Continuity test

Abstract: An electrosurgical generator is provided which includes a continuity test circuit assembly for testing electrical continuity through an electrode of an electrosurgical instrument. The continuity test circuit assembly includes a test power source providing electrical test energy to a first conductor which is in electrical communication with the electrode and the electrosurgical generator and to at least one second conductor which is coupled to the first conductor for providing a path for current to flow between the first conductor and the at least one second conductor for establishing a test path through which the test energy flows between the first conductor and at least one conductor of the at least one second conductor. The continuity test circuit assembly further includes energy detection circuitry positioned along the test path for detecting the flow of the test energy through the test path for determining electrical continuity through the electrode.

Abstract: A method of performing continuity testing of individual lead sets bonded to an integrated semiconductor component with a continuity test circuit fabricated on the component. The continuity test circuit includes a plurality of current gates, each of which is associated with a different semiconductor component contact pad a lead set is bonded to. Each current gate includes a first terminal connected to the associated contact pad and a second terminal connected to a common conductor all the current gate second terminals are connected to. The common conductor terminates at a semiconductor component contact test pad a lead set is bonded to. Whenever a test signal is applied to either the first or second terminal of a current gate, a measurable response signal is generated by the current gate over the other terminal. Continuity testing of the lead sets bonded to the chip is performed by applying a test signal to either a wiring board conductor connected to the lead set being tested or a wiring board conductor connected to the lead set connected to the semicondcutor component test contact pad. A test probe is then applied to the board conductor the test signal is not applied to. If the response signal is sensed, the leads are properly bonded; if no response signal is detected either the lead set being tested on the lead set connected to the semiconductor component is improperly bonded. The current gate blocks signals on the first terminal from appearing on the second terminal or the common conductor. Thus, when the semiconductor component is in use, the continuity test circuit is isolated from the other individual circuit components forming the integrated semiconductor component.

Abstract: A portable test instrument for testing electrical continuity, and diode polarity, AC and DC voltage amplitudes and DC voltage polarity. An electronic switch device has main electrodes connected in an indicating circuit with an electrical supply, a light-emitting diode and a current-limiting resistor. A double pole, double throw switch is manually switchable between continuity and voltage test positions, and with four resistors defines an input circuit interposed between the control electrode of the electronic switch device and probes connectible to a circuit or the like to be tested. In both the voltage and continuity test modes of the instrument, the light-emitting diode is energized only by current from the electrical supply within the indicating circuit. Though proper circuit operation is obtained by manual manipulation of the mode switch between its voltage and continuity positions, the light-emitting diode is automatically protected from damage should the test probes engage a voltage circuit (within the operating voltage range of the instrument) while the instrument is in continuity mode.

Abstract: The present invention provides an apparatus and method for inspecting electrical continuity of a circuit board, capable of decreasing the impedance in a current path as an inspection object to achieve enhanced SN ratio. A coupling capacitance is formed at one of terminals of a pattern wire on a board as an inspection object in a non-contact manner, and an inductance ( 450 ) and a lead wire are connected to this capacitance. An AC inspection signal is applied to the other terminal through the lead wire in a contact manner. A resonance circuit is defined by the capacitance, inductance and pattern wire, and thereby an output signal can be detected with lowering the impedance.