Open Access10.4229/EUPVSEC20162016-1BV.5.32
Triangular Ribbons for Improved Module Efficiency
Ulrich Eitner,M. Ebert,Li Carlos Rendler,A.J. Beinert,M. Mittag +4 more
- 25 Jul 2016
- pp 169-172
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About: The article was published on 25 Jul 2016. and is currently open access. The article focuses on the topics: Ray tracing (graphics).
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References
A study of shading and resistive loss from the fingers of encapsulated solar cells
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TL;DR: In this article, a spectrophotometer with integrating sphere attachment was used to measure the reflection from the front surface of encapsulated silver electroplated front contact solar cells, and the results obtained are in good agreement with a previous study by one of the authors using a different method.
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Analysis of the Optical Properties of Screen-Printed and Aerosol-Printed and Plated Fingers of Silicon Solar Cells
TL;DR: In this article, the effective shading of different finger types is analyzed with two different measurement methods, and it was shown that for aerosol-printed fingers the effective (optical) width is only 38% of its geometrical width, while for standard screen-printed fingers it is 47%.
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TL;DR: In this article, the authors present the characteristics of interconnect contacts in conventional cells and other unconventional crystalline silicon cells and present a comparison of their concept, cell type, joint type, manufacturing techniques and production status.
Combined effect of light harvesting strings, anti-reflective coating, thin glass, and high ultraviolet transmission encapsulant to reduce optical losses in solar modules
TL;DR: In this article, the effects of anti-reflective coating, front glass thickness, polyvinyl butyral ultraviolet+ encapsulant, and light harvesting strings on the module performance individually and in combination are evaluated.
Multi-wire interconnection of busbar-free solar cells
TL;DR: In this paper, the authors focus on the interconnection of busbar-free solar cells by infrared soldering and the optimization of the front metallization design in order to achieve reliable solder joints.