Abstract: A circuit module (10) having enhanced heat transfer and distribution characteristics which is particularly adapted for use in high speed electronic digital computers. The circuit module (10) includes a circuit board assembly (12) with a plurality of electronic devices (26) such as integrated circuits, mounted on a circuit board (28). The circuit board (28) includes conductive pads (42 and 44) and plated-through holes (46) forming a thermally conductive flow path from each electronic device (26) to the opposite side of the circuit board for more efficient heat transfer away from the module (10). The heat pads (42 and 44) and plated-through holes (46) are preferably connected with the ground plane layer (36) of the circuit board (28) for better heat distribution as well.

Abstract: Generally speaking, several roles are seen for low temperatures in electronics: As a means of extracting better performance from existing technology, avoiding expense and delay required for the advances in design or fabrication which would be needed to achieve the same performance at room temperature. As a necessity in the quest for improved performance, to counteract detrimental effects which arises as technology is pushed to extremes. As an opportunity to take advantage of effects made available by low temperature operation, and to develop new devices based on them. The electronic devices and circuits considered are those based on semiconductivity. Superconductive devices and circuits are not included.

Abstract: A high density packaging arrangement for electronics systems wherein a plurality of circuit board assemblies are provided with electronic components on one side and cooling tubes on the other side. The assemblies are arranged such that the cooling tubes mounted on one board cool the electronic components mounted on an adjacent board. Electronic contact elements are provided on the circuit board surfaces, to allow electrical interconnection of the electronic components mounted on adjacent boards.

Abstract: Parallel in-serial out analog readout electronics integrated with silicon strip detectors will bring a reduction of two orders of magnitude in external electronics. The readout concept and the chosen CMOS technology solve the basic problem of low noise and low power requirements. A hybrid solution is an intermediate step towards the final goal of monolithic integration of detector and electronics.

Abstract: This book describes radiation effects on and dose enhancement factors for electronic materials. Alteration of the electrical properties of solid-state devices and integrated circuits by impinging radiation is well-known. Such changes may cause an electronic subsystem to fail, thus there is currently great interest in devising methods for avoiding radiation-induced degradation. The development of radiation-hardened devices and circuits is an exciting approach to solving this problem for many applications, since it could minimize the need for shielding or other system hardening techniques. Part 1 describes the basic mechanisms of radiation effects on electronic materials, devices, and integrated circuits. Radiation effects in bulk silicon and in silicon devices are treated. Ionizing radiation effects in silicon dioxide films and silicon MOS devices are discussed. Single event phenomena are considered. Key literature references and a bibliography are provided. Part II provides tabulations of dose enhancement factors for electronic devices in x-ray and gamma-ray environments. The data are applicable to a wide range of semiconductor devices and selected types of capacitors. Radiation environments discussed find application in system design and in radiation test facilities.

Abstract: A remotely-read energy metering product comprises a conventional watt-hour meter to which an electronics package has been added, the package comprising a thin, annular, printed circuit board mounted for support on an annular adaptor ring and disposed in surrounding relation to the annular watt-hour meter. Electrical components mounted on the printed circuit board provide an electronic read-out circuit for a pulse initiator, and further provide the transponder electronics for effecting bidirectional communication between the watt-hour meter and a remote location.

Abstract: The subject invention relates to an integrated electronic assembly comprising a power supply and as associated electronics unit powered thereby. The integral power supply housing is pivotal with respect to the electronics unit housing. Protruding from the power supply is a plug (pair of prongs) for insertion directly into a standard electrical outlet to permit the entire assembly to be physically supported thereby. A detent is provided for holding the power supply at predetermined orientations with respect to the electronics unit. Electrical connections are maintained between the power supply and the electronics unit while they are pivoted at various orientations with respect to each other.

Abstract: The density of I/O circuits on input and output modules in a programmable controller is doubled, while the number of optically coupled circuits is reduced, by transmitting data serially through one of the optically coupled circuits. Optically coupled circuits are also used for address and test signals and error-checking circuitry is provided to sense failures of the optically coupled circuits. The optically coupled circuits on each module are connected between two universal large scale integrated (LSI) circuits. The universal circuit can be operated on either the processor side or the machine side of either an input module or an output module by selecting a corresponding one of its four modes of operation. The multiplexing electronics on the input and output modules, aside from the optically coupled circuits, is integrated into just two components, and only one universal component is required for replacement of either of these two.

Abstract: A multitrack tape recorder records and replays digital data on a plurality of data tracks (15) by way of record/replay electronics (7), a record head (5) and a replay head (6). Channels (8) corresponding to the tape tracks (15) are provided for input to and output from the electronics (7). An additional channel (11) carries auxiliary data related to the signals in the channels (8). This data is formatted during recording by the electronics (7) into a block format compatible with the data format on channels (15) and is recorded on a separate dedicated track (16). The auxiliary information may be formatted in labels each of which has an instruction field and a parameter field. The labels can carry a wide variety of information relating to operation of the system. As one example, a label may contain in the instruction field an instruction to increase the playback gain by an amount contained in the parameter field.

Abstract: An electronic device, such as an integrated circuit chip, having pins for connection to a circuit board or the like is secured to a relatively massive heat sink. The heat sink is releasably secured to support means such that the electronic device and its pins are substantially isolated from forces related to the mass and weight of the heat sink.

