Topic
B-staging
About: B-staging is a research topic. Over the lifetime, 2 publications have been published within this topic receiving 1 citations.
Papers
Patent•
4 Sep 2012
TL;DR: In this article, a conductive resin composition with which an increase in facility cost can be prevented in that solvent distillation and exposure to light are unnecessary is provided, and a cured object having sufficient adhesive strength while retaining relatively low resistivity can be obtained by curing.
Abstract: Provided is a conductive resin composition with which an increase in facility cost can be prevented in that solvent distillation and exposure to light are unnecessary; B staging (semicuring) is possible such that the product is sufficiently tack-free at relatively low temperatures while having excellent pressure-sensitive tack in that temporary adhesion of parts is possible; and a cured object having sufficient adhesive strength while retaining relatively low resistivity can be obtained by curing (C staging). Also provided is a cured object that uses the conductive resin composition. The conductive resin composition that is used for the cured object comprises (A) an epoxy resin, (B) a compound having (meth)acryloyl groups and glycidyl groups, (C) a phenol resin curing agent, (D) a radical polymerization initiator, and (E) conductive particles.
1 citations
Patent•
2 Feb 2017
TL;DR: A photo and thermosetting adhesive for inkjet capable of enhancing thickness accuracy of an adhesive layer where an adhesive is cured and further making hard to generate void in the adhesive layer is presented in this paper.
Abstract: PROBLEM TO BE SOLVED: To provide a photo and thermosetting adhesive for inkjet capable of enhancing thickness accuracy of an adhesive layer where an adhesive is cured and further making hard to generate void in the adhesive layerSOLUTION: A photo and thermosetting adhesive for inkjet contains a photosetting compound, a thermosetting compound, a photoinitiator, and a thermosetting agent and has elastic modulus of a B staging adhesive at 25°C of 50×10Pa to 80×10Pa when a light with integrated light amount of 1000 mJ/cmis irradiated to the adhesive, so that lighting intensity at 365 nm is 100 mW/cm, and the B staging adhesive is obtainedSELECTED DRAWING: Figure 1
Related Topics (5)
Performance Metrics
| Year | Papers |
|---|---|
| 2017 | 1 |
| 2012 | 1 |