Patent
System and method for disassembling laminated substrates
James D. Sampica,Paul R. Nemeth,Tracy J. Barnidge,Vincent P. Marzen +3 more
- 18 Jan 2008
38
TL;DR: In this article, an apparatus for separating a laminated substrate assembly comprises at least a substantially planar assembly, a cutting member housing assembly positioned on a first side of the substantially planarial assembly, and a cut member receiving assembly positioned opposite from the first side to receive an amount of the elongated cutting member.
read more
Abstract: An apparatus for separating a laminated substrate assembly comprises at least a substantially planar assembly, a cutting member housing assembly positioned on a first side of the substantially planar assembly, a cutting member receiving assembly positioned on a second side of the substantially planar assembly, substantially opposite from the first side of the planar assembly suitable for receiving an amount of the elongated cutting member. At least one of the cutting member housing assembly or the cutting member receiving assembly is configured to provide an amount of tension to the elongated cutting member as the elongated cutting member is released by the cutting member housing assembly or received by the cutting member receiving assembly, and the elongated cutting member is configured to remove an amount of adhesive from an adhesive layer of the laminated substrate assembly.
read more
Chat with Paper
AI Agents for this Paper
Find similar papers on Google Scholar, PubMed and Arxiv
Write a critical review of this paper
Analyze citations of this paper to find unaddressed research gaps
Citations
Patent
Layer-Specific Energy Distribution Delamination
Casey J. Feinstein,Silvio Grespan,Kuo-Hua Sung,John Z. Zhong,Lynn R. Youngs +4 more
- 20 Mar 2009
TL;DR: In this paper, a localized energy transferrer can generate localized heating, cooling, cooling or other form of energy absorption or transmission in a bonding layer of a multilayer stack.
50
Patent
System and method for completing lamination of rigid-to-rigid substrates by the controlled application of pressure
James D. Sampica,Paul R. Nemeth,Tracy J. Barnidge,Vincent P. Marzen +3 more
- 14 Mar 2012
TL;DR: In this article, a rigid-to-rigid substrate lamination using pressure-sensitive adhesive (PSA) is described, where the first pressure is applied to a first sealed cavity and the second sealed cavity is sealed by a flexible membrane.
31
Patent
Substrate lamination system and method
James D. Sampica,Paul R. Nemeth,Tracy J. Barnidge,Vincent P. Marzen +3 more
- 18 Jan 2008
TL;DR: In this paper, a method for laminating a substrate may include disposing a pressure-sensitive adhesive layer between a substantially planar surface of a first substrate and a planar one of a second substrate, and applying a pressure to at least one of the first and the second substrate.
29
Patent
Planarization treatment of pressure sensitive adhesive for rigid-to-rigid substrate lamination
James D. Sampica,Paul R. Nemeth,Tracy J. Barnidge,Vincent P. Marzen +3 more
- 01 Nov 2013
TL;DR: In this article, a planarization treatment of pressure-sensitive adhesive (PSA) is proposed, which includes placing at least one layer of PSA onto the first substrate and applying a pressure to the second substrate via a flexible membrane, said pressure being applied in a generally uniform, unidirectional and localized manner.
23
Patent
Method and Apparatus for Display Screen Shield Replacement
Teo Chong Teck
- 11 Jun 2013
TL;DR: A method and apparatus for replacement of damages display shield (typically glass) covering a display screen on a device, typically a mobile phone, can be found in this article, where the removal of a damage glass can be accomplished by cutting through the polarizer with a moving wire or blade, separating the glass from the sensitive display and allowing replacement of the glass without damaging the more expensive display.
17
References
Patent
Protected organic electronic device structures incorporating pressure sensitive adhesive and desiccant
Jeffrey Silvernail
- 25 Aug 2003
TL;DR: In this article, an organic electronic device region (e.g., an OLED region) and a cover and a getter region are provided, and a radiation-curable, pressure-sensitive adhesive layer is disposed between the first and second regions and adhering the two regions to one another.
97
Patent
Device for aligning printed circuit boards and pattern carriers
Paul R Waldner,Bernd Gennat +1 more
- 10 Nov 1994
TL;DR: In this paper, the authors proposed a support for the mutual alignment of perforated printed circuit boards and pattern carriers, for example films, by axially slidable and laterally immovable within guides disposed thereon.
83
Patent
Sealed organic optoelectronic structures
Jeffrey Silvernail,Kenneth L. Urbanik +1 more
- 07 Feb 2001
TL;DR: In this article, an organic optoelectronic device structure is provided, which consists of an organic light emitting diode (LED), an organic electrochromic display, an organic photovoltaic device and an organic thin film transistor.
79
Patent
Plasma display module
Sok-San Kim,Ki-Jung Kim,Tae-kyoung Kang,Myoung-Kon Kim,Won-Sung Kim +4 more
- 28 Apr 2006
TL;DR: A plasma display module including a plasma display panel (PDP) including a first substrate and a second substrate and having an alignment mark formed thereon, and a chassis supporting the PDP as discussed by the authors.
73
Patent
Procedure for encapsulation of electronic devices
Mark Dai Joong Auch,Ewald Karl Michael Guenther,Chua Soo Jin +2 more
- 28 Sep 2001
TL;DR: In this article, an encapsulation procedure for an organic light emitting diode (OLED) device, especially for thin and therefore flexible substrates, is disclosed, and the device is sealed hermetically against environmental and mechanical damage.
72
Related Papers (5)
Ken Fukuta,Yuji Ueda,Satoshi Sugiyama +2 more
- 30 Dec 2002
Paul R Waldner,Bernd Gennat +1 more
- 10 Nov 1994