Synthesis and characterization of high fluorine‐containing polyimides with low‐dielectric constant

TL;DR: In this paper , a more systematic and inductive analysis of low dielectric polyimide (PI) is presented, based on which the development potential of low-dielectric PI is explored.

TL;DR: Researchers developed cross-linked poly(ester imide)s with improved thermal stability and mechanical durability, achieving a low dielectric constant (Dk < 3.0) and dissipation factor (Df ≈ 0.003) at high frequencies (10-40 GHz) through structural manipulation.

TL;DR: In this paper , short-chain substituents were introduced to regulate the conformation between benzene and imide rings, as well as the ability of amide hydrogen bond formation, which resulted in high optical transmittance at 400 nm of up to 86 %, a Tg as high as 402 °C, a low thermal expansion coefficient of 17 ppm K−1 and an extremely high tensile modulus of 5.2 GPa.

TL;DR: A novel benzocyclobutene-functionalized fluorine-containing polyimide material (PI-BFs) exhibits low dielectric constant (Dk=2.72) and improved thermal stability, glass transition temperature, and storage modulus, making it suitable for high-speed communication applications.

TL;DR: In this paper, a large variety of polymers have been proposed for use as materials with low dielectric constants for applications in microelectronics, including polyimides, heteroaromatic polymers, poly(aryl ether)s, fluoropolymers, hydrocarbon polymers without any polar groups, films deposited from the gas phase by chemical vapor deposition, plasma enhanced chemical vapor (PEVD) and other techniques.

TL;DR: A comprehensive review of the use of trifluoromethyl (CF3) substituents in polymers can be found in this paper, where the main focus is on the synthesis of polymers from the corresponding CF3 substituted monomers, and the consequent property advantages brought about in the polymer.

TL;DR: In this article, a review of colorless and optically transparent polyimide (CPI) films has been presented, focusing on the applications of CPI films as flexible substrates for optoelectrical devices, such as flexible active matrix organic light emitting display devices (AMOLEDs), flexible printing circuit boards (FPCBs), and flexible solar cells.

TL;DR: In this article, a review summarizes the latest research and development of colorless polyimide (CPI) films, including synthesis, properties and applications, including flexible thin-film solar cells, advanced flexible display devices, flexible printed circuit boards, flexible terahertz sensors and smart windows.