Patent
Stack type semiconductor packaging structure containing flexible circuit board
Qiu Jizong
- 23 Jun 2010
2
TL;DR: In this paper, a soft circuit plate is used to connect the second chip to the first chip without placement of current spacer in order to reduce the integral height of the packaging structure of the semiconductor.
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Abstract: The invention relates to a packaging structure for a stackable semiconductor with a soft circuit plate inside, which comprises a base plate and a chip group which at least comprises a first chip, a second chip and a soft circuit plate. The invention is characterized in that the second chip which is above the first chip is connected with the first chip by using the soft circuit plate without placement of current spacer in order to effectively decrease the integral height of the packaging structure of the semiconductor and simplify the technique to reduce manufacturing cost.
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Citations
Patent
Semiconductor piling packaging structure and manufacturing method thereof
Chen Zhengrong
- 04 Jul 2017
TL;DR: In this paper, the authors proposed a semiconductor piling packaging structure and a manufacturing method thereof, where a plurality of solder bulges are formed on the surface of the second chip, and the first chip is positioned above the second and the second is connected with the substrate through the solder bulged in an inverted mounting manner.
Patent
Semiconductor stack package structure and manufacturing method thereof
Chenzhengrong
- 28 Oct 2015
TL;DR: In this article, a semiconductor stack package structure and a manufacturing method for semiconductor stacks is described. But the manufacturing method is not described. And it is not shown how to construct a good chip in the stack package.