About: Coolant is a research topic. Over the lifetime, 34883 publications have been published within this topic receiving 269579 citations. The topic is also known as: heat transfer fluid & cooling fluid.
TL;DR: In this paper, a water-cooled integral heat sink for silicon integrated circuits has been designed and tested at a power density of 790 W/cm2, with a maximum substrate temperature rise of 71°C above the input water temperature.
Abstract: The problem of achieving compact, high-performance forced liquid cooling of planar integrated circuits has been investigated. The convective heat-transfer coefficient h between the substrate and the coolant was found to be the primary impediment to achieving low thermal resistance. For laminar flow in confined channels, h scales inversely with channel width, making microscopic channels desirable. The coolant viscosity determines the minimum practical channel width. The use of high-aspect ratio channels to increase surface area will, to an extent, further reduce thermal resistance. Based on these considerations, a new, very compact, water-cooled integral heat sink for silicon integrated circuits has been designed and tested. At a power density of 790 W/cm2, a maximum substrate temperature rise of 71°C above the input water temperature was measured, in good agreement with theory. By allowing such high power densities, the heat sink may greatly enhance the feasibility of ultrahigh-speed VLSI circuits.
TL;DR: In this article, the authors present a detailed discussion of the relationship between the heat transfer and the cooling properties of a cascade-vane with respect to the rotation of the Cascade Vane.
Abstract: Fundamentals Need for Turbine Blade Cooling Turbine-Cooling Technology Turbine Heat Transfer and Cooling Issues Structure of the Book Review Articles and Book Chapters on Turbine Cooling and Heat Transfer New Information from 2000 to 2010 References Turbine Heat Transfer Introduction Turbine-Stage Heat Transfer Cascade Vane Heat-Transfer Experiments Cascade Blade Heat Transfer Airfoil Endwall Heat Transfer Turbine Rotor Blade Tip Heat Transfer Leading-Edge Region Heat Transfer Flat-Surface Heat Transfer New Information from 2000 to 2010 2.10 Closure References Turbine Film Cooling Introduction Film Cooling on Rotating Turbine Blades Film Cooling on Cascade Vane Simulations Film Cooling on Cascade Blade Simulations Film Cooling on Airfoil Endwalls Turbine Blade Tip Film Cooling Leading-Edge Region Film Cooling Flat-Surface Film Cooling Discharge Coefficients of Turbine Cooling Holes 3.10 Film-Cooling Effects on Aerodynamic Losses 3.11 New Information from 2000 to 2010 3.12 Closure References Turbine Internal Cooling Jet Impingement Cooling Rib-Turbulated Cooling Pin-Fin Cooling Compound and New Cooling Techniques New Information from 2000 to 2010 References Turbine Internal Cooling with Rotation Rotational Effects on Cooling Smooth-Wall Coolant Passage Heat Transfer in a Rib-Turbulated Rotating CoolantPassage Effect of Channel Orientation with Respect to the RotationDirection on Both Smooth and Ribbed Channels Effect of Channel Cross Section on Rotating Heat Transfer Different Proposed Correlation to Relate the Heat Transferwith Rotational Effects Heat-Mass-Transfer Analogy and Detail Measurements Rotation Effects on Smooth-Wall Impingement Cooling Rotational Effects on Rib-Turbulated Wall ImpingementCooling New Information from 2000 to 2010 References Experimental Methods Introduction Heat-Transfer Measurement Techniques Mass-Transfer Analogy Techniques Liquid Crystal Thermography Flow and Thermal Field Measurement Techniques New Information from 2000 to 2010 Closure References Numerical Modeling Governing Equations and Turbulence Models Numerical Prediction of Turbine Heat Transfer Numerical Prediction of Turbine Film Cooling Numerical Prediction of Turbine Internal Cooling New Information from 2000 to 2010 References Final Remarks Turbine Heat Transfer and Film Cooling Turbine Internal Cooling with Rotation Turbine Edge Heat Transfer and Cooling New Information from 2000 to 2010 Closure Index
TL;DR: In this paper, open-cell metal foams with an average cell diameter of 2.3 mm were manufactured from 6101-T6 aluminum alloy and were compressed and fashioned into compact heat exchangers.
TL;DR: In this paper, four cell-cooling methods: air cooling, direct liquid cooling, indirect liquid cooling and fin cooling, were evaluated using a typical large capacity Li-ion pouch cell designed for EDVs from the perspective of coolant parasitic power consumption, maximum temperature rise, temperature difference in a cell, and additional weight used for the cooling system.
TL;DR: In this article, the authors show that the performance of tungsten surfaces under intense transient thermal loads is another critical issue, since the formation of a melt layer may favor the generation of highly activated dust particles.