TL;DR: A wood preservative includes injectable particles comprising one or more sparingly soluble copper salts, which are sufficiently insoluble so as to not be easily removed by leaching but are sufficiently soluble to exhibit toxicity to primary organisms primarily responsible for the decay of the wood.
Abstract: A wood preservative includes injectable particles comprising one or more sparingly soluble copper salts. The copper-based particles are sufficiently insoluble so as to not be easily removed by leaching but are sufficiently soluble to exhibit toxicity to primary organisms primarily responsible for the decay of the wood. Exemplary particles contain for example copper hydroxide, basic copper carbonate, copper carbonate, basic copper sulfates including particularly tribasic copper sulfate, basic copper nitrates, copper oxychlorides, copper borates, basic copper borates, and mixtures thereof. The particles typically have a size distribution in which at least 50% of particles have a diameter smaller than 0.25 μm, 0.2 μm, or 0.15 μm. At least about 20% and even more than 75% of the weight of the particles may be composed of the substantially crystalline copper salt. Wood or a wood product may be impregnated with copper based particles of the invention.
TL;DR: In this article, a facile activation method has been illustrated for the synthesis of porous carbons derived from orange peels using basic copper carbonate as activation agent, and the resulting carbon material possesses a high specific surface area of 912.4m2−g−1, hierarchical pore architecture with interconnected meso-/macropores, and a rich amount of nitrogen, oxygen and sulfur heteroatoms.
TL;DR: In this article, a series of pure and mixed Mn and Cu oxides were prepared by calcination of MnCO 3 and CuCO 3 ·Cu(OH) 2 at different temperatures, (250, 500, 750 and 1000°C) for 4h in air.
TL;DR: Between the two mechanisms, co-precipitation accounted for about 29% of the total chromium's co-removal while the remaining 71% was attributed to surface adsorption, mainly through electrostatic attraction and ligand exchange.
Abstract: The mechanisms of hexavalent chromium [Cr(VI)] co-removal with copper [Cu(II)] during homogeneous precipitation were studied with batch tests using a synthetic solution containing Cr(VI) and Cu(II). Metal precipitation was induced by adding Na2CO3 stepwise to different pH, and the respective removals of Cu(II) and Cr(VI) were measured. At the same time, the relative quantities of Cu(II) and Cr(VI) in the precipitates were also analyzed to establish their stoichiometric relationship. The results indicated that, in a solution containing 150 mg/L Cu(II) and 60 mg/L Cr(VI), the initial co-removal of Cr(VII with Cu(II) began at pH 5.0 and completed at pH 6.2. At pH 5.0-5.2, coprecipitation took place through the formation of copper-chromium-bearing solids [such as CuCrO4 and/or CuCrO4 x 2Cu(OH)2]. Thereafter, the remaining soluble copper started to react with carbonate in a heterogeneous environment to form the negatively charged basic copper carbonate precipitates [CuCO3 x Cu(OH)2], which subsequently adsorbed additional Cr(VI) (or HCrO4-) at pH 5.2-6.2. The maximum Cr(VI) co-removal took place at pH 6.2. Between the two mechanisms, co-precipitation accounted for about 29% of the total chromium's co-removal while the remaining 71% was attributed to surface adsorption, mainly through electrostatic attraction and ligand exchange. When the solution pH was increased to beyond 7.5, a surface charge reversal took place on the basic copper carbonate solids, and this led to some Cr(VI) desorption. Thus, the extent of Cr(VI) adsorption is highly pH dependent.
TL;DR: In this paper, the anodic oxidation of copper in and aqueous solutions at pH 8 has been studied using a rotating disk electrode, where the first oxidation product is a thin porous Cu(I) oxide film formed by a solid-state mechanism.
Abstract: The anodic oxidation of copper in and aqueous solutions at pH 8 has been studied using a rotating disk electrode The first oxidation product is a thin porous Cu(I) oxide film formed by a solid‐state mechanism In the solutions containing low concentrations (<005M), this film undergoes localized corrosion However, for concentration of , more positive anodic potentials, or longer exposure times, further oxidation of copper take place through the thin porous Cu(I) oxide film This process results in the formation of a stable outer layer of the precipitated Cu(II) oxides and basic copper carbonate compounds which protect the electrode towards further corrosion The presence of chloride ions in bicarbonate solution has a promoting effect on the breakdown of the passive film; they shift the corrosion and breakdown potentials towards more negative values Bicarbonate has an inhibiting influence on the corrosion of copper, since it counters the aggressive attack of chloride ions