Computer-aided technologies

Abstract: In this paper, emerging technologies in the automotive assembly are discussed, along with techniques used in the vehicle assembly plants. The discussion involves technologies directly dealing with assembly processes such as handling, joining, human resources etc. as well as with supporting systems, mainly the information technologies. An overview of the existing technologies is provided. The assembly systems are unable to cope with the requirements of mass customization and need to be enriched with new technologies for a higher flexibility potential. Concepts integrating various new technologies into supporting both automated and human based assembly operations are presented and discussed versus this identified inability for mass customization. Future assembly plants need to utilize flexibility systematically, both for the system design and its operation. For this purpose, a close loop approach is discussed.

Abstract: There is increasing acceptance of high-throughput technologies for the discovery, development, and optimization of materials and catalysts in industry. Over the years, the relative synchronous development of technologies for parallel synthesis and characterization has been accompanied by developments in associated software and information technologies. This Review aims to provide a comprehensive overview on the state of the art of the field by selected examples. Technologies developed to aid research on complex materials are covered as well as databases, design of experiment, data-mining technologies, modeling approaches, and evolutionary strategies for development. Different methods for parallel synthesis provide single sample libraries, gradient libraries for electronic or optical materials, similar to polymers and catalysts, and products produced through formulation strategies. Many examples illustrate the variety of isolated solutions and document the barely recognized variety of new methods for the synthesis and analysis of almost any material. The Review ends with a summary of success stories and statements on still-present problems and future tasks.

Abstract: Three-dimensional (3-D) hyperintegration is an emerging technology, which vertically stacks and interconnects multiple materials, technologies, and functional components to form highly integrated micro-nano systems. This 3-D hyperintegration is expected to lead to an industry paradigm shift due to its tremendous benefits. Worldwide academic and industrial research activities currently focus on technology innovations, simulation and design, and product prototypes. Anticipated applications start with memory, handheld devices, and high-performance computers and extend to high-density multifunctional heterogeneous integration of InfoTech-NanoTech-BioTech systems. This paper overviews the 3-D hyperintegration and packaging technologies, including motivations, key technology platforms, status, and perspectives towards commercialization. The challenges associated with the 3-D technologies are addressed, including integration architectures and design tools, yield and cost, thermal and mechanical constraints, and manufacturing infrastructure.