Abstract: An extension of the op-amp concept featuring two differential inputs is presented. In a closed-loop environment this circuit forces two floating voltages to the same value, and thus has many interesting applications in the analog circuit domain. A description of such a circuit, its nonidealities, and restrictions are given. A monolithic integration of this differential difference amplifier is implemented in a double-poly CMOS technology, its measured characteristics are described. Many applications of this circuit, including a voltage comparator with floating inputs, a voltage inverter without resistors, and an instrumentation amplifier with only two external gain determining resistors, are discussed.

Abstract: The examined class of circuits includes voltage multipliers, current multipliers, linear V-I convertors, linear I-V convertors, current squaring circuits, and current divider circuits. Typical for these circuits is an independent control of the sum as well as the difference between two gate-source voltages. As direct use is made of the basic device characteristics, only a small number of transistors is required in the presented circuits.

Abstract: A modular trim panel unit for the manufacturing and assembling of doors for motor vehicles, with the preassembly of the interior trim panel for the door including one or more basic mechanical and/or electrical components, which unit is manufactured off the main automotive assembly line, with the preassembled modular trim panel unit to be brought to the main assembly line for final assembly of the door. The trim panel unit adds no significant structural reinforcement to that of the final door assembly and is made up of at least one molded layer and includes the drive and motor of the window lift mechanism, with the window and guide(s) therefor and a drive connection being mounted on the main door frame structure. The panel unit can also include parts, if not all, of the door latch mechanism and door lock motor, as well as the actuating mechanisms therefor, and an electronics module (e.g., a remote multiplexing unit), all of the door switches, and preferably most of the lateral extent of the electrical wiring for the various electrical door components, all completely mounted and interconnected. The innermost molded layer can include a series of cavities or support and positioning walls for holding the various mechanical and electrical components in place, including a covered "box" area into which uncovered circuit board(s) can be inserted, as well as straddling plateau areas for making screw connections for the components.

Abstract: A board fixturing system is described for interfacing a printed circuit board 11 having electronic devices at predeter­mined locations thereon to a probe plate 40 having electrical contacts at predetermined locations The fixturing system of the system is mechanical and avoids the problems and limitations of the conventional vacuum fixturing systems The fixturing system of this invention includes a unique conveyor system 22, 24 which is capable of staging one board while testing another The conveyor system 22, 24 is adapted to be disengaged from one board (for testing) while another board is advanced toward the test fixture The invention also provides a cassette system for the probe plates 40, 42

Abstract: Switch-level modeling is a recently developed design and analysis methodology for MOS VLSI circuits. At the switch level, important features of MOS circuits can be directly modeled using a moderate number of discrete parameters, including switch states, resistance, capacitance, and bidirectional signals. Switch-level models, provide more accurate behavioral and structural information than gate-level logical models, while avoiding the high computational cost associated with analog electrical models.

Abstract: This renowned book offers a comprehensive yet practical exploration of basic electrical and electronic concepts, hands-on applications, and troubleshooting Written in a clear and accessible narrative, theSeventh Edition focuses on fundamental principles and their applications to solving real circuit analysis problems, and devotes six chapters to examining electronic devices Some key features include: Symptom/Cause problems, and exercises on Multisim circuits on CD-ROM Key terms glossaryFurnished at the end of each chapter Vivid illustrations Numerous examples in each chapterIllustrate major concepts, theorems, and methods For professionals with a career in electronics, engineering, technical sales, field service, industrial manufacturing, service shop repair, and/or technical writing

Abstract: An improved phased-array active antenna transmit-receive means utilizing a multiplicity of individual transmit-receive cells positioned in an array format upon a common wafer of semiconductor material. Each transmit-receive cell, comprises a multiplicity of redundant, integrated circuit, electronic devices implanted upon the common semiconductor substrate. The transmit-receive cells utilize novel mitered mechanical switches to permanently interconnect individual electronic devices into either transmit or receive circuits during the fabrication and test of the transmit-receive cells. Radio frequency and direct current input and output vias formed from a novel metal evaportion technique connect the devices upon the surface of the common semiconductor wafer to underlying, insulated direct current distribution circuits and a radio frequency manifold. This array of improved phased-array active antenna transmit-receive means comprised of transmit-receive cells sharing common central processing means, logic control and heat dissipation means results in a significant reduction in the size and weight of the standard phased-array active antenna system. This significant reduction in antenna system size and weight is very important in broad band electronic countermeasure systems or narrow band phased array active antenna radar systems as used in advanced tactical fighters, or space applications.

