TL;DR: In this paper, a review of the reactions between SnPb and one of the four metals, Cu, Ni, Au, and Pd have been reviewed on the basis of the available data of morphology, thermodynamics, and kinetics.
Abstract: Solder reactions between SnPb and one of the four metals, Cu, Ni, Au, and Pd have been reviewed on the basis of the available data of morphology, thermodynamics, and kinetics. The reactions on both bulk and thin film forms of these metals have been considered and compared. Also the two kinds of reactions, above and below the melting point of the solder, have been considered and compared. The rate of intermetallic compound formation in wetting reactions between the molten solder and the metals is three to four orders of magnitude faster than those between the solid state solder and the metals. The rate is controlled by the morphology of intermetallic compound formation. In the wetting reaction between molten SnPb and Cu or Ni, the intermetallic compound formation has a scallop-type morphology, but in solid state aging, it has a layer-type morphology. There are channels between the scallops, which allow rapid diffusion and rapid rate of compound formation. In the layer-type morphology, the compound layer itself becomes a diffusion barrier to slow down the reaction. Similar morphological changes occur between SnPb and Au or Pd. The stability of scallop-type morphology in wetting reaction and layer-type morphology in solid state aging have been explained by minimization of surface and interfacial energies. The unusually high rate of scallop-type intermetallic compound formation has been explained by the gain of rate of free energy change rather than free energy change. Also included in the review is the use of a stack of thin films as under-bump-metallization, such as Cr/Cu/Au, Al/Ni(V)/Cu, and Cu/Ni alloyed thin films.
TL;DR: In this article, a method and an apparatus are provided for performing growth of compound thin films by alternately repeating separate surface reactions of the substances comprising the compound, and a carrier gas affects a diffusion barrier between the surface reaction steps to separate them from each other.
Abstract: A method and an apparatus are provided for performing growth of compound thin films by alternately repeating separate surface reactions of the substances comprising the compound. A carrier gas affects a diffusion barrier between the surface reaction steps to be separated from each other. The gas phase diffusion barrier is also applied to separate the source regions of different reacting vapors both from each other and from the surface reaction zone.
TL;DR: In this paper, the authors performed density-functional theory (DFT) calculations of carbon dissolution and diffusion in iron, the latter being a typical example of interstitial diffusion, and they found that a supercell with 128 Fe atoms and one C atom is sufficient for describing dilute concentrations of carbon in bcc Fe.
Abstract: We perform density-functional theory (DFT) calculations of carbon dissolution and diffusion in iron, the latter being a typical example of interstitial diffusion. The Kohn-Sham equations are solved with periodic boundary conditions and within the projector-augmented-wave formalism, using the generalized gradient approximation for electron exchange and correlation. With the solution enthalpy as an indication of cell size convergence, we find a supercell with 128 Fe atoms and one C atom is sufficient for describing dilute concentrations of carbon in bcc Fe. The solution enthalpy of carbon in an octahedral site in ferrite is predicted to be 0.74 eV, i.e., the dissolution of carbon in bcc ferromagnetic (FM) Fe is an endothermic process. Using the Fe128C1 periodic cell, we find that the minimum-energy path (MEP) of carbon diffusion from one octahedral site to another (via a tetrahedral site) has a barrier of 0.86 eV, in excellent agreement with the experimental value of 0.87 eV. This encouraging benchmark result prompted us to investigate carbon diffusion in austenite, whose electronic structure is less well characterized experimentally. Cell size convergence results show that a supercell with 32 Fe atoms and one C atom is sufficient. The calculated solution enthalpy is $\ensuremath{-}0.17$ eV, which indicates that the dissolution of carbon in fcc Fe is exothermic, consistent with the known greater solubility of C in austenite compared to ferrite. The MEP shows that carbon moves linearly from an octahedral site to another, contrary to the common notion of an off-plane diffusion path. The diffusion barrier is calculated to be 0.99 eV. Since we model austenite with the FM high-spin phase, the diffusion barrier we obtain is not directly comparable to the experiments in which austenite is usually paramagnetic. However, this prediction is relevant for C incorporation into Fe thin films, since FM high-spin fcc Fe can be obtained by epitaxial growth of thin Fe films on a Cu substrate.
TL;DR: In this paper, the adsorption and diffusion of hydrogen on the surface of titanium nitride was studied using density functional theory (DFT) and generalized gradient approximation (GGA) for the exchange and correlation energy.
Abstract: The adsorption and diffusion of hydrogen on the (100) surface of titanium nitride was studied using density-functional theory (DFT) and the generalized gradient approximation (GGA) for the exchange and correlation energy. The adsorption site was found to be on top of the titanium atom with the chemisorption energy of -2.88 eV. The diffusion barrier was determined as 0.73 eV along the path connecting the neighboring titanium atoms. The surface energies and surface relaxations of the three most important surfaces of TiN were studied. The surface energies have the following order: ${S}_{100}l{S}_{110}l{S}_{111}.$ Three different GGA functionals, the Perdew-Wang 1991 (PW91), the Perdew-Burke-Ernzerhof (PBE), and the revised PBE (RPBE) functionals, were tested on crystals, small molecules and TiN surfaces. The RPBE functional when applied to the surface studies of TiN was found to produce slightly lower values of surface energies and of hydrogen adsorption energies than the PW91 functional.
TL;DR: The one-step direct synthesis of 2D Mo2 C-on-graphene film by molten copper-catalyzed chemical vapor deposition (CVD) is reported, showing a much lower onset voltage for hydrogen evolution reactions as compared to Mo 2 C-only electrodes.
Abstract: As a new member of the MXene group, 2D Mo2 C has attracted considerable interest due to its potential application as electrodes for energy storage and catalysis. The large-area synthesis of Mo2 C film is needed for such applications. Here, the one-step direct synthesis of 2D Mo2 C-on-graphene film by molten copper-catalyzed chemical vapor deposition (CVD) is reported. High-quality and uniform Mo2 C film in the centimeter range can be grown on graphene using a Mo-Cu alloy catalyst. Within the vertical heterostructure, graphene acts as a diffusion barrier to the phase-segregated Mo and allows nanometer-thin Mo2 C to be grown. Graphene-templated growth of Mo2 C produces well-faceted, large-sized single crystals with low defect density, as confirmed by scanning transmission electron microscopy (STEM) measurements. Due to its more efficient graphene-mediated charge-transfer kinetics, the as-grown Mo2 C-on-graphene heterostructure shows a much lower onset voltage for hydrogen evolution reactions as compared to Mo2 C-only electrodes.