Proceedings Article10.1109/THERMINIC.2015.7389635
Why matrix reduction is better than objective function based optimization in compact thermal model creation
J. H. J. Janssen,Lorenzo Codecasa +1 more
- 01 Sep 2015
- pp 1-6
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TL;DR: It is shown how the objective function optimization approach fails in the construction of boundary condition independent compact thermal models of complex Systems On Silicon in which more than two powers are allowed to arbitrarily change.
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Abstract: It is shown how the objective function optimization approach fails in the construction of boundary condition independent compact thermal models of complex Systems On Silicon in which more than two powers are allowed to arbitrarily change. For such applications a novel matrix reduction approach is shown to lead to the efficient construction of accurate boundary condition independent compact thermal models whichever is the number of independent heat sources. Such matrix reduction approach is implemented in the FANTASTIC BCI software tool which is allow to analyze state-of-the art industrial applications.
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Citations
Delphi-like dynamical compact thermal models using model order reduction
Brice Rogie,Lorenzo Codecasa,Eric Monier-Vinard,Valentin Bissuel,Najib Laraqi,Olivier Daniel,D. D'Amore,Alessandro Magnani,Vincenzo d'Alessandro,Niccolò Rinaldi +9 more
- 01 Sep 2017
TL;DR: A novel process flow for extracting Delphi-inspired BCI DCTMs is investigated and the results show that for a similar accuracy, the integration of MOR technique allows minimizing the time-consuming numerical simulations and so to reduce the thermal network creation time by 80%.
33
Calibration of detailed thermal models by parametric dynamic compact thermal models
Lorenzo Codecasa,Vincenzo d'Alessandro,Alessandro Magnani,Niccolò Rinaldi +3 more
- 01 Sep 2016
TL;DR: In this paper, a constrained least square fit of the thermal response of a parametric dynamic compact thermal model, having as parameters the material thermal properties and geometrical details to be calibrated, onto the measured temperature response is performed.
19
Novel approach for the extraction of nonlinear compact thermal models
Lorenzo Codecasa,Vincenzo d'Alessandro,Alessandro Magnani,Niccolò Rinaldi +3 more
- 01 Sep 2017
TL;DR: In this article, a model order reduction method is proposed to extract dynamic compact thermal models from nonlinear heat diffusion equations, which take into account the temperature dependence of thermal properties, by projecting the heat diffusion equation onto the space spanned by a few terms in the Volterra's series expansion of the solution.
16
Versatile MOR-based boundary condition independent compact thermal models with multiple heat sources
Lorenzo Codecasa,Robin Bornoff,James Dyson,Vincenzo d'Alessandro,Alessandro Magnani,Niccolò Rinaldi +5 more
TL;DR: This paper shows that the connection of MOR-based boundary condition independent (BCI) dynamic compact thermal models (DCTMs) and detailed models of heat transfer problems is not straightforward and is subject to numerical issues, so a novel definition of Mor-based BCI DCTMs is provided, which makes this connection feasible.
16
Thermal Resistance Advanced Calculator (TRAC)
Lorenzo Codecasa,Salvatore Race,Vincenzo daAlessandro,Donata Gualandris,Arianna Morelli,Claudio Maria Villa +5 more
- 01 Sep 2018
TL;DR: A novel simulation tool, named Thermal Resistance Advanced Calculator, is presented that allows the straightforward definition of a parametric detailed thermal model of family of electronic packages with Manhattan geometry, in which anew thermal properties and/or geometrical details can vary in a chosen set.
15
References
Ten Years of Boundary-Condition- Independent Compact Thermal Modeling of Electronic Parts: A Review
TL;DR: This review paper is written with the purpose of presenting a condensed overview of the history, background, philosophy, methodology, and standardization aspects of compact thermal modeling to non-experts.
117
FAst Novel Thermal Analysis Simulation Tool for Integrated Circuits (FANTASTIC)
Lorenzo Codecasa,Vincenzo d'Alessandro,Alessandro Magnani,Niccolò Rinaldi,Peter J. Zampardi +4 more
- 04 Dec 2014
TL;DR: FANTASTIC provides a novel equivalent network suitable for use in SPICE-like circuit simulators to perform efficient thermal and electrothermal analyses and requires much less CPU time and memory storage compared to commercial simulators.
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Thermal Measurement and Modeling of Multi-Die Packages
Andras Poppe,Yan Zhang,J. Wilson,Gabor Farkas,Peter G. Szabo,John Parry,Marta Rencz,Vladimir Szekely +7 more
TL;DR: In this paper, an opto-coupler device with four chips in a combined lateral and vertical arrangement is presented for a more complex structure, where the measurement results are presented along with a structure function-based methodology which helps validating the detailed model of the package being studied.
Thermal measurement and modeling of multi-die packages
Andras Poppe,Yan Zhang,John Wilson,Gabor Farkas,Peter G. Szabo,John Parry +5 more
- 01 Sep 2006
TL;DR: In this paper, an opto-coupler device has been investigated with 4 chips in lateral as well as vertical arrangement, and the results for stacked and MCM structures were presented.
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