Abstract: A self contained sensor module (1) mounted on a power transmission line (2). The module is capable of measuring various parameters such as line current, voltage, conductor temperature, and ambient temperature. The parameter values are processed by sensor electronics (17) which digitize and periodically transmit the values to a ground receiver. The sensor electronics (17) include MOS integrated circuits which are sensitive to fluctuations in supply voltage and which may enter a power-fail state or latch up as a result of such fluctuations. The module contains watchdog circuitry which monitors the operation of the module. If an interruption in the module's normal operating sequence occurs, the watchdog circuit resets the MOS integrated circuits by initiating a power down/power up sequence. The module further includes current limiting circuitry that reduces the integrated circuit's supply voltage in response to the failure of a circuit that is not critical to the module's normal operating sequence.

Abstract: Design Fundamentals for Low-Voltage Distribution and Control provides practical guidelinesfor all aspects of this vital topic. Linking theoretical principles with real hardware designs,the book will help engineers meet safety and regulatory standards, reduce redesign costs,shorten product development and testing cycles, and develop more reliable, efficientequipment.This outstanding reference highlights the determination of reactance and resistances of conductors... discusses heat transfer problems in industrial apparatus . .. and considers shortcircuit and ground fault calculations as well as temperature rise and forces occurring underfault conditions.Design Fundamentals for Low-Voltage Distribution and Control applies thermodynamicprinciples to electrical equipment, including coverage of heat transfer equations, calculationexamples for conductor sizes, and insulation. It provides empirical models to show howhigher order theoretical equations can be practically approximated . . . and includes samplecalculations for magnet size, circuit breakers, fault current, arc interruption, and other propertiesand equipment.In addition, the book compares design requirements for both U.S. and European equipment.Featuring numerous equations, graphs, tables, test procedures, and diagrams, Design Fundamentalsfor Low-Voltage Distribution and Control is an invaluable practical guide for electricaland electronics, design, project, and power engineers involved with the design andapplication of electrical apparatus; and graduate students of electrical engineering, powerengineering, and electro technology.

Abstract: The laser‐directed discretionary deposition of metal films broadens the scope of electronics fabrication and provides new capabilities for building and restructuring microelectronic devices. When such depositions are combined with local laser‐guided etching processes, multilevel modifications are enabled. This mode of processing allows the modification of individual circuits on a micrometer scale, as well as permitting the interconnection of larger circuits composed of multiple devices, both on a single substrate (‘‘wafer‐scale’’ integration) and in multichip hybrid configurations. In this paper, recent advances in the interconnect deposition processes useful for these applications are described, as well as some principal demonstrations on functioning circuits.

Abstract: Electro-optic sampling has been used extensively for the characterization of picosecond electronic devices such as photodetectors, transistors, and diodes [1,2]. For the large part, these studies have been with discrete devices coupled to specialized electro-optic modulators in a hybrid electrode geometry. However, there is great interest in being able to probe internal points of integrated circuits in order to characterize device and circuit operation in situ. Recently, a specialized embodiment of electro-optic sampling [3] was developed to perform sampling directly in the substrate of, specifically, GaAs integrated circuits. With this technique, almost any internal point of the circuit could be accessed. However, GaAs is the only commonly used semiconducting material that is also electro-optic. The substrate probing technique, or internal electro-optic sampling, also requires the surfaces of the integrated circuit to be of optical quality and the sampling laser beam to have a photon energy below the band gap energy of the substrate material.

Abstract: The invention relates to the electrical system of a motor vehicle with two operating voltages which are supplied by a generator. The system serves generally to increase the power of the vehicle's electrical system. The two operating voltages are supported by one battery each. When the batteries which are connected in series are being charged together, electronic devices for charge compensation are required. These electronic actuating elements can be used in a modified circuit forming an alternating current system.

Abstract: The Vortex Flow Transistor (VFT) has been proposed as a superconducting amplifying device. Useful circuits at microwave frequencies may be achievable using distributed amplifier concepts. However, realization of these circuits depends on obtaining a circuit model for this device and then characterizing and optimizing the elements that make up this model. In order to study these elements, a group of devices with various geometric differences were fabricated with Nb-Pb technology. Initial results of a study of the low and high frequency properties of the transresistance, output resistance, feedthrough capacitance, and input inductance of the VFT are presented.

