Topic
Bead probe technology
About: Bead probe technology is a research topic. Over the lifetime, 834 publications have been published within this topic receiving 13648 citations.
Papers published on a yearly basis
Papers
Book•
1 May 2007
TL;DR: In this paper, the authors discuss the acceptability of printed circuit boards and assemblies, vendor selection and development of flexible circuit materials and fabrication, and testing assembly testing repair of bare board and board assemblies.
Abstract: Interconnectivity component packages printed circuits surface mount technology multichip module technology basic board materials specialized board materials electrical and mechanical design computer aided design computer simulations of design parameters fine line technologies image transfer drilling etching electroplating additive plating routing and machining multilayer processes solder mask testing small quantity assembly automated assembly solder basics soldering basics no-clean processes solderability standards and testing assembly testing repair of bare board and board assemblies waste minimalization waste treatment and disposal quality programmes acceptability of printed circuit boards and assemblies reliability of printed circuit boards vendor selection and development flexible circuit materials and fabrication.
553 citations
Patent•
IBM1
TL;DR: In this paper, an interposer is used to connect the aligned flip chip die or ball grid array device solder ball pattern to the underlying printed circuit board solder deposit pattern through dendrite penetration of the solder using an interPOSer situated between and aligned to each such solder pattern.
Abstract: A socket for attaching a flip chip die or ball grid array devices to a printed circuit board substrate having a pattern of solder covered lands, with resources for removing the flip chip die or ball grid array device, resources for directly aligning the solder balls of the flip chip die or ball grid array device to the printed circuit board, resources for using an interposer of dendrite coated vias or pads to electrically and physically connect the solder balls of the flip chip die or ball grid array devices to the solder deposits of the printed circuit board, resources for having the interposer reconfigure the wiring for testing or replacement purposes, resources for utilizing the flexibility and resilience of the interposer to improve dendrite connections, and resources for heat sinking the flip chip die or ball grid array device by direct thermal contact. The socket applies an evenly distributed force to connect the aligned flip chip die or ball grid array device solder ball pattern to the underlying printed circuit board solder deposit pattern through dendrite penetration of the solder using an interposer situated between and aligned to each such solder pattern.
311 citations
Patent•
19 May 2006
TL;DR: In this article, a board for connecting a bare semiconductor die with a bond pad arrangement which does not conform to a master printed circuit board with a specific or standardized pin out, connector pad, or lead placement arrangement is described.
Abstract: A board for connecting a bare semiconductor die with a bond pad arrangement which does not conform to a master printed circuit board with a specific or standardized pin out, connector pad, or lead placement arrangement The board comprises a printed circuit board including first elements, such as minute solder balls, pins, or bond wires, for making electrical contact between the board and the master board, and second elements, such as minute solder balls, pins, or bond wires, for making electrical contact between the semiconductor die and the board The board has circuit traces for electrical communication between the board/master board electrical contact elements, and the semiconductor die board electrical contact elements
223 citations
Patent•
21 May 1987TL;DR: In this paper, a solder joint assembly technique applies controlled volumes of solder to pads of both package and substrate, and the two units are positioned adjacent each other with the pads and solder deposits mechanically maintained in registration with each other.
Abstract: A solder joint assembly technique applies controlled volumes of solder to pads of both package and substrate. The two units are positioned adjacent each other with the pads and solder deposits mechanically maintained in registration with each other. The assembly is reflowed and the final separation between package and substrate at which the resulting solder joint solidifies is mechanically controlled in order to control a geometry of the resultant solidified joint. The solder volume deposits may assume various forms including spherical bumps and solder paste deposits.
198 citations
Patent•
19 Aug 1992
TL;DR: In this paper, a method for electrically connecting flip chips to a flexible printed circuit substrate is described, which consists of providing solder paste to a plurality of active contact pads located on the substrate and heating the resulting assembly as a whole so that the solder paste on each active contact pad reflows to form an electrical connection with its corresponding solder bump.
Abstract: A method is described for electrically connecting flip chips to a flexible printed circuit substrate. The method comprises (1) providing solder paste to a plurality of active contact pads located on the flexible printed circuit substrate, (2) placing the flip chips on the substrate such that solder bumps located on the flip chips are in registration with the solder paste on the active contact pads, and (3) heating the resulting assembly as a whole so that the solder paste on each active contact pad reflows to form an electrical connection with its corresponding solder bump.
182 citations
Related Topics (5)
Performance Metrics
| Year | Papers |
|---|---|
| 2017 | 3 |
| 2016 | 5 |
| 2015 | 9 |
| 2014 | 16 |
| 2013 | 15 |
| 2012 | 15 |