TL;DR: In this article, the use of a hydrogen anode, diffusion barrier and anolyte circulation for the electrodeposition of a metal of oxidation potential below that of hydrogen from a salt solution thereof is described.
Abstract: This disclosure deals with the novel use of a hydrogen anode, diffusion barrier and anolyte circulation for the electrodeposition of a metal of oxidation potential below that of hydrogen from a salt solution thereof and in controlled locations maintained apart from the hydrogen catalyst surface at the anode which normally would plate out the metal thereon.
TL;DR: In this article, a thin layer of a ductile diffusion barrier, which is non-poisonous to thermoelectric materials, such as iron, tungsten, molybdenum, or niobium, is disposed between the thermoclectric material and a contacting shoe.
Abstract: A bonded electrical contact and method for a thermoelectric element A thin layer of a ductile diffusion barrier, which is non-poisonous to thermoelectric materials, such as iron, tungsten, molybdenum, or niobium, is disposed between the thermoelectric material and a contacting shoe, such as stainless steel, which has poisonous alloy constituents The thermal expansion coefficient of the diffusion barrier, which does not match that of the thermoelectric material, is overridden by that of the shoe, whose coefficient does correspond with that of such high expansion thermoelectrics as the tellurides
TL;DR: In this paper, an unusual leakage path may be involved in the three order of magnitude increase in the reverse current leakage of a semiconductor junction encapsulated in resin and subjected to high temperature and high humidity.
Abstract: The foregoing data and analysis indicate that an unusual leakage path may be involved in the three order of magnitude increase in the reverse current leakage of a semiconductor junction encapsulated in resin and subjected to high temperature and high humidity The SiO2-resin interface apparently plays a key part in this leakage Diffusion of water through the relatively thick resin is involved
TL;DR: In this article, a method of fabricating carbide-metal interaction specimens was developed and was employed in the experimental evaluation of the compatibility of MC type carbides in high temperature metal matrices.
Abstract: : A method of fabricating carbide-metal interaction specimens was developed and is described. The diffusion bonded specimens were employed in the experimental evaluation of the compatibility of MC type carbides in high temperature metal matrices. This was accomplished in an effort to evaluate the stability of the MC type carbide in terms of its potential use as a diffusion barrier in a carbon filament reinforced high temperature metal matrix composite system. Six MC type carbides were chosen based on structural and thermodynamics consideration. These carbides were: TiC, VC, HfC, TaC, NbC, and ZrC and were evaluated in pure Ni, pure Co, Ni-20Cr, Co-19.5Cr, IN 100, and MAR-M-509. The diffusion couples were evaluated after 25 hours at temperatures from 1000 to 1200C. (Author)
TL;DR: In this article, the influence of solar radiation reflectance on water evaporation was studied and the authors concluded that a special surface film or monolayer was required that would not only act as a diffusion barrier, but also serve as a good reflector of the solar radiation.
Abstract: In a recent paper, Beard and Gainer [1970] studied the influence of solar radiation reflectance on water evaporation. They concluded that for maximum suppression of evaporation, a special surface film or monolayer was required that would not only act as a diffusion barrier, but also as a good reflector of solar radiation. Their own evidence, however, refutes the latter claim with respect to monolayers. From their calculated results of per cent evaporation reduction as a function of the normal reflectance ratio of a monolayer-covered water surface to an uncovered water surface, for instance, it may be discerned that the reflectance properties of the best monolayer they could find (Union Carbide S-1362-91-2) only tended to increase the evaporation suppression of the monolayer by about 2%, from 25.5% to 27.5%, an essentially negligible amount compared to the basic suppression caused by the monolayer's diffusion barrier characteristics alone.