Third-order intermodulation distortion in capacitively-driven CC-beam micromechanical resonators
Reza Navid,John R. Clark,M.U. Demirci,Clark T.-C. Nguyen +3 more
- 21 Jan 2001
- pp 228-231
TL;DR: In this article, the third-order input intercept point (IIP/sub 3) distortion in capacitively driven clamped-clamped beam micromechanical ("CC-beam /spl mu/mechanical") resonators is shown to arise mainly from nonlinear interactions between applied off-resonance electrical signals and the mechanical displacements they induce.
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Abstract: The mechanism behind third order intermodulation distortion (IM/sub 3/) in capacitively driven clamped-clamped beam micromechanical ("CC-beam /spl mu/mechanical") resonators is shown to arise mainly from nonlinear interactions between applied off-resonance electrical signals and the mechanical displacements they induce. Analytical formulations for the third-order input intercept point (IIP/sub 3/) are then presented, first with simplifications that allow a closed form expression, then with additional complexities to account for second-order effects, such as beam bending due to an applied dc-bias voltage. Using this analytical formulation, predicted voltage IIP/sub 3/'s of 1.8 V and 6.5 V for 9.2 MHz and 17.4 MHz /spl mu/mechanical resonators, respectively, closely match measured values of 1.8 V and 6.3 V. Extensive data on the dependence of IIP/sub 3/ on dc-bias voltage, resonator Q, and resonator center frequency, are also included to lend further insight into the trade-offs involved when designing for a specific linearity requirement.
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Citations
MEMS technology for timing and frequency control
Clark T.-C. Nguyen
- 29 Aug 2005
TL;DR: As vibrating RF MEMS devices are perceived more as circuit building blocks than as stand-alone devices, and as the frequency processing circuits they enable become larger and more complex, the makings of an integrated micromechanical circuit technology begin to take shape, perhaps with a functional breadth not unlike that of integrated transistor circuits.
High-Q UHF micromechanical radial-contour mode disk resonators
TL;DR: In this paper, a laterally vibrating disk resonator, fabricated via a technology combining polysilicon surface-micromachining and metal electroplating to attain sub-micron lateral capacitive gaps, has been demonstrated at frequencies as high as 829 MHz and with Q's up to 23 000 at 193 MHz.
286
High- UHF Micromechanical Radial-Contour Mode Disk Resonators
John R. Clark,Wan-Thai Hsu,Mohamed A. Abdelmoneum,Clark T.-C. Nguyen +3 more
- 01 Jan 2005
Abstract: A micromechanical, laterally vibrating disk resonator, fabricated via a technology combining polysilicon surface-micromachining and metal electroplating to attain submicron lateral capacitive gaps, has been demonstrated at frequencies as high as 829 MHz and with Q's as high as 23 000 at 193 MHz. Furthermore, the resonators have been demonstrated operating in the first three radial contour modes, allowing a significant frequency increase without scaling the device, and a 193 MHz resonator has been shown operating at atmospheric pressure with a Q of 8,880, evidence that vacuum packaging is not necessary for many applications. These results represent an important step toward reaching the frequencies required by the RF front-ends in wireless transceivers. The geometric dimensions necessary to reach a given frequency are larger for this contour-mode than for the flexural-modes used by previous resonators. This, coupled with its unprecedented Q value, makes this disk resonator a choice candidate for use in the IF and RF stages of future miniaturized transceivers. Finally, a number of measurement techniques are demonstrated, including two electromechanical mixing techniques, and evaluated for their ability to measure the performance of sub-optimal (e.g., insufficiently small capacitive gap, limited dc-bias), high-frequency, high-Q micromechanical resonators under conditions where parasitic effects could otherwise mask motional output currents. [1051].
268
Mechanically Corner-Coupled Square Microresonator Array for Reduced Series Motional Resistance
M.U. Demirci,Clark T.-C. Nguyen +1 more
TL;DR: In this article, the authors used a parallel array of corner-coupled polysilicon square plate resonators to achieve a motional resistance reduction of 5.9X.
171
Vibrating RF MEMS for next generation wireless applications
Clark T.-C. Nguyen
- 22 Nov 2004
TL;DR: An overview of the latest in vibrating RF MEMS technology is presented with an addendum on remaining issues to be addressed for insertion into tomorrow's handsets.
125
References
High-Q HF microelectromechanical filters
TL;DR: In this article, an IC-compatible microelectromechanical intermediate frequency filters using integrated resonators with Q's in the thousands were demonstrated using polysilicon surface micromachining technology.
528
VHF free-free beam high-Q micromechanical resonators
TL;DR: Free-free-beam flexural-mode micromechanical resonators utilizing nonintrusive supports to achieve measured Qs as high as 8400 at VHF frequencies from 30 to 90 MHz are demonstrated in a polysilicon surface micromachining technology as mentioned in this paper.
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VHF free-free beam high-Q micromechanical resonators
Kun Wang,Yinglei Yu,Ark-Chew Wong,Clark T.-C. Nguyen +3 more
- 01 Jan 1999
TL;DR: In this paper, a polysilicon surface micromachining technology was used to achieve measured Q's as high as 8,400 at VHF frequencies from 30-90 MHz.
380