Variable emissivity through MEMS technology
A. Garrison Darrin,Robert Osiander,J. L. Champion,Theodore D. Swanson,Donya Douglas,L.M. Grob +5 more
- 23 May 2000
- Vol. 504, Iss: 1, pp 803-808
TL;DR: A new technology for variable emissivity (vari-e) radiator surfaces is discussed, which has significant advantages over traditional radiators and promises an alternative design technique for future spacecraft thermal control systems.
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Abstract: This paper discusses a new technology for variable emissivity (vari-e) radiator surfaces, which has significant advantages over traditional radiators and promises an alternative design technique for future spacecraft thermal control systems. All spacecraft rely on radiative surfaces to dissipate waste heat. These radiators have special coatings, typically with a low solar absorptivity and a high infrared-red emissivity, that are intended to optimize performance under the expected heat load and thermal sink environment. The dynamics of the heat loads and thermal environment make it a challenge to properly size the radiator and often require some means of regulating the heat rejection rate of the radiators in order to achieve proper thermal balance. Specialized thermal control coatings, which can passively or actively adjust their emissivity offer an attractive solution to these design challenges. Such systems would allow intelligent control of the rate of heat loss from a radiator in response to heat load and thermal environmental variations. Intelligent thermal control through variable emissivity systems is well suited for nano and pico spacecraft applications where large thermal fluctuations are expected due to the small thermal mass and limited electric resources. Presently there are three different types of vari-e technologies under development: Micro Electro-Mechanical Systems (MEMS) louvers, Electrochromic devices, and Electrophoretic devices. This paper will describe several prototypes of micromachined (MEMS) louvers and experimental results for the emissivity variations measured on theses prototypes. It will further discuss possible actuation mechanisms and space reliability aspects for different designs. Finally, for comparison, parametric evaluations of the thermal performance of the new vari-e technology and standard thermal control systems are also presented in this paper.
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Citations
Review of Modern Spacecraft Thermal Control Technologies
TL;DR: In this paper, a broad overview of spacecraft thermal control subsystem technologies is provided, each including an assessment of their potential use for terrestrial HVAC&R applications, as well as a review of the potential use of these technologies for terrestrial applications.
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Advanced Passive Thermal Control Materials and Devices for Spacecraft: A Review
TL;DR: In this paper , a comprehensive review of state-of-the-art advanced passive thermal control materials and devices that are available for space applications, specifically, variable emissivity thermal control Materials and microelectromechanical systems (MEMS), radiofrequency (RF)-transparent and/or tunable solar absorptivity and total hemispherical emissivities thermal control material, and a passive re-deployable radiator with advanced materials and insulation.
Development of the Variable Emittance Thermal Suite for the Space Technology 5 Microsatellite
Donya Douglas,Theodore Swanson,Robert Osiander,John L. Champion,Ann Garrison Darrin,William Biter,Prasanna Chandrasekhar +6 more
- 15 Mar 2002
TL;DR: In this article, the development of the variable emittance thermal suite for ST-5 is described and a description of and the infusion and validation plans for the Variable Emittance coatings are presented.
Controlling Variable Emittance (MEMS) Coatings for space applications
D. Farrar,W. Schneider,Robert Osiander,J. L. Champion,A.G. Darrin,Donya Douglas,Ted Swanson +6 more
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Spectral and surface analysis of heated micro-column arrays fabricated by laser-assisted surface modification
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TL;DR: In this paper, the authors found that NiTi films containing an excess of Ti (52% at.) are crystallised when deposited on Si(100) substrates heated up to only 200°C.
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