Semiconductor device, semiconductor module, electronic equipment, method for manufacturing semiconductor device, and method for manufacturing semiconductor module

TL;DR: In this paper, a power storage device including a positive electrode having a positive electrode current collector, a positive-electrode active material with a plurality of first projections on the positive-electric-current collector, and a first insulator on an end of each of the first projections, was presented.

TL;DR: In this article, a gap is made between the semiconductor die and a portion of the insulating material is removed to form a first through hole via (THV), a conductive lining is conformally deposited in the first THV.

TL;DR: In this paper, a display apparatus includes a base substrate, a pixel on the base substrate and a color filter part between the pixel and the pixel, including a cover layer defining a TSC (Tunnel Shaped Cavity), an image display part provided in the TSC, and first and second electrodes which apply an electric field to the image display.

TL;DR: In this article, a method for manufacturing a highly reliable semiconductor device including thin film transistors which have stable electric characteristics and are formed using an oxide semiconductor was proposed, which includes the steps of: forming a first conductive film including at least one of titanium, molybdenum, and tungsten, over the oxide semiconductors, forming a second conductive material including a metal having lower electronegativity than hydrogen over the first, and forming a source electrode and a drain electrode by etching of the first and second conductivities.

TL;DR: In this article, a plurality of integrated circuits are packaged within chip carriers and stacked, on one top of the other, on a printed circuit board, each of the input/output data terminals, power and ground terminals of the chips are connected in parallel.

TL;DR: In this paper, a double cavity semiconductor chip carrier (100) is described, which comprises a multilayer ceramic sandwich structure having a pair of semiconductor receiving cavities in the opposite faces thereof.

TL;DR: In this article, a carrier apparatus for mounting logic components on the surface of a circuit board is described, which utilizes ground and voltage planes together with alternating signal (118) and AC ground (121) traces.

TL;DR: In this article, a stacked die carrier assembly and method for packaging and interconnecting silicon chips such as memory chips is described, where the chip is wire bonded to the conductor pattern on the substrate and each conductor is routed to the edge of the substrate where it is connected to a half-circle of a metalized through hole.