper, the theoretical model of cable assemblies is established by analyzing the characteristics of cable assemblies, and the equivalent RF circuit is designed. The static discharge characteristics of the cable are analyzed and verified by simulation.

Abstract: A wearable device (20) with an electrostatic protection function, comprising: a housing structure (201), an electrostatic sensitive functional chip (202) and a substrate (203) configured to fix the functional chip, spacing between the housing structure (201) and the functional chip (202) being smaller than a pre-set distance, wherein a dielectric constant corresponding to a dielectric medium of an electrostatic sensitive part of the functional chip (202) is higher than that of air. By changing a medium of an electrostatic sensitive part of an electrostatic sensitive device in the wearable device, the aim of reducing the intensity of an electrostatic field is achieved, such that electrostatic protection can be carried out on a functional chip in the wearable device, thickening of the wearable device is also avoided, and current increasing demands for miniaturization of the wearable device are met.