Topic
Diffusion welding
About: Diffusion welding is a research topic. Over the lifetime, 1411 publications have been published within this topic receiving 10400 citations.
Papers published on a yearly basis
1 / 2
Papers
25 Oct 2005-Materials Science and Engineering A-structural Materials Properties Microstructure and Processing
TL;DR: In this paper, the microstructures of the transition joints were revealed in optical and scanning electron microscopy (SEM) and their chemical compositions were determined by energy dispersive spectroscopy.
Abstract: Diffusion bonding was carried out between commercially pure titanium (cpTi) and 304 stainless steel (304ss) using copper as interlayer in the temperature range of 850–950 ◦ C for 1.5 h under 3 MPa load in vacuum. The microstructures of the transition joints were revealed in optical and scanning electron microscopy (SEM). The study exhibits the presence of different reaction layers in the diffusion zone and their chemical compositions were determined by energy dispersive spectroscopy. The occurrence of different intermetallic compounds such as CuTi2, CuTi, Cu3Ti2 ,C u 4Ti3, FeTi, Fe2Ti, Cr2Ti, T2 (Ti40Cu60−xFex ;5
249 citations
TL;DR: In this article, molecular dynamics simulations are carried out to analyze the diffusion bonding at the Cu/Al interfaces, and the results indicate that the thickness of the interfacial layer is temperature-dependent, with higher temperatures yielding larger thicknesses.
179 citations
TL;DR: In this paper, the UHV diffusion energy of bicrystals was determined as a measure of their bond strength, and it was assumed that both these properties are associated with interfacially active elements in the system.
Abstract: In both the practical and theoretical aspects of joining metals to ceramics the influence of impurities on the interfacial bond strength is not fully understood. In the present paper the authors describe part of a study in which the interface of niobium-sapphire bicrystals was contaminated under defined conditions and the interfacial fracture energy of these UHV diffusion bonded bicrystals was determined as a measure of their bond strength. The model combination niobium-sapphire shows at high temperatures a simple reaction in which alumina dissolves in niobium without forming an interlayer. Furthermore, niobium and sapphire are characterized by nearly the same expansion behavior which minimizes the development of thermal stresses during cooling down from the bonding temperature. The authors report on experiments in which silver or titanium atoms have been chosen as interfacial impurity elements. Silver is practically insoluble in niobium and sapphire whereas titanium possesses a highly negative free enthalpy of oxide formation. It is assumed that both these properties are associated with interfacially active elements in the system niobium-sapphire.
148 citations
TL;DR: In this paper, a Ti-6Al-4V alloy was bonded to electrolytic copper at various temperatures of 875, 890 and 900°C and times of 15, 30 and 60 min through diffusion bonding.
133 citations
TL;DR: In this article, plates of stainless steel (grade 410) were joined to copper ones through a diffusion bonding process using a nickel interlayer at a temperature range of 800-950°C.
127 citations
Related Topics (5)
Performance Metrics
| Year | Papers |
|---|---|
| 2025 | 3 |
| 2024 | 7 |
| 2023 | 14 |
| 2022 | 30 |
| 2021 | 25 |
| 2020 | 75 |