Topic
Copper tape
About: Copper tape is a research topic. Over the lifetime, 512 publications have been published within this topic receiving 1943 citations.
Papers published on a yearly basis
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Papers
TL;DR: In this article, the electrical characteristics of HTS coils based on the turn-to-turn inserted materials and conditions were presented. And the experimental results showed that the properties of materials inserted into the coil can control the time constant.
Abstract: Recently, studies of partially insulated, high-temperature superconducting (HTS) coils have shown application in the design and construction of compact, stable and self-protecting HTS coils. This article presents the electrical characteristics of HTS coils based on the turn-to-turn inserted materials and conditions. Three partially co-wound pancake coils were fabricated and tested. Each coil was partially co-wound with Kapton, stainless steel and copper tape at every fourth turn of the winding. Tested coils were co-wound on every turn with Kapton, stainless steel and copper tape, and coils without turn-to-turn insulation were the control group. Charge–discharge, sudden-discharge and over-current tests were performed to evaluate the performance of the fabricated coils. The experimental results show that the properties of materials inserted into the coil can control the time constant (τ). Therefore, HTS coils can be designed for specific purposes according to the time constant control. The experimental results of the study could be useful in designing HTS coil applications.
107 citations
TL;DR: A thin tape target driver for laser ion acceleration was developed in this paper, which can move a copper tape of 5 μm thickness with a positioning reproducibility of less than 30 μm (peak to valley), which is sufficient for a laser irradiation target.
Abstract: A thin tape target driver for laser ion acceleration was developed. The driver can move a copper tape of 5 μm thickness with a positioning reproducibility of less than 30 μm (peak to valley), which is sufficient for a laser irradiation target. Using this tape target and laser pulses of energy 350 mJ and duration 60 fs, protons of energies of over 1 MeV were accelerated in the forward direction.
60 citations
TL;DR: In this article, a new technique for the preparation of polycrystalline single-phase CulnS2 thin films for solar applications has been developed, where a continuous roll-to-roll process is used, where copper tape is at first electrochemically plated with an In layer.
57 citations
TL;DR: In this article, current versus voltage measurements were done on copper indium disulphide cells fabricated on a continuous copper tape fabricated at IST (Frankfurt/Oder, D).
47 citations
Patent•
1 Feb 1990TL;DR: In this article, the fingers of a copper tape are reflow soldered to metal bumps located on the semiconductor device and the copper assembly tape is lightly pressed against the bumps by means of a thermode, which is quickly heated to a temperature well above the gold-tin eutectic melting temperature.
Abstract: In a semiconductor device tape assembly bonding process the fingers (22) of a copper tape are reflow soldered to metal bumps (19) located on the semiconductor device (10). First, the semiconductor wafer is covered with a conductive film composed of thin layers of aluminum (14), nickel-vanadium alloy (15) and gold (16). The bumps are then created by electroplating gold through openings in a photoresist mask. The gold bumps (19) are overcoated with a contolled thickness tin layer and the tin is overcoated with a thin gold anticorrosion layer. The copper assembly tape is coated with a thin gold layer (23) and are lightly pressed against the bumps by means of a thermode. The thermode is quickly heated to a temperature well above the gold-tin eutectic melting temperature and then rapidly cooled. The tin layer on the bump will combine with the adjacent gold to form a liquid phase eutectic (24) which will form and contact both the copper finger and the gold bump. Upon cooling the eutectic melt will solder the finger to the bump. Since all of the tin is combined with the gold there is no metallic tin left in the system and the problems of tin whiskers and tin electromigration are avoided.
41 citations
Related Topics (5)
Performance Metrics
| Year | Papers |
|---|---|
| 2021 | 9 |
| 2020 | 12 |
| 2019 | 24 |
| 2018 | 28 |
| 2017 | 22 |
| 2016 | 29 |