Abstract: @ The specification discloses a circuit module (10) having enhanced heat transfer and distribution characteristics which is particularly adapted for use in high speed electronic digital computers. The circuit module (10) includes a circuit board assembly (12) with a plurality of electronic devices (26) such as integrated circuits, mounted on a circuit board (28). The circuit board (28) includes conductive pads (42 and 44) and plated-through holes (46) forming a thermally conductive flow path from each electronic device (26) to the opposite side of the circuit board for more efficient heat transfer away from the module (10). The heat pads (42 and 44) and plated-through holes (46) are preferably connected with the ground plane ■ layer (36) ofthe circuit board (28) for better heat distribution as well.

Abstract: The electronics revolution led by computers and microprocessors is based on the silicon integrated circuit. Gold contacts play a key role in the fabrication of integrated circuits. For microwave devices and integrated circuits made from compound semiconductors such as gallium arsenide, gold metallization is used for both ohmic and rectifying contacts.

Abstract: This paper describes a general computer program for the analysis and design of passive, active and non-linear lumped/distributed circuits. This program is particularly suitable for the analysis of active microwave networks and GaAs integrated circuits.

Abstract: Introduction and overview PART I: INTRODUCTION TO CIRCUITS 1. Principles of Electric Circuits 2. Introduction to dc Circuit Analysis 3. Techiniques of dc Analysis 4. Active Circuit Elements PART II: TIME-VARYING SIGNALS IN CIRCUIT ANALYSIS 5. Inductance and Capacitance 6. Sinusoidal Signals 7. Phasor Analysis 8. Transient Response of Passive Circuits PART III: ANALOG SIGNALS AND TECHNIQUES 9. Principles of Analog Systems 10. Practical Analog Technology PART IV: DIGITAL SIGNALS AND THEIR USES 11. Digital Building Blocks 12. Introduction to Digital Systems PART V: ACTIVE DEVICES AND CIRCUITS 13. Semiconductor Devices 14. Transistor Amplifiers 15. Digital Circuits PART VI: MAGNETIC DEVICES, ELECTRIC POWER, AND MACHINES 16. Electric Power 17. Electromechanical Devices References Answers to Even-Numbered Problems Index

Abstract: A high speed and low power consumption semiconductor integrated circuit device has a plurality of internal circuits (302, 303) each including circuit elements for performing a desired circuit operation, a plurality of input circuits (301) for receiving external input signals and supplying the signals to the internal circuits and a plurality of output circuits (301) for receiving the output signals from the internal circuits and supplying signals to an external. Each of the internal circuits is primarily constructed by bipolar transistors and MOS transistors, and at least one of each of the input circuits and each of the output circuits is primarily constructed by bipolar transistors.

Abstract: Device for temperature regulation having a control apparatus, a temperature sensor and an actuator on one or more radiators. The essence of the invention is that the control apparatus has processing electronics with variable programming and that discontinuously operating actuators are connected to the processing electronics via quasi-continuously operating two-point controllers.

Abstract: The Integrated Tactile Network Architecture or ITNA is a hierarchical system for managing the interaction of tactile sensing and motor control in the 3-D active sensory environment. The overall ITNA includes custom dedicated hybrid front end tactile arrays incorporating electronics and microprocessors for sensor linearization, tactile information preprocessing, and local feature extraction approaches to the distributed motor control of manipulator fingers for grasping; interconnection networks for guarded movement and reflex arcs; and special purpose hardware for model generation derived from tactile information. This paper primarily addresses the overall ITNA structure and, in particular, the design of an intelligent sensor array and its associated communications subsystem.

Abstract: A survey to identify areas of needed research to understand aging mechanisms for electronics in nuclear power plant instrumentation has been completed. The emphasis was on electronic components such as semiconductors, capacitors, and resistors used in safety-related instrumentation in the reactor containment area. The environmental and operational stress factors which may produce degradation during long-term operation were identified. Some attention was also given to humidity effects as related to seals and encapsulants, and failures in printed circuit boards and bonds and solder joints. Results suggest that neutron as well as gamma irradiations should be considered in simulating the aging environment for electronic components. Radiation dose-rate effects in semiconductor devices and organic capacitors need to be further investigated, as well as radiation-voltage bias synergistic effects in semiconductor devices and leakage and permeation of moisture through seals in electronics packages.

Abstract: Semiconductor particle detectors were conceived as miniature energy spectrometers for energetic ionizing particles. The higher the energy, the thicker the detector must be to contain the full energy deposition of the particle. In photon spectrometry, one strives for highest conversion efficiency by using semiconducting materials of high atomic number (Ge, CdTe, HgI 2) and again by increasing the detector volume as much as possible. The development of these particle detectors occurred in the wake of the general interest in semiconductor devices, but the materials requirements are so stringent that detector manufacturing has become a venerable art, only loosely connected to the semiconductor industry. The production of ultra-pure silicon and germanium is a challenge and the related research has been profitable also to less demanding users through better understanding of the materials properties. Besides materials requirements, there have also been continuous needs for improvement of the noise performance of the detector-related electronics. These have prompted efforts to design low noise amplifiers and special low noise FET transistors. Such amplifiers now find widespread application, e.g. in optoelectronics.

Abstract: An automatic motorized system is presented. It is based on an essentially analogic approach and the use of DC motors. The electronics and mechanics have been designed for assembling optical components that must be in mechanical contact.

Abstract: Preface to the second edition Preface to the first edition 1. Principles of amplifiers 2. The p-n junction and the field-effect transistor 3. The bipolar transistor 4. Operational amplifiers and linear integrated circuits 5. Negative feedback 6. Positive feedback and oscillators 7. Digital fundamentals 8. Digital circuits and applications Appendices Index.