Abstract: custom design. A chapter is devoted to VLSI architectures, and covers the implementation of finite state machines and the use of cellular logic to reduce complexity. This is followed by an introduction to digital signal processing, and descriptions of some typical signal processing architectures. Having done the groundwork, the author then presents three case studies of signal processing system designs. A digital finite impulse response filter is used to illustrate the basic approach to system design using the metrics introduced earlier. A frequency domain filter shows when to use semi-custom VLSI circuits, and a digital beam former presents a case for full custom design. The tradeoffs between using commercial chips, and designing custom chips are discussed. Finally, the book ends with a look at networking, and a comparison of several interconnection schemes. The book is well structured with each chapter starting with a concise summary and finishing with a good reference list. It is aimed at graduate engineers, and forms a useful introduction to signal processing system design. M. J. NAYLOR, Department ofElectrical and Electronic Engineering, University ofCanterbury , New Zealand

Abstract: The printed circuit board is an integral part of the electronic packaging hierarchy. Its use began more than 40 years ago, and the demand for printed circuit boards has increased in parallel with the growth of the electronics industry.[1] According to a recent forecast, the worldwide production of printed circuit boards will reach to over 19 billion U.S. dollars’ worth by 1990.[2] With continuing demands for more interconnections, the multilayer circuit board industry is experiencing its fastest growth rate. Boards with more than 20 inner planes of circuitry are being manufactured with high reliability. Based on dollar values, more than 90% of the circuit boards produced are in the rigid board category, where starting materials are based on thermosetting prepregs produced by a solution impregnation method. This article is a review of materials currently used in rigid composites.

Abstract: A flexible film has electrical interconnections on each side. Through-film interconnects pass through openings in the film to connect the electrical interconnects on opposite sides of the film. Electrical contact patterns are formed on one side of the film to accomodate integrated circuit chips or other small electronic devices. Multi-chip circuits can be formed by connecting the chips to the pattern areas and connecting the patterns by way of the electrical interconnections on either side, or on both sides.

Abstract: A substrate-entry PIN photodiode has been constructed using In0.53Ga0.47As grown on a semi-insulating InP substrate by MOVPE. This device shows low dark current (200 pA) and low capacitance (95 fF), with large remote bondpads. This device is suitable for monolithic integration with electronic devices.

Abstract: Frequency stabilisation of FDM optical signals to a comb of equally spaced frequencies has been demonstrated for optical signals originating from different locations The result was achieved by locking each optical source to a resonance of a separate fibre Fabry-Perot cavity The Fabry-Perot's comb of resonances was synchronised by locking all these devices to a master reference Implementation of the frequency stabilisation circuit requires, at each location, a tunable fibre Fabry-Perot resonator, a photodetector and simple electronics Such a simple circuit provides the means to frequency-stabilise a large number of FDM optical sources originating from different locations, as in a star network

Abstract: The Lick Observatory CCD data acquisition system is described, with some observational results to illustrate the system capability. The electronics for the CCD are subdivided into those attached to the dewar, a 'smart' controller near the dewar, and a computer connected by serial link to the smart controller. Software for the controller is in assembler code, while the software for data acquisition and on-line analysis is written in C and uses the UNIX operating system. The computers and controllers are programmed to recognize and operate several different types of CCD. Three separate instruments that use the CCDs are described briefly, together with examples of the data they produce.

Abstract: Fibre optic distributed pressure sensors will play an increasingly large role in safety devices for automation systems due to their inherent 'fail to safe' characteristics, freedom from environmental noise, and small size. Distributed microbend sensors provide the first volume applications of optical sensors for this market. Details of control systems and products will be discussed as well as advances in the state-of-the art.© (1987) COPYRIGHT SPIE--The International Society for Optical Engineering. Downloading of the abstract is permitted for personal use only.

Abstract: CIRCUIT ANALYSIS. Basic Circuits. Circuit Analysis. Alternating-Current Circuit Analysis. Alternating-Current Power. Alternating-Current Topics. Transients. ELECTRONICS. Analog Signals and Instrumentation. Digital Signals and Logic. Feedback Control Systems. Communications. Microcomputers. Digital Integrated Circuits. Operational Amplifiers. Transistors as Amplifiers. Diodes and Transistors as Switches. MACHINES AND POWER. Plant Power Systems. Transformers and Magnetics. Motors. Rotating Machinery Basics. Electrical Safety. Appendices. Index.

Abstract: A 1.6μm CMOS array with programmable aspect-ratio transistors and double-poly capacitors will be described. Using a 7.1×7.5mm array, a modem for mobile telephones has been realized with 17K transistors and 7300 passive elements.

Abstract: There are several types of polymers having special properties that make them of potential interest to the electronics and associated industries. These include materials possessing unique combinations of electrical, optical, thermal, chemical and physical properties which enable them to be utilized in applications that have not normally been associated with the more common polymers. Examples include electrical conductivity and photoconductivity, non-linear optical effects, and dielectric properties such as piezo- and pyroelectricity. Many of these polymeric materials offer significant potential advantages over the traditional materials used for the same application and in some cases, such as photoresists and non-linear materials, applications not possible by other means have been achieved. The fabrication of today’s complex semiconductor devices would, for example, be impossible without the availability of such polymers.