Journal Article10.1063/1.1745338
The Copper Oxide Rectifier
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TL;DR: In this paper, the authors measured the thermal conductance of the cuprous oxide rectifier and revealed a new physical phenomenon, asymmetrical thermal conductances, which is in the direction that would be expected from the electron theory of heat conduction.
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Abstract: The equilibrium diagram of the copper: copper oxide: oxygen system controls the conditions of formation of the cuprous oxide rectifier. The interface between the cuprous oxide and the copper from which it is formed can be studied with polarized light. Intimate contact exists for more than half the total area. The technique of preparing the rectifier has a marked influence on its characteristics. By using a method of measuring the resistance characteristic which did not cause an error due to current heating at the interface, unusual results were obtained from specimens made under various conditions. Measurement of the thermal conductance of the rectifier disclosed a new physical phenomenon, asymmetrical thermal conductance. This asymmetry is in the direction that would be expected from the electron theory of heat conduction.
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Citations
Nanoscale thermal transport
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Colloquium : Phononics: Manipulating heat flow with electronic analogs and beyond
TL;DR: In this article, a toolkit of familiar electronic analogs for use of phononics is put forward, i.e., phononic devices are described which act as thermal diodes, thermal transistors, thermal logic gates, and thermal memories.
Near-Field Thermal Transistor
TL;DR: A nanoscale analog of a field-effect transistor that is able to control the flow of heat exchanged by evanescent thermal photons between two bodies and opens up new perspectives concerning the development of contactless thermal circuits intended for information processing using the photon current rather than the electric current.
A review of thermal rectification observations and models in solid materials
Nicholas A. Roberts,D. G. Walker +1 more
TL;DR: Thermal rectification is a phenomenon in which thermal transport along a specific axis is dependent upon the sign of the temperature gradient or heat current as discussed by the authors, which offers improved thermal management of electronics as size scales continue to decrease.
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