Abstract: 1. Apparatus for applying a metallic solder coating on a printed circuit board through contact of the printed circuit board with the liquid solder, having a first container (6) for receiving the liquid solder (7), a second container (9) which has a slot-shaped opening (35) extending horizontally in one wall (22, 23), an a pump (37) which pumps the liquid solder from the first container (6) into the second container (9) in a quantity such that the level (38) of solder in the second container (9) is above the openings (35), characterized in that a further slot-shaped opening (35) extending horizontally is provided in the wall (23) opposite the wall (22) with the slot-shaped opening (35) and both slot-shaped openings (35) are located in the feed plane of the printed circuit boards (21) fed horizontally.

Abstract: A conveyor device containing transport frames, each of which is structured for receiving a printed circuit or wiring board carrying circuit components and guided at their leading and their trailing corners by related guide tracks, leads the transport frames to a solder bath, where the transport device lowers the transport frames together with the printed circuit boards towards the solder bath and again raises the same therefrom. During the course of travel of a transport frame containing a printed circuit board carrying one or more of the circuit components through the solder bath one side of the printed circuit board is immersed into the solder bath and then again lifted out of the solder bath. On the one hand, to prevent that the connection leads or wires protruding from the printed circuit board, during the immersion into the soldering bath, hold back air and, on the other hand, to prevent that during lift-out of the printed circuit board from the solder bath solder bridges will form between the protruding leads or wires, the guide tracks, viewed in the direction of conveying, possess descending ramps whose spacing from one another is less than the length of a transort frame. Following the descending ramps are ascending ramps, whose spacing from one another approximately corresponds to the length of a transport frame. The equipment is particularly suitable for the series or mass production soldering of printed circuit boards which carry similar types of circuit components.

Abstract: The tubular handle of the appts. forms a suction cylinder (a) closed at one end by a nozzle up which molten solder can be drawn. Inside cylinder (a) is a coil spring supporting a loose disk (b) fitted with a needle entering the nozzle to remove solder at the end of each desoldering operation. Behind the disk (b) is a piston (c) provided with ring grooves holding grease. Piston (c) is driven by a hand operated piston rod which releases the compressed coil spring to provide the suction. The spring is pref. a friction fit in cylinder (a) so the bore of the latter is kept free of solder. Used esp. for removing molten solder in electronic appts. for desoldering integrated circuits.