Topic
Die (manufacturing)
About: Die (manufacturing) is a research topic. Over the lifetime, 37851 publications have been published within this topic receiving 170493 citations. The topic is also known as: die and mold & matrix.
Papers published on a yearly basis
1 / 3
Papers
Patent•
16 Feb 1996
TL;DR: In this paper, the rotary die has cutting edges and a die packing material adjacent to at least a portion of the cutting edges, which compresses the gel prior to cutting, and the compression is preferably sufficient to cause elastic deformation in the gel so that the gel retracts after being cut.
Abstract: A method of making a return pad for an electrosurgical system comprises the following steps. A first step includes die cutting an electrically conductive foil on a backing using a rotary press to create a foil blank. A second step includes peeling the conductive foil from around the blank, and leaving the blank on its backing. A third step includes layering electrically conductive gel together with the die cut foil to form a layered sheet. A fourth step includes blanking the return pad from the layered sheet using a rotary die. The rotary die has cutting edges and a die packing material adjacent to at least a portion of the edges. The die packing material compresses the gel prior to cutting. The compression is preferably sufficient to cause elastic deformation in the gel so that the gel retracts after being cut. The retraction of the gel leaves a border around the edge of the pad. The border region helps prevent the possibility of the gel coming into electrical contact with an unintended object. One of the advantages of the method of manufacturing disclosed herein is that a continuous rotary process can be used to manufacture electrosurgical return pads. The continuous nature of the process increases the efficiency of the manufacturing operation. The apparatus for using the method is also disclosed.
599 citations
Patent•
4 Jun 1993
TL;DR: In this article, a medical staple forming die and pusher punch for use in a staple forming machine is presented, where the bend radius of the staple is formed either by the form punch pushing the wire past a set of rollers, or by movable forming dies in conjunction with a tapered or contoured pusher punched.
Abstract: A medical staple forming die and pusher punch for use in a staple forming machine. The bend radius of the staple is formed either by the form punch pushing the wire past a set of rollers, or by movable forming dies in conjunction with a tapered or contoured pusher punch. Since the wire is not scrapping on a stationary rail, pulling thin or cracking in its corners is substantially eliminated and the possibility of metal slivers produced by the prior art scrapping methods is substantially reduced or eliminated.
529 citations
TL;DR: In this paper, a new method is described which produces fully dense, well aligned Nd•Fe•B magnets from rapidly quenched ribbons, achieved by hot pressing at ∼15 kpsi in argon at 700 °C, and a second hot press in a larger die cavity to allow deformation transverse to the press direction (die upsetting).
Abstract: A new method is described which produces fully dense, well‐aligned Nd‐Fe‐B magnets from rapidly quenched ribbons Full density is achieved by hot pressing at ∼15 kpsi in argon at 700 °C A second hot press in a larger die cavity to allow deformation transverse to the press direction (die upsetting) introduces a preferred magnetization direction parallel to the press direction Energy products of 40 MGOe (Br/Hci=135 kG/11 kOe) have been generated by this method
487 citations
TL;DR: In this paper, a review of the state-of-the-art in the micro forming of metals is given, where scaling effects occur in tribological aspects such as the friction coefficient, which increases with decreasing specimen size.
348 citations
Patent•
TSMC1
TL;DR: In this paper, the authors present a method for forming a sacrificial film layer over a top surface of a die, the die having a contact pad at the top surface, which is attached to a carrier, and a molding compound is formed over the die.
Abstract: A method embodiment includes forming a sacrificial film layer over a top surface of a die, the die having a contact pad at the top surface. The die is attached to a carrier, and a molding compound is formed over the die and the sacrificial film layer. The molding compound extends along sidewalls of the die. The sacrificial film layer is exposed. The contact pad is exposed by removing at least a portion of the sacrificial film layer. A first polymer layer is formed over the die, and a redistribution layer (RDL) is formed over the die and electrically connects to the contact pad.
335 citations
Related Topics (5)
Performance Metrics
| Year | Papers |
|---|---|
| 2022 | 4 |
| 2021 | 354 |
| 2020 | 1,446 |
| 2019 | 2,015 |
| 2018 | 2,226 |
| 2017 | 2,